Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.

A method of making connection elements for a microelectronic device is provided, including foil ling a conducting layer on a support on which there is at least one conducting pad located on a front face of the support opposite a back face thereof, the conducting layer including a first conducting portion in contact with at least one conducting pad, the first conducting portion extending on the front face and being connected to at least one second conducting portion extending in contact with at least one given wall of the support being located between the front and back faces and forming a non-zero angle with the front face; thinning the support at the back face to release one conducting end of the second conducting portion as a free conducting end projecting from the back face; and after the thinning, bending the free conducting end projecting from the back face.

To prevent decrease of the bonding strength of an electronic component and a multilayer substrate, an electronic component-embedded module may include an electronic component having a plurality of pads and a multilayer substrate which includes a plurality of resin layers and a cavity for containing the electronic component. The multilayer substrate may include a first resin layer having a plurality of first pattern conductors and a space, and a second resin layer having a second pattern conductor and a plurality of third pattern conductors. The plurality of third pattern conductors may be in conduction with either of the first pattern conductors or the pads, with the second resin layer being placed over the first resin layer. The second pattern conductor may be arranged around a first pad with a gap, and the second resin layer is present between the second pattern conductor and at least one of the first pads.

An interposer including stress-engineered nonplanar microsprings may provide interconnection of bonding pads of electronic structures disposed above and below the interposer. The lateral offset between an anchor portion of a microspring disposed for contact at a bottom surface of the interposer and the tip of the microspring located in a free portion of the microspring for contact and deflection over a top surface of the interposer permits the interconnection of devices having different bonding pad pitches. Microspring contacts at the free portion permit temporary interconnection of devices, while solder applied over the free portion permit permanent connection of devices to the interposer.

Provided is a component-mounting flexible board allowing mounted driver circuits to share the same display panel or circuit board regardless of the number of driver circuits.

Of two source drivers 31 and 32 mounted in an SOF package 30, the source driver 31 has output wiring patterns respectively pressure-bonded to connection terminals S.sub.1 to S.sub.960 included in a first connection terminal group 11 of a liquid crystal panel 10. The source driver 32 has output wiring patterns respectively pressure-bonded to connection terminals S.sub.1 to S.sub.960 included in a second connection terminal group 12 of the liquid crystal panel 10. Dummy wiring patterns 36 are pressure-bonded to two dummy connection terminals 18 formed in a spared space between the first connection terminal group 11 and the second connection terminal group 12 of the liquid crystal panel 10.

Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.

A circuit board structure includes an inner circuit structure and a first build-up circuit structure. The inner circuit structure includes a core layer having an upper surface and a lower surface, a first patterned circuit layer disposed on the upper surface, a second patterned circuit layer disposed on the lower surface and a conductive through hole connecting the first and the second patterned circuit layers. The first build-up circuit structure at least has a cavity and an inner dielectric layer. The inner dielectric layer has an opening communicating the cavity and a pad of the first patterned circuit layer is located in the opening. A hole diameter of the opening is smaller than a hole diameter of cavity. An inner surface of the inner dielectric layer exposed by the cavity and a top surface of the pad are coplanar or have a height difference.

A flexure has a metal support layer, an electric insulating layer laid on a surface of the metal support layer, a wiring layer having a general part laid on a surface of the electric insulating layer and a terminal to provide a conductive connection to an external slider, and a raising structure in a thickness direction of the wiring layer provided to the terminal independently of the metal support layer so that the terminal protrudes from a surface of the general part or has a surface being flush with the surface of the general part.

An image pickup apparatus includes: an image pickup device including a light receiving surface, an opposite surface, and an inclined surface inclined at a first angle, and provided with light receiving surface electrodes on the light receiving surface; a cover glass; and a wiring board including a first main surface and a second main surface, and including wires each connected with each of the light receiving surface electrodes, back surfaces of the light receiving surface electrodes are exposed to a side of the opposite surface, distal end portions of the wires are flying leads bent at a second angle in a relation of a supplementary angle to the first angle and connected with the light receiving surface electrodes, and the second main surface at a distal end portion of the wiring board is directly fixed to the opposite surface arranged in parallel with the second main surface.

A circuit board structure includes an inner circuit structure and a first build-up circuit structure. The inner circuit structure includes a core layer having an upper surface and a lower surface, a first patterned circuit layer disposed on the upper surface, a second patterned circuit layer disposed on the lower surface and a conductive through hole connecting the first and the second patterned circuit layers. The first build-up circuit structure at least has a cavity and an inner dielectric layer. The inner dielectric layer has an opening communicating the cavity and a pad of the first patterned circuit layer is located in the opening. A hole diameter of the opening is smaller than a hole diameter of cavity. An inner surface of the inner dielectric layer exposed by the cavity and a top surface of the pad are coplanar or have a height difference.