A transmission circuit board includes a bendable area, a first transmission areas, and a second transmission areas. The first and second transmission areas are connected to the bendable area. The inner circuit substrate board further includes a substrate layer and an inner circuit layer formed on the substrate layer and including a first signal circuit. The transmission circuit board further includes a first dielectric layer formed on the inner circuit layer, a first outer circuit layer formed on the first dielectric layer, a first protecting layer formed on the first outer circuit layer, and a first shielding layer formed on the first protecting layer. The first dielectric layer lies the first and second transmission areas. Two ends of the first signal circuit are connected to the first outer circuit layer. The first shielding layer is connected to the first outer circuit layer and lies the bendable area.

A printed circuit board according to an embodiment comprises: a first insulation layer; a first circuit pattern disposed on one surface of the first insulation layer and including a pad; and a second insulation layer disposed on one surface of the first insulation layer and including a cavity exposing the pad, wherein the first circuit pattern includes a 1-1 metal layer disposed on one surface of the first insulation layer, and a 1-2 metal layer disposed on one surface of the 1-1 metal layer, wherein the area of the 1-1 metal layer is greater than the area of the 1-2 metal layer, and at least a portion of a side surface of the 1-1 metal layer is exposed through the cavity.

A printed wiring board includes an insulating layer, a first conductor layer formed on the insulating layer, an adhesive layer formed on the first conductor layer, a resin insulating layer formed on the insulating layer such that the adhesive layer is formed between the first conductor layer and the resin insulating layer, and a second conductor layer formed on the resin insulating layer. The first conductor layer is formed such that the first conductor layer has a smooth upper surface and a smooth side surface and that the adhesive layer has a smooth film formed on the smooth upper and side surfaces, and a protruding part protruding from the smooth film.

An improved electromagnetic field generating antenna is compatible with fluoroscopic imaging and can be placed under, above or anywhere around the patient. The antenna includes one or more antenna elements laid out on a single or multi-layer PCB with current conducting metal traces used for creating electromagnetic fields for tracking sensors. An antenna enclosure is made with a polymer or other non-conductive material. The antenna does not have to be moved for allowing medical imaging during various procedures. An X-ray filter may be made out of similar sub-components as a full antenna assembly with the sole purpose of reducing the radiation dose to the patient during medical procedures without negatively affecting the image quality.

A resin substrate includes an insulating base material including opposing first and second main surfaces, at least one of which is parallel or substantially parallel to each of an X-axis direction and a Y-axis direction. The insulating base material is divided into first and second sections arranged in the X-axis direction. The first section includes, when evenly divided into three in a Z-axis direction, a first region closest to the first main surface, a second region closest to the second main surface, and a third region between the first region and the second region. A degree of resin molecular orientation in the first region in the Y-axis direction is greater than a degree of resin molecular orientation in the second section of the insulating base material in the Y-axis direction.

A printed circuit board includes a first insulating layer; a protective filler layer disposed on one surface of the first insulating layer; a first wiring layer disposed on the one surface of the first insulating layer and having a pad protruding with respect to the protective filler layer; a first via passing through the first insulating layer and contacting the pad; and a second insulating layer disposed on the first wiring layer and the protective filler layer, and having a cavity exposing the pad and at least a portion of the protective filler layer, respectively.

In some implementations, a substrate comprises a ceramic core, multiple metal-filled vias through the ceramic core, and a first metal layer, on a top side of the ceramic core, including metal traces, over respective metal-filled vias. The substrate comprises a second metal layer, including a first electrical contact over a first metal trace, a second electrical contact over a second metal trace, and a third electrical contact over a third metal trace, where the second metal trace is electrically isolated from the first and third metal traces. The substrate comprises a thin dielectric layer separating the first metal layer and the second metal layer. The dielectric layer between the first metal layer and the second layer provides the substrate with a low parasitic inductance and a low thermal resistance based on a thickness of the dielectric layer and/or a material used for the dielectric layer.

A circuit board according to an embodiment includes a first insulating portion including at least one insulating layer; a second insulating portion disposed on the first insulating portion and including at least one insulating layer; and a third insulating portion disposed under the first insulating portion and including at least one insulating layer; wherein the insulating layer constituting the first insulating portion includes a prepreg containing glass fibers, and wherein each of the insulating layers constituting the second and third insulating portions is made of resin coated copper (RCC).

Disclosed are a molded circuit board and a camera module, and a manufacturing method thereof and an electronic device comprising the same. The molded circuit board includes a circuit board main body and a molded structure. The circuit board main body includes at least one circuit layer and at least one substrate layer, wherein the circuit layer and the substrate layer are stacked in a manner of being spaced apart. The molded structure includes a molded layer, wherein the molded layer is stacked on at least one surface of the circuit board main body to cover at least part of the substrate

The object of the invention is to provide a double-sided circuit non-oxide-based ceramic substrate excellent in radiation property and low in cost, and a method for manufacturing the same. A double-sided circuit non-oxide-based ceramic substrate related to the present invention includes a high heat-conductive non-oxide-based ceramic substrate that includes a through hole, a holding layer that is formed on a wall surface of the through hole, and an electro-conductive metal section that is held inside the through hole by the holding layer and does not include an active metal. The double-sided circuit non-oxide-based ceramic substrate related to the present invention preferably includes electrodes (thin film electrodes) that shield end surfaces of the holding layer and end surfaces of the electro-conductive metal section which are exposed to front and back surfaces of the ceramic substrate.