A cabinet liquid cooling system is configured to dissipate heat of a cabinet. A flow allocation unit is installed on a single side of the cabinet, is located in space between a side wall of the cabinet and a mounting bar of the cabinet, and is provided with a liquid inlet and a liquid outlet. A liquid cooling system (LCS) control unit is installed at the bottom of the cabinet and cyclically supplies liquid to the flow allocation unit using the liquid inlet and the liquid outlet. A liquid supply branch includes a liquid delivery pipe and a liquid return pipe. A node pipe includes a liquid inlet pipe and a liquid outlet pipe. Both the liquid inlet pipe and the liquid outlet pipe are connected to the corresponding liquid delivery pipe and liquid return pipe using the quick male connector and the quick female connector.

An electronic equipment chassis assembly includes a housing, and a plurality of openings defined in the housing that allow airflow there-through. The openings include at least one intake opening defined in the front surface of the housing and at least one exit opening defined in the rear surface of the housing. The chassis also includes an air filter, and one or more rails disposed within the housing defining receiving slots that releasably secure a first plurality of circuit boards, and a second plurality of circuit boards, which second plurality of circuit boards are orthogonally oriented relative to the first plurality of circuit boards. The chassis includes an airflow assembly proximate the top surface of the housing, and one or more output fans proximate the rear surface of the housing. The airflow assembly and the output fans balance airflow throughout the chassis.

The present disclosure relates to a cold plate and vapor chamber for conduction cooling of one or more printed circuit boards in a printed circuit board (PCB) enclosure. The cold plate may include a planar surface at an oblique angle relative to an axis along which the PCB assembly is inserted into the enclosure. The PCB assembly may include a vapor chamber having a complementary obliquely angled surface. The complementary angled surfaces of the cold plate and vapor chamber may exert forces against each other upon insertion of the printed circuit board assembly into the enclosure and contact between the cold plate and vapor chamber.

A drive apparatus is provided which comprising a ducting piece coupled to a drive comprises an air vent. The base of the ducting piece is open to receive exhaust gases from the drive and the ducting piece then diverts these gases horizontally. A system may be provided comprises a plurality of such apparatuses, with the ducting pieces coupled to one another to pass the gases along a horizontal pathway.

Cooling systems for devices arranged in rows are disclosed. An example cooling system for a datacenter includes a supply air duct to extend lengthwise above a first space between a first row of computers and a second row of computers. The example cooling system further includes a branch air duct attached to the supply air duct to extend downward from the supply air duct into the first space.

Cooling systems for devices arranged in rows are disclosed. An example cooling system for a datacenter in a building includes a supply air duct to extend lengthwise along a first aisle within the building. The first aisle is defined between a first row of computers and a second row of computers. The first row of computers provides passage of a first current of air from the first aisle to a second aisle on an opposite side of the first row of computers. The supply air duct is to be positioned with an upper section that is higher than a top surface associated with the first and second rows of computers. The cooling system includes a first wing to extend from the supply air duct toward the first row of computers, and a second wing to extend from the supply air duct toward the second row of computers.

A method of providing cooling air for cooling data centre IT equipment, an evaporative humidifier and an air handling unit is disclosed. The method comprises operating an evaporative humidifier (201) to humidify air for supply as IT equipment cooling air, the evaporative humidifier preferably comprising a deformable wettable matrix (207). Preferably, the method comprises steps of wetting the deformable wettable matrix (207), passing air through the wetted matrix (207) thus producing humidified air, and expelling water from the wettable matrix (207) by subjecting the wettable matrix to compressive deformation. The evaporative humidifier (201) preferably comprises a compressible wettable matrix (207), a water reservoir (217), a pump (218) for supplying water from the reservoir (217) to the wettable matrix (207), a frame for supporting the compressible wettable matrix, and an actuator (211) for effecting a compressive force on the compressible wettable matrix (207) for the purpose of expelling water from the wettable matrix (207). The air handling unit preferably comprises an evaporative humidifier (201) as disclosed.

A rack cover assembly including a first side cover and a second side cover. The first side cover may include a first tensioner and a first flexible rectangular sheet. The first tensioner may be coupled to the first flexible rectangular sheet at or near a first lateral edge. The first tensioner may include a first tensioner height that is less than a first sheet height between the first top edge and the first bottom edge. The second cover may include a second tensioner and a second flexible rectangular sheet configured to couple with the first flexible rectangular sheet. The second tensioner may be coupled to the second flexible rectangular sheet at or near a second lateral edge. The second tensioner may include a second tensioner height that is less than a second sheet height between the second top edge and the second bottom edge.

Cooling systems for devices arranged in rows are disclosed. An example cooling system includes an inflatable air duct to be positioned above a cold aisle defined between two rows of electronic equipment. The inflatable air duct is to be air permeable to deliver conditioned air into the cold aisle. The electronic equipment has fans to force cool air within the cold aisle through the electronic equipment to adjacent hot aisles on opposite sides of the two rows of the electronic equipment. The inflatable air duct to be spaced apart from the rows of computers such that the cold aisle is in unobstructed fluid communication with the adjacent hot aisles over top of the rows of electronic equipment. The conditioned air delivered from the inflatable air duct to substantially prevent a mixing of warm air in the hot aisles with the cool air in the cold aisle.

An example cooling system for a datacenter is disclosed. The datacenter includes a plurality of computers arranged in a row within a building. The row of computers separates a cold aisle and a hot aisle. The row of computers defines an air passageway between the cold aisle and the hot aisle. The row of computers is associated with a top surface that is below and spaced apart from an overhead surface of the building to define a gap between the top surface and the overhead surface. The example cooling system includes an inflatable air duct to be disposed within the gap. The inflatable air duct has selectively an inflated state and a deflated state. The inflatable air duct filling more of the gap when the inflatable air duct is in the inflated state than when the inflatable air duct is in the deflated state.