A receiving device for components. The receiving device is designed to be adjusted in a controlled manner relative to a deposit point at least partly along a first, second, and/or third axis by at least one linear drive and/or move a support guided by the receiving device along one of the first and/or second axes by a drive. The receiving device has a position sensor which is paired with a component deposit point in order to detect a component which has only been partly deposited in a pocket of the support at the component deposit point, where the position sensor is connected to the receiving device laterally of the support such that the position sensor is moved directly together with the receiving device.

A system for monitoring the charging performance of a capacitor in an electric circuit in a manufacturing machine installed in a production line includes a charging voltage detecting section for detecting the charging voltage of the capacitor. A control device of the production machine measures, as the charging time, a time from starting charging to a time when a specified charging complete determination voltage that can be used to determine when the charging voltage of the capacitor has reached full charge is reached based on the charging voltage of the capacitor detected by charging voltage detecting section, determines whether the capacitor has deteriorated by determining whether the measured charging time is equal to or less than a specified deterioration threshold value, and upon determining that the capacitor has deteriorated, issues a warning to an operator via a display or sound.

A method for detecting errors or malfunctions in electrical or electronic components of circuits, wherein each of the circuits is located on a circuit board and wherein a plurality of circuit boards border one another on a circuit board panel, includes populating each of the circuit boards of the circuit board panel with electrical or electronic components corresponding to the circuits; for each of the analog, electrical or electronic components used for the construction of the circuits, placing a corresponding test component in an edge region of the circuit board panel; providing the analog, electrical or electronic test components placed in the edge region of the circuit board panel with test points; and checking for the correct function value and/or the correct poling of the analog, electrical or electronic test components provided with test points and located in the edge region of the circuit board panel.

A substrate inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder and a thermosetting adhesive applied on the substrate, the substrate inspection device including: an irradiator that irradiates the solder and the adhesive with light; an imaging device that takes an image of the irradiated solder and the irradiated adhesive; and a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group.

A component mounting includes an external monitoring camera that images an outside work area that is an area outside of the component mounting machine at which an operator performs work with respect to the component mounting machine. The outside work area of the component mounting machine includes at least an area where a feeder is set, and a monitoring target is at least a state during and after completion of setting the feeder on the component mounting machine and during and after completion of setting component supply tape on the feeder. By looking at a recorded image or a real time image displayed on a display device by using the external monitoring camera to capture an outside work area of the component mounting machine, it is possible to check the state of the monitoring target on which an operator performed work in the outside work area of the component mounter.

A mark recognition device is applied to a substrate including a marked region. The mark recognition device includes; an image collecting mechanism and a first light source. The first light source emits a light beam, the light beam includes a first light beam and a second light beam. The first light beam is irradiated to the marked region of the substrate and blocked by a mark of the marked region to generate a marked orthographic projection on the image collecting mechanism. The second light beam is transmitted to the image collecting mechanism to form transmitted light. The image collecting mechanism recognizes the mark according to the marked orthographic projection of the mark and the second light beam. Recognition accuracy of the mark is effectively improved in embodiments of the present application.

A grounding includes a photoelectric sensor that emits light to a detection region in which the detection target portion moves in conjunction with the grounding of the electronic component to a board and receives light from the detection region, and a grounding discrimination section that discriminates between the presence or absence of the grounding based on a signal from the photoelectric sensor. The detection target portion is disposed in the detection region in the ungrounded state.

There is provided a tape feeder for supplying, using a taped electric component including a carrier tape and multiple electric components held onto the carrier tape, the electric component in a supply position, the tape feeder including a detection sensor configured to detect presence or absence of the electric component in the supply position.

A periphery monitoring device includes monitoring areas in at least three directions of moving body. Safety laser scanners are mounted to the moving body for each of the monitoring areas in the directions. A monitoring area in at least one direction is a three-dimensional monitoring area, and a monitoring area in the other direction is a horizontal monitoring area to be monitored in two dimensions in a horizontal direction. The safety laser scanner configured to monitor the three-dimensional monitoring area is mounted to an upper portion of the moving body, and the three-dimensional monitoring area forms an inclined plane-like monitoring area. A safety laser scanner configured to monitor the horizontal monitoring area is mounted to the lower portion of the moving body, and the horizontal monitoring area forms a horizontal plane-like monitoring area from the lower portion of the moving body.

A control device is used for a mounting device with a mounting head including at least a first holder on which a first pickup member is installed, and a second holder on which a second pickup member is installed, and configured to pick up components supplied from a component supply section and mount the components. The control device includes a control section configured to acquire a first deviation amount of a tip of the first pickup member and a second deviation amount of a tip of the second pickup member and select a combination of the pickup members in which an interval between the tips of the pickup members that is obtained based on the first deviation amount and the second deviation amount falls within a predetermined range.