A plug-in holder includes a frame, a first engaging structure and at least one second engaging structure. The frame has a first side and a second side, wherein the first side is opposite to the second side. The first engaging structure is located at the first side. The at least one second engaging structure is located at the second side.

An apparatus comprises a housing, a component cradle, and a plurality of towers. The housing generally has an inner mounting surface. The component cradle may be formed on the inner mounting surface of the housing. The plurality of towers may be formed on and extending from the inner mounting surface of the housing around the component cradle. The towers are generally deformable into a form-fitting engagement with an electronic component placed on the component cradle.

An electronic component package structure and an electronic device are provided. The electronic component package structure includes at least: a substrate having a set attachment area for attaching an electronic component; a conductive lid having a top and a sidewall that extends toward the substrate, where one side of the sidewall close to the substrate has a bonding end, where the bonding end bonds the conductive lid to the substrate by using a non-conductive adhesive, and the conductive lid bonded to the substrate encloses the attachment area and forms a shielding space over the attachment area; and the non-conductive adhesive is located between the substrate and the bonding end, and has a dielectric constant not less than 7 and a coating thickness not greater than 0.07 millimeters (mm). With the present invention, an Electromagnetic Interference (EMI) shielding effect of the shielding space can be improved.

An apparatus includes a printed circuit board. The printed circuit board includes at least one conductive layer on top a first dielectric layer, wherein the at least one conductive layer comprises at least one of a ground plane and a power plane. The printed circuit board includes a second dielectric layer on top of the at least one conductive layer. The printed circuit board includes a thermal pad on top of the second dielectric layer. The printed circuit board is fabricated by forming at least one plated through hole for electrically coupling the thermal pad to the at least one conductive layer. The printed circuit board is fabricated by backdrilling the at least one plated through hole to remove a portion of the conductive material, wherein subsequent to the backdrilling the conductive material remaining in the at least one plated through hole electrically couples one or more of the at least one conductive layer to the thermal pad.

A wiring substrate includes an electronic component mounting pad, an electrode pad arranged at an outer side of the electronic component mounting pad, a first insulation layer formed on the electronic component mounting pad and the electrode pad, an opening formed in the first insulation layer on the electronic component mounting pad, a connection hole formed in the first insulation layer on the electrode pad, and recess portions formed at the electronic component mounting pad in the opening and at the electrode pad in the connection hole, respectively.

Embodiments of the present disclosure are directed towards techniques and configurations for dual surface finish package substrate assemblies. In one embodiment a method includes depositing a first surface finish on one or more electrical routing features located on a first side of a package substrate and on one or more lands located on a second side of the package substrate, the second side being opposite the first side of the substrate. The method may further include removing the first surface finish on the first side of the package substrate; and depositing a second surface finish on the one or more electrical routing features of the first side. The depositing of the second surface finish may be accomplished by one of a Direct Immersion Gold (DIG) process or an Organic Solderability Preservative (OSP) process. Other embodiments may be described and/or claimed.

Disclosed is a circuit board having a contact pad for connection with an external device, which protrudes from an upper surface of an outermost insulating layer. A device can be mounted on the circuit board, and a connection terminal of the device can be connected to the contact pad of the circuit board by a wire etc.

A circuit board assembly and an electronic device. The circuit board assembly includes: a circuit board to which a first board-to-board connector and a second board-to-board connector are mounted; a first bracket, where the first bracket is mounted on the circuit board, the first bracket is located on a side of the first board-to-board connector away from the circuit board; a second bracket, where the second bracket is mounted on the circuit board, and the second bracket is located on a side of the second board-to-board connector away from the circuit board, and the second bracket is disposed neighboring to the first bracket and the second bracket is provided with a tongue insert; and a fixing member, where the fixing member is connected to the circuit board and the fixing member is provided with a slot.

A circuit board assembly and an electronic device. The circuit board assembly includes: a circuit board to which a first board-to-board connector and a second board-to-board connector are mounted; a first bracket, where the first bracket is mounted on the circuit board, the first bracket is located on a side of the first board-to-board connector away from the circuit board; a second bracket, where the second bracket is mounted on the circuit board, and the second bracket is located on a side of the second board-to-board connector away from the circuit board, and the second bracket is disposed neighboring to the first bracket and the second bracket is provided with a tongue insert; and a fixing member, where the fixing member is connected to the circuit board and the fixing member is provided with a slot.

Printed circuit boards (PCBs) are configured with an athermalized mounting suitable for securing and positioning and the PCBs within an inertial measurement unit (IMU). The PCBs include integrated circuit (IC) components, such as accelerometers and/or gyroscopes, which require relative positional stability within the IMU environment in order to provide accurate results. The athermalized mounting configuration of the PCB enables the PCBs to experience thermal expansion within the IMU without causing significant displacement of the IC relative to the IMU environment.