A substrate includes a multilayer substrate body in which a plurality of circuit bodies are laminated in a laminating direction through insulating layers and are interlayer connected via a connected conductor formed on each of the insulating layers, and a magnetic body that is arranged in the laminating direction while at least a part of or all of the magnetic body sandwiches the circuit bodies. Each of the circuit bodies includes at least a first circuit body and a second circuit body. The first circuit body is formed of a first extending portion and a first folding portion. The second circuit body is formed of a second extending portion and a second folding portion.

A mini smart card and a method of manufacturing the mini smart card are introduced. The method includes disposing bilayered print layers on a top side and a bottom side of a circuit layer, respectively; performing a heat-compression treatment and then a printing treatment on the circuit layer and the bilayered print layers; removing surface layers from the bilayered print layers; and disposing transparent protective layers on the bilayered print layers, respectively. The bilayered print layers are prevented from deforming under the heat generated during the printing treatment. Removal of the surface layers from the bilayered print layers effectively reduces the thickness of the mini smart card.

A component carrier includes a stack with at least one electrically insulating layer structure, a structured electrically conductive layer assembled to the stack, where a part of the structured electrically conductive layer is configured as an inductive element, and a magnetic matrix embedded in the stack. The magnetic matrix at least partially surrounds the inductive element. Further, a manufacturing method is described.

A circuit board utilizing the better and faster performance of optical signals includes interconnected first, second, and third areas. The first area includes a first circuit substrate, and a first coupling element and a chip connected thereon. The second area includes an optical fiber within an insulating layer. The third area includes a second circuit substrate, and a second coupling element and an electronic element connected thereon. The first coupling element and the second coupling element are optically aligned with the optical fiber for signal reception and transmission. A method for manufacturing such composite circuit board is also disclosed.

Disclosed are a multilayer circuit board manufacturing apparatus and a multilayer circuit board manufacturing method. The present disclosure includes: a plurality of uncoilers configured to supply a plurality of different members; and a compressing machine configured to bond the members, which are supplied from the respective uncoilers, to each other. The compressing machine includes: a belt that rotates in contact with one surface of one of the plurality of members; and a pressing device which is located inside the belt and spaced apart from the belt, and presses the belt toward the member in a non-contact manner.

An electronic device with high density for component arrangement includes a first substrate, a second substrate, a plural of passages formed through the first and the second substrates, a first contact arranged on the first face of the first substrate to conceal the corresponding one of the passages, a second contact arranged on the second substrate and adjacent to the corresponding one of the passages, and a conductor disposed in the passages. A first end of the conductor electrically connects the first contact, while a second end of the conductor electrically connects the second contact.

The invention discloses a method of improving a wire structure of a circuit board, comprising the following steps: providing a multi-layer circuit board, including an inner circuit and a surface circuit; forming an opening to expose the inner circuit; forming a first circuit layer in the opening; removing the first circuit layer, the first conductive circuit, and the surface circuit on the multi-layer circuit board and removing a part of the first circuit layer in the opening; forming an adhesion promoter layer in the opening and on the multi-layer circuit board; forming a second conductive circuit on the adhesion promoter layer and on the first conductive circuit layer in the opening; forming a photoresist layer on the second conductive circuit layer; forming a second circuit layer in the opening and on the multi-layer circuit board, and removing the photoresist layer and a part of the second conductive circuit.

An all-directions embedded module includes a substrate layer, many first embedded pads, many second embedded pads, and many side wall circuits. The substrate layer comprises a first surface, a second surface opposite to the first surface, and a plurality of side surfaces connected to the first surface and the second surface. The first embedded pads is formed on the first surface. The second embedded pads is formed on the second surface. The side wall circuits embedded in the substrate layer and exposed from the side surfaces. The all-directions embedded module further includes a plurality of first connecting circuits formed on the first surface and a plurality of second connecting circuits formed on the second surface. The first embedded pads is connected to the side wall circuits by the first connecting circuits. The second embedded pads is connected to the side wall circuits by the second connecting circuits.

Prepregs having a UV curable resin layer located adjacent to a first thermally curable resin layer or sandwiched between first and second thermally curable resin layers wherein the UV curable resin layer is uncured or partially cured as well as methods for preparing laminates using the prepregs wherein the laminate includes at least one UV curable resin encapsulated electrical component.

The movable coil for a flat plate speaker according to an embodiment of the present invention includes a PCB coil and a metal coil. The PCB coil plate forms a single layer or multiple layers. In the PCB coil, a coil track is spirally pattern-printed on a single layer PCB coil plate. Otherwise, each of a plurality of coil tracks is spirally pattern-printed on each of multilayer PCB coil plates, and, the plurality of coil tracks are electrically connected to each other. The metal coil is electrically connected to the PCB coil and wound in a planar spiral shape. The coil track includes straight section effective tracks patterned on the upper and lower portions of one surface of the PCB coil plate, respectively, and idle tracks patterned on left and right portions of the one surface of the PCB coil plate, respectively. The straight section effective tracks are formed by connecting multiple lines in parallel, the idle tracks are formed by singular lines, and the coil track is formed in a spiral shape as multiple lines and singular lines are alternately repeated.