Described herein is a system and method for securing a printed circuit board without the use of screws in a housing assembly comprising a bottom housing made of plastic and a top housing made of metal. The top housing comprises a plurality of ribs. The bottom housing comprises a plurality of flexible snap arms each having a head portion, which includes an angled lower face, a horizontal crush rib, and a vertical crush rib. Upon coupling of the assembly, the ribs exert a horizontal force on the flexible snap arms resulting in climbing of the angled lower face further onto the printed circuit board. The horizontal force may also crush the horizontal crush ribs allowing for increased flexibility between the components to adjust for interference, preventing potential damage to the printed circuit board. Vertical forces may also crush the vertical crush ribs allowing for increased flexibility between the components.

A control module for a vehicle with at least one electric motor and a transmission is provided. The control module has a housing for receiving a transmission control electronics unit and an inverter electronics unit for controlling an electric motor, and a heat sink. The heat sink is disposed between a housing upper part and a housing lower part in such a manner that the heat sink forms part of the housing. The housing lower part and the heat sink form a medium-tight cavity for receiving the inverter electronics unit. The transmission control electronics unit is surrounded by a plastic casing. The transmission control electronics unit with the plastic casing forms the housing upper part. The housing upper part is connected to the heat sink in a thermally conductive manner such that a heat transport from the transmission control electronics unit to the heat sink takes place.

An ECU 1 includes a circuit board 10, a connector 20 fixed to the circuit board 10 and a resin portion 50 covering the circuit board 10 and the connector 20. The connector 20 includes a housing body 22 and a cut-off receiving portion 27 projecting from the housing body 22. The cut-off receiving portion 27 includes a flange portion 28 projecting outward from the housing body 22 and a flexible wall 29 extending from the flange portion 28 and inclined to be closer to the housing body 22 toward a tip, and a part of the flexible wall 29 is embedded in the resin portion 50.

A shock resistant fuselage system includes first and second fuselage side walls, each of the first and second fuselage side walls having a plurality of guide posts, and a printed circuit board (PCB) rigidly attached to at least one of the first and second fuselage side walls, the PCB having a plurality of guide slots, each of the plurality of guide posts slideably seated in a respective one of the plurality of guide slots so that elastic deformation of the PCB is guided by the guide slots between the first and second fuselage side walls.

A digital amplifier integrated circuit (IC), which is a heat-generating electronic component, is mounted on an upper surface of an insulating substrate. The digital amplifier IC is disposed inside a recess of a heat sink. The heat sink includes a peripheral wall having an end face placed on the upper surface of the insulating substrate. A hot-melt resin layer, molded by hot-melt molding, covers the upper surface of the insulating substrate. The hot-melt resin layer is in contact with a side face of the peripheral wall and retains the heat sink on the insulating substrate. The recess of the heat sink has no hot-melt resin therein.

A transmission control device, in particular for a motor vehicle, includes a circuit board element, and an electrical-connector housing. The circuit board element has electronic components. The electrical-connector housing is configured to receive an electrical connector, and to electrically connect the electrical connector to the circuit board element. The electrical-connector housing substantially consists of a thermoset material, and partially encloses the circuit board element via direct contact in an integrally bonded fashion.

An enclosure for an electronic device. The enclosure has a rear base defining a cavity for holding the electronic device and having one or more input/output connectors. The enclosure has a front cover coupled to the rear base. The enclosure has a backplane within the cavity of the rear base. The backplane has a printed circuit board. The enclosure has as interconnect that electrically connects the printed circuit board with the one or more input/output connectors. The interconnect has a cross-hatched ground (or power) plane.

Embodiments of the present invention provide a method for packaging a printed circuit board assembly (PCBA), a packaged PCBA module, and a motor vehicle. The method includes: providing a printed circuit board assembly comprising a printed circuit board (PCB) and a plurality of elements assembled on the printed circuit board; providing a support constructed to carry the printed circuit board assembly and define a space for accommodating the printed circuit board assembly; placing the printed circuit board assembly in the space of the support to enable the support to carry and position the printed circuit board assembly, and placing the support and the printed circuit board assembly carried thereby in a mould; and filling the mould with a polymer material using a moulding process so as to form a packaging structure encapsulating at least the printed circuit board assembly and fixing the printed circuit board assembly relative to the support.

Electronics modules according to embodiments of the present technology may include a circuit board having a first surface from which an electronic component extends and a second surface opposite the first surface. The circuit board may include a tie-bar residual extending from a sidewall of the circuit board beyond the width across the first surface. The modules may also include an overmold at least partially encapsulating the circuit board. The overmold may be characterized by a first height extending normal to the first surface of the circuit board across the width of the circuit board. The overmold may extend laterally beyond the width along a length of the first surface. The overmold may define a region about the tie-bar residual characterized by a recessed height. The overmold may define a notch recessed from an outer edge of the overmold. The notch may be located across the tie-bar residual.

An electronic medical device is disclosed here. An exemplary embodiment of the medical device includes a printed circuit board assembly, a protective inner shell surrounding at least a portion of the printed circuit board assembly, and an outer shell surrounding at least a portion of the protective inner shell. The printed circuit board assembly has a printed circuit board, electronic components mounted to the printed circuit board, a battery mounted to the printed circuit board, and an interface compatible with a physiological characteristic sensor component. The protective inner shell is formed by overmolding the printed circuit board assembly with a first material having low pressure and low temperature molding properties. The outer shell is formed by overmolding the protective inner shell with a second material that is different than the first material.