A reticle pod with antistatic capability includes a base and plural of support members. The base has a carrying surface having a recess formed thereon and defined by a bottom surface. The support members encircle the carrying surface of the base and are adapted to support a reticle. The recess is defined by a depth extending between the carrying surface and the bottom surface. The depth ranges from 300 ?m to 3400 ?m to thereby weaken the electrostatic force exerted upon particles on the carrying surface.

Providing a highly reliable electronic control device capable of achieving both low cost and productivity. An electronic control device including an electronic component, a control substrate on which the electronic component is mounted, and a sealing resin that seals the control substrate, the electronic control device being installed outside the vehicle cabin or in the engine compartment, the electronic control device further including a housing case that fixes the control substrate, and an outer periphery of the housing case being covered with a sealing resin.

An electronic circuit unit in which a mold exclusion part, having a rear surface side covered by mold resin and a front surface side exposed from an outer case, is provided at a part of a plate surface of a circuit board which is mounted with electronic components and is covered by the outer case formed by the mold resin. The outer case is multi-material molded using plural kinds of resin having different fluidities. A rear wall of the outer case located on the rear surface side of the mold exclusion part is made of one of the plural kinds of the resin having a fluidity higher than a fluidity of another one of the plural kinds of the resin constituting the other portion of the outer case.

An enclosure for an electronic device. The enclosure has a rear base defining a cavity for holding the electronic device and having one or more input/output connectors. The enclosure has a front cover coupled to the rear base. The enclosure has a backplane within the cavity of the rear base. The backplane has a printed circuit board. The enclosure has as interconnect that electrically connects the printed circuit board with the one or more input/output connectors. The interconnect has a cross-hatched ground (or power) plane.

Providing an electronic control device excellent in electromagnetic shielding property with low cost. An electronic control device includes: an electronic component; a control substrate on which the electronic component is mounted; a sealing resin that seals the control substrate; and a metal housing case at least a portion of which is sealed with the sealing resin. The housing case consists of: a heat sink portion a portion of which is exposed from the sealing resin to dissipate heat of the inside of the sealing resin; an electromagnetic shield unit that shields electromagnetic noise by covering the electronic component; and a fixing portion exposed from the sealing resin to achieve fixation to a vehicle body.

A printed circuit board assembly for a field bus device is described, comprising a housing, a printed circuit board, and at least one electronic component fastened to the printed circuit board. The printed circuit board is arranged in the housing. The housing has at least one bearing surface on which a gap filler is arranged, against which the electronic component rests so that the printed circuit board is mounted in the housing via the electronic component and the gap filler. A potting compound is provided, which covers the printed circuit board and contacts the gap filler.

Integrated circuit packages including carriers with incorporated substrates and interfaces are disclosed herein. An integrated circuit package carrier disclosed herein includes a frame including an opening to receive an integrated circuit package and at least one of (1) a circuitry component on a substrate on a surface of the frame or (2) a cable interface directly coupled to the frame.

An electronic assembly includes a circuit board having a plurality of conductive traces and electronic components forming an electronic circuit disposed thereon, a plurality of flexible electrical terminals configured to attach to electrical contacts disposed on a glass surface and electrically connected to the plurality of conductive traces, and a coaxial cable connector electrically connected to the plurality of conductive traces. A method of manufacturing an electronic assembly, e.g., the electronic assembly described above, is also presented herein.

A semiconductor module includes a base plate, a substrate on the base plate and carrying at least one semiconductor chip, a housing attached to the base plate and at least partially enclosing the substrate, and at least one terminal having one end which protrudes from the housing and another end which has a terminal foot attached on a terminal pad of the metallization by means of ultrasonic welding. The housing has a protective wall which encloses the terminal and divides an interior space of the housing into an unprotected region and a protected region. The protective wall is formed such that a gap is formed between the substrate and the protective wall. The gap is designed to carry a fluid flow such that particles produced during the ultrasonic welding of the terminal foot to the terminal pad are prevented from penetrating into the protected region from the unprotected region.

An electric device having a printed circuit board fitted with components, and at least one foam component, the foam component surrounding the circuit board at least partially so as to form a housing.