A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.

Embodiments are generally directed apparatuses, methods, techniques and so forth to select two or more processing units of the plurality of processing units to process a workload, and configure a circuit switch to link the two or more processing units to process the workload, the two or more processing units each linked to each other via paths of communication and the circuit switch.

A module for a networking node is disclosed. The module includes a Printed Circuit Board (“PCB”), one or more circuits mounted to the PCB and a faceplate. The faceplate includes a middle plate, a first side plate, and a second side plate. The first side plate extends from the middle plate at an obtuse angle relative to the middle plate towards a first side and back of the module. The second side plate extends from the middle plate, opposite to the first side plate, at an obtuse angle relative to the middle plate towards a second side and the back of the module.

Printed circuit boards (PCBs) are configured with an athermalized mounting suitable for securing and positioning and the PCBs within an inertial measurement unit (IMU). The PCBs include integrated circuit (IC) components, such as accelerometers and/or gyroscopes, which require relative positional stability within the IMU environment in order to provide accurate results. The athermalized mounting configuration of the PCB enables the PCBs to experience thermal expansion within the IMU without causing significant displacement of the IC relative to the IMU environment.

A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.

A display stack-up for an electronic device has: multiple layers that include a display layer and a second layer; and an outer seal. Each layer has first and second base surfaces and a thickness therebetween defining a height of a lateral surface at a periphery of the layer. The multiple layers are stacked along an axis perpendicular to their base surfaces and parallel to their lateral surfaces, and the outer seal is positioned along the lateral surface of at least some of the multiple layers. The outer seal is composed of a flexible material and is arranged to bind the second layer and at least one other layer of the multiple layers. The outer seal also contains a non-adhesive liquid between the second layer and the at least one other layer to allow relative sliding between at least two layers of the multiple layers.

According to certain embodiments, an electronic device comprises a first electrical structure disposed in an internal space of the electronic device; and a flexible printed circuit board (FPCB) comprising a first fastening area and an extension area extended from the first fastening area, the first fastening area electrically connected to the first electrical structure, wherein the FPCB further comprises: a dielectric substrate comprising a first surface and a second surface facing in a direction opposite to that of the first surface and facing the first electrical structure; a first conductive layer disposed on the first surface of the dielectric substrate; and a first protective layer stacked on the first conductive layer, in the extension area and terminating in the first fastening area; wherein the first fastening area comprises a screw through hole for screw fastening, and at least one conductive via disposed at a periphery of the screw through hole extending from the dielectric substrate to the first conductive layer.

An electronic apparatus includes a plurality of parts, a frame having an outer periphery surrounding the plurality of parts and formed from resin, a circuit board disposed at one side in a first direction with respect to the plurality of parts, a chassis disposed at the one side in the first direction with respect to the plurality of parts, attached to the frame, and formed from metal, and a metal plate disposed at the other side in the first direction with respect to at least one of the plurality of parts and attached to the frame.

Embodiments may be generally direct to apparatuses, systems, method, and techniques to determine a configuration for a plurality of connectors, the configuration to associate a first interconnect protocol with a first subset of the plurality of connectors and a second interconnect protocol with a second subset of the plurality of connectors, the first interconnect protocol and the second interconnect protocol are different interconnect protocols and each comprising one of a serial link protocol, a coherent link protocol, and an accelerator link protocol, cause processing of data for communication via the first subset of the plurality of connectors in accordance with the first interconnect protocol, and cause processing of data for communication via the second subset of the plurality of connector in accordance with the second interconnect protocol.

A system includes a top-of-rack, a first plurality of chassis, and a first backplane. The first plurality of chassis each includes at least one rack module and a chassis network switch that connects to each of the at least one rack module. The first backplane includes a first backplane network switch that connects to the top-of-rack and connects to each of the first plurality of chassis via the chassis network switch of each of the first plurality of chassis.