A molded assembly, a camera module, a jointed board of molded assembly, and a manufacturing method are provided. The molded assembly includes a circuit board and a molded portion, wherein the circuit board has a molding region, a mounting region and at least two pad regions, the molding region surrounds the mounting region, the pad regions are arranged at corners of the circuit board and located outside corresponding corners of the molding region so as to electrically connect to an actuator, and the pad region has an avoidance boundary, and an angle formed by the avoidance boundary is greater than 90 degrees; wherein the molded portion embeds the molding region, surrounds the mounting region, and has a light window, and the molded portion avoids the pad regions along the avoidance boundary so as to reduce defective rate during production.

The invention relates to an electronic unit (100, 100′) comprising at least one printed circuit board (10, 10′, 20) which is populated with a plurality of electric and/or electronic components (50, 50.1, 50.2) on one side or on both sides and which is incorporated into at least one protective housing (90) made of a solidified potting compound (80′). In the process, the electronic unit overall forms a volume body (200) in which the solidified potting compound takes up a filling volume (70). In order to minimize the filling volume, the electronic unit additionally comprises a separate insert molding part (60) which is arranged at least adjacently to a populated side of the at least one printed circuit board and which takes up a spatially closed displacement volume in the volume body with respect to a flowable potting compound for forming the protective housing in a solidified state (80′).

A control unit (10) for an apparatus (12), the control unit (10) comprising a component-carrying member (14; 114; 18; 118) provided with at least one electronic component (30, 32, 34, 36, 38; 60, 62; 74, 78) configured to provide a function of the apparatus (12); wherein the component-carrying member is formed of a material that is pliable at least during assembly of the control unit (10). The control unit is provided with an injection moulded layer (22; 22′) encapsulating at least a part of the or each electronic component (30, 32, 34, 36, 38; 60, 62; 74, 78).

The disclosure provides an electronic control apparatus including a printed circuit board with a first surface side and a second surface side and with at least one electronic component that is arranged on at least one of the surface sides of the printed circuit board. At least one heat sink is arranged on the printed circuit board on the opposite surface side from the electronic component for the purpose of heat dissipation. The printed circuit board with the electronic component and the heat sink are surrounded by a casing made from a thermosetting plastic material such that at least one outer side of the heat sink is free of thermosetting plastic material.

A circuit board device (A) includes a circuit board (10), a cover (32) and a molded body (52) to be provided on the circuit board (10), and a board connector (11) to be surface-mounted on the circuit board (10). The board connector (11) includes a housing (13) and metal members (24, 29) integrally mounted in or on the housing (13). The board connector (11) is surface-mounted on the circuit board (10) by solder-joining the metal members (24, 29). The molded body (52) is made of synthetic resin and surrounds the circuit board (10) and the metal members (24, 29) in a solder joint state. The cover (32) is embedded in the molded body (52) while being disposed at intermediate positions of straight paths connecting gate marks (54) on an outer surface of the molded body (52) and the metal members (24, 29).

An electronic component module (100) includes a module board (10) having electronic components (40) mounted on at least one of a first surface (front surface) (12) and a second surface (back surface) (14), mold portions (22 and 23), and a shield (32). The mold portions (22 and 23) cover the mounted electronic components (40). The shield (32) covers at least a part of the mold portions (22 and 23) and the side surfaces of the module board (10). Protrusions (15) protruding from the side surfaces are formed on the module board (10). The shield (32) is separated by the protrusions (15).

A resin-sealed in-vehicle electronic control device in the present disclosure is a resin-sealed in-vehicle electronic control device including a circuit board on which an electronic component is mounted, a connector housing that electrically connects the circuit board to an external terminal, and a sealing resin fixing the connector housing to the circuit board. The connector housing has a through hole allowing communication between a second end surface located opposite to a first end surface on which the external terminal is mounted and a side surface of the connector housing adjoining the second end surface, and the sealing resin is continuous to fill at least the inside of the through hole and cover a part of an outer periphery of the connector housing and at least a part of an outer periphery of the circuit board.

An electronic medical device is disclosed here. An exemplary embodiment of the medical device includes a printed circuit board assembly, a protective inner shell surrounding at least a portion of the printed circuit board assembly, and an outer shell surrounding at least a portion of the protective inner shell. The printed circuit board assembly has a printed circuit board, electronic components mounted to the printed circuit board, a battery mounted to the printed circuit board, and an interface compatible with a physiological characteristic sensor component. The protective inner shell is formed by overmolding the printed circuit board assembly with a first material having low pressure and low temperature molding properties. The outer shell is formed by overmolding the protective inner shell with a second material that is different than the first material.

Reliability is to be improved. A control board 2 on which an electronic component 1 is mounted and an enclosure 3 in which the control board 2 is sealed with sealing resin 5 are included, wherein the enclosure 3 has a shape in which a volume of resin on one surface side of the control board 2 is larger than a volume of resin on the other surface side, a gate mark 21a is formed in the enclosure 3, a length of the gate mark 21a in a thickness direction of the control board 2 is larger than a thickness of the control board 2, the control board 2 is located such that a side surface partially overlaps a projection region of the gate mark 21a, and the control board 2 is arranged toward the other surface side relative to a center of the gate mark 21a.

An ECU 1 includes a circuit board 10, a connector 20 fixed to the circuit board 10 and a resin portion 50 covering the circuit board 10 and the connector 20. The connector 20 includes a housing body 22 and a cut-off receiving portion 27 projecting from the housing body 22. The cut-off receiving portion 27 includes a flange portion 28 projecting outward from the housing body 22 and a flexible wall 29 extending from the flange portion 28 and inclined to be closer to the housing body 22 toward a tip, and a part of the flexible wall 29 is embedded in the resin portion 50.