A module installation assembly for installing a module into a socket of a land grid array includes a tool having a mounting bracket for connecting the tool to an adjacent fixture, an alignment member connected to the mounting bracket, and cavity defined at least partially by the alignment member. The cavity is substantially aligned with a socket of the land grid array such that the module is configured to pass through the cavity when being connected to the socket.

There is provided a method for manufacturing a component interconnect board (150) comprising a conductor structure for providing electrical circuitry to at least one component (114) when mounted on the component board, the method comprising providing a conductor sheet (100) with a first predetermined pattern (115), providing a solder resist sheet (112) with a second predetermined pattern for defining solder areas (125) of the component board, forming a subassembly (120) by laminating the solder resist sheet on top of the conductor sheet, applying solder onto the subassembly, placing the at least one component onto the subassembly, performing soldering, and laminating the subassembly to a substrate (130). The solder resist sheet is further arranged to act as a carrier for the conductor sheet.

A plurality of signal terminals are disposed in parallel and comprise an embedded part embedded and held in a base member of insulating material and a protruding part that protrudes from the base member, the protruding part forms a connecting part that is electrically connected by contacting or solder-connecting to a mating connecting body, the base member comprises a main body holding part that covers the entire circumference of the circumferential surface of the signal terminals and holds the signal terminals, and a semi-exposed holding part that exposes a portion of the circumferential surface of the signal terminals while covering and holding the remaining portion, with the protruding part of the signal terminals protruding from the semi-exposed holding part with regard to the main body holding part.

Methods and devices for selectively presenting a user interface in a dual screen device. More particularly, the method includes providing a gallery for the dual screen device. The gallery can present one or more images in a user interface. The gallery user interface can adapt to changes in the device configuration. Further, the gallery can display images or videos in the various configurations.

A component mounting method is provided for mounting a light emitting component on a board by picking up the light emitting component from a pocket formed in a carrier tape by a mount head. The method includes recognizing a reference part formed in the board, recognizing a light emitting part of the light emitting component by imaging the light emitting component from above in a state where the light emitting component is held within the pocket by a holder from below, picking up the light emitting component by the mount head in the state where the light emitting component is held within the pocket by the holder from below, and mounting the picked up light emitting component on the board based on a recognition result of the reference part and a recognition result of the light emitting part.

An object of the present disclosure is to provide a component crimping device and a component crimping method that make it possible to improve accuracy of attaching a component onto a substrate by preventing the component from being excessively elongated due to rapid thermal expansion when the component is pressed against the substrate. A lower surface side of a substrate-side terminal part of a substrate held by a substrate holding table is supported by a support, a component placed on a placing table is picked up by a crimping head while heating the component, the component is compressed against a compressing table so as to be elongated, and then the component is pressed against the substrate-side terminal part.

A method for mounting SMD components on contact springs in electric motors. In a first method variation, the SMD component is mounted on the base of a carrier of the electric motor, which has already been provided with a contact spring protruding into a cavity. As the SMD component is installed, the contact spring is pressed back such that no frictional or sliding contact arises during installation. In a second variation, the SMD component is mounted first and then a contact spring is inserted using a press tool. As the contact spring is inserted, the spring is held back such that likewise no frictional or sliding contact arises with the SMD component that has already been installed. This avoids damage to the SMD component caused by the contact spring during installation.

A work head unit that detects the rotational position of suction nozzle with first Q-axis encoder positioned facing component holding section that holds a component. With the work head unit, it is desirable to detect the orientation of component holding section at two locations: suction nozzle and syringe member.

Control device 80 of component mounter 11 performs control such that after a component supplied by reel unit 56 is picked up by nozzle 40 of mounting head 24 and before the component is mounted on board 12, the component is temporarily placed at a specified position of temporary placement surface 71. Also, control device 80, after performing control such that the component is temporarily placed at the specified position, determines whether the component has actually been temporarily placed at the specified position based on the pressure state at a hole provided at the specified position of temporary placement surface 71 to which negative pressure is being supplied, and performs processing according to the determination result. Because the determination of whether the component has actually been temporarily placed is based on the pressure state of the hole provided in temporary placement surface 71, the determination is performed rapidly compared to a case in which the presence of the component is checked by analyzing an image of temporary placement surface 71 captured from above.

Methods and devices for minimizing and maximizing displayed output associated with applications are provided. More particularly, an application presented across two or more screens of a device in a landscape mode can be minimized to present portion of the application in one of the screens. With respect to a maximization operation received with respect to a page of an application results in the expansion of the displayed portion of the application to multiple screens of the device. Input to effect minimization and maximization operations can be entered in one or more gesture capture regions associated with the screens.