An electrical connector includes a seat and two electrical terminals. The two electrical terminals are disposed within the seat. Each electrical terminal includes a terminal body and a mounting portion. Each terminal body includes a front end, a rear end, and two lateral edges opposite to each other. The two lateral edges are connected to the front end and the rear end. The mounting portion is extending from the rear end. The terminal body further includes one or more bending wings formed on one of the two lateral edges. The bending wing is located on an inner side of the terminal body. The inner sides of the terminal bodies face each other, and the terminal bodies of the two electrical terminals are arranged in parallel, and the mounting portions of the electrical terminals are located at different heights so as to be arranged in misalignment.

An electronic device includes: a housing and a printed circuit board (PCB) structure disposed in the housing. The PCB structure includes a circuit board including an opening area formed through a first surface of the circuit board and a second surface of the circuit board opposite the first surface and a conductive pattern formed in a peripheral area around the opening area, a plate disposed on the second surface of the circuit board covering the opening area, an electronic element disposed on the plate and electrically connected with the circuit board, a resin portion disposed between the plate and the circuit board and extending from the conductive pattern, the resin portion including a conductive material, and a solder portion formed between the resin portion and the plate.

A set formed of a conductor connection element and a fastening element for fastening the conductor connection element to another component, wherein the conductor connection element has an insulating housing with a conductor insertion opening for inserting an electrical conductor in a direction of conductor insertion, and wherein the fastening element has a connecting arrangement by means of which the fastening element can be fastened to the conductor connection element in a positive-locking manner. The connecting arrangement is configured to allow a fastening of the fastening element to the conductor connection element in multiple different discrete spatial orientations relative to the direction of conductor insertion.

A pressing area set on a main surface of a plate-shaped holding jig is arranged on contact parts. The contact parts are pressed against a multilayer board while heating the multilayer board and the pressing area of the holding jig is inclined with a warp of the multilayer board. In this way, when pressing for bonding the contact parts is performed, even if the multilayer board is warped by the heating and the contact parts are shifted, the contact parts are pressed against the multilayer board without fail.

A circuit board assembly for electronic devices includes a circuit board having a first surface and a second surface opposite the first surface, and a heat sink carrier disposed on the first surface of the circuit board. The heat sink carrier includes at least one clamp portion. The assembly also includes a heat sink. The heat sink is positioned in the at least one clamp portion of the heat sink carrier to transfer heat from one or more electronic devices to the heat sink via the heat sink carrier.

A base of an electrical connector includes a fixing pin and a base body. The fixing pin includes a pin body, a stopping element and one or more latches. The pin body includes a lower end and an upper end, the stopping element is disposed at the upper end, and the latch is disposed on the pin body in a protruding manner. One or more installation troughs are formed on a rear surface of the base body and the installation trough is in communication with a front surface of the base body through an insertion hole. The base body further includes a pin hole formed on an outer peripheral surface of the base body, and the pin hole is intersected with and in communication with the installation trough. The latch is adapted to be engaged with a stopper block formed on an inner wall of the pin hole.

An electronic assembly includes a printed wiring board (PWB), and a stiffener secured to the PWB. The stiffener includes one or more tray sections. One or more electronic modules is secured respectively to the one or more tray sections of the stiffener.

Example embodiments described in this disclosure are generally directed to a mounting bracket for deployment in a vehicle. In one embodiment, a multilayer mounting bracket includes a first layer made of a dual-conductive polymer and a second layer made of a polymer that includes an endothermic blowing agent. The dual-conductive polymer includes carbon material that renders the first layer electrically conductive and also includes graphite material that renders the first layer thermally conductive. The endothermic blowing agent renders the second layer thermally insulative. An electronic module such as an engine controller can be mounted upon the first layer, which operates as a heat sink to dissipate heat generated by the electronic module and also operates as an electromagnetic interference (EMI) shield. The second layer prevents heat from being transferred from the first layer into another electronic module that may be mounted upon the mounting bracket.

Lighting systems that include an LED and a silicone module designed to contain a lens are described herein.

A composite electronic component includes: a composite body including a multilayer ceramic capacitor coupled to a ceramic chip, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween are stacked and first and second external electrodes disposed on opposite end portions of the first ceramic body in a length direction, respectively, and the ceramic chip including a second ceramic body including ceramic and first and second terminal electrodes, wherein a ratio of a length of the ceramic chip to a length of the multilayer ceramic capacitor is 0.7 to 1.0, and a ratio of a sum of a length of the first terminal electrode and a length of the second terminal electrode to the length of the ceramic chip is 0.3 to 0.6.