A method of mounting components on a PCB includes drawing a component, transporting the component to a starting position, taring the sensor, moving the sensor in Z-axis until the component contacts the board surface, activating the regulator, transmitting from the regulator a signal to a industrial robot as Z-axis offset, releasing the components from the industrial robot if the Z-axis offset is greater than or equal to a preset parameter and establishing the current position of the component as a starting point, moving the component if the Z-axis offset is less than the preset parameter beginning from the current position, arresting movement of the component when the sensor detects an opening edge in the board, moving the component away from the opening edge based on data from the sensor, repeating steps while a change in the component movement is executed.

Systems, apparatus, methods, and techniques of assembly of discrete modules of a control panel are disclosed. The modules can be independently wired, tested, and installed into a control panel. Module definitions are defined specifying components to perform the electrical function, a mechanical arrangement of the components, electrical connections, and logical interactions of the module. A bill of materials can be generated based on a designation of a set of modules for a control panel and the module definitions. Modularly assembled control panels are disclosed. An assembly frame is described herein for temporarily mounting components of a module for independent assembly of a control module and for eventual removal and installation into a control panel frame. The assembly frame may include a faceplate frame and side frames and temporary mounting features.

The current disclosure provides a pickup and placing device including a control element, a substrate and a pickup structure. The substrate has an upper surface and a lower surface opposite to each other and a plurality of conductive via structures, wherein the conductive via structures are electrically connected to the control element. The pickup structure includes a plurality of pickup heads used for picking up or placing a plurality of light emitting diodes respectively. The pickup structure is disposed on the lower surface of the substrate or disposed in the substrate and extended outside the substrate, and the substrate is disposed between the control element and the pickup structure, wherein the pickup heads are electrically connected to the conductive via structures.

A method for reducing influence of a remote reference power noise on signal quality is provided. A remote reference power plane connected to a power module is identified according to a schematic diagram of signal design, and a noised power plane is determined. A position of the noised power plane is found in a PCB, and whether the noised power plane is remote referenced by a high-speed signal is judged. Placement positions and number of connection capacitors are determined according to a layout and routing position of the high-speed signal and a width of the noised power plane. Two capacitors with fixed capacitance values are placed at the placement positions of the connection capacitors. Connection capacitors are added to a position of a noised remote reference power plane of a signal line for connecting the power plane and the ground.

Based on the measured values of the electrical characteristics of multiple components including a component positioned in the middle among many components held on the component tape, it is possible to more accurately estimate the electrical characteristics of the many components as compared with the case based on the measured value of the electrical characteristic of a component positioned at the leading end. Also, based on the statistically processed results of these measurement values, it is possible to appropriately evaluate the electrical characteristics of many components. Further, if the electrical characteristics of all of the components are measured, the evaluation can be performed more appropriately.

Control device 80 of component mounter 11 performs control such that after a component supplied by reel unit 56 is picked up by nozzle 40 of mounting head 24 and before the component is mounted on board 12, the component is temporarily placed at a specified position of temporary placement surface 71. Also, control device 80, after performing control such that the component is temporarily placed at the specified position, determines whether the component has actually been temporarily placed at the specified position based on the pressure state at a hole provided at the specified position of temporary placement surface 71 to which negative pressure is being supplied, and performs processing according to the determination result. Because the determination of whether the component has actually been temporarily placed is based on the pressure state of the hole provided in temporary placement surface 71, the determination is performed rapidly compared to a case in which the presence of the component is checked by analyzing an image of temporary placement surface 71 captured from above.

A method of manufacturing an article, including using coordinate measuring machine both to obtain three-dimensional point coordinate measurements of first part of article in place and to position a second part of article in predetermined spatial relationship relative to first part in dependence upon measurements of first part. Predetermined spatial relationship is defined in more than three degrees of freedom. Positioning second part relative to first part includes controlling machine to move second part relative to first part in more than three degrees of freedom. Machine is controlled to hold first and second parts in predetermined spatial relationship while performing an operation to fix both parts in predetermined spatial relationship. Second part is not in direct contact with any other part of article when first and second parts are in predetermined spatial relationship, at least not in a manner which would interfere with or influence or affect predetermined spatial relationship.

A holder including syringe configured to move up and down as the lifting and lowering section moves up and down, a first displacement portion configured to move up and down with respect to the syringe and to which the component holding section is attached, and a second displacement portion provided separately from the first displacement portion and configured to move up and down with respect to the syringe and the first displacement portion. The second displacement portion includes an engaging portion configured to engage the first displacement portion urged downward by the first urging portion in a vertical direction, and a target detection portion coupled to the engaging portion and positioned above the syringe. The contact determination section determines that an electronic component has contacted the circuit board when displacement of the target detection portion is detected with the sensor.

A board work machine includes a board holding portion configured to hold a board, a work head configured to hold a lead component having a lead wire and insert the lead wire into a through-hole formed in the board, a lead wire cutting device configured to cut the lead wire inserted into the board by relatively reciprocally moving a first blade portion and a second blade portion, a distortion sensor configured to detect distortion of at least one of the first blade portion or the second blade portion, and a control device configured to drive the lead wire cutting device to acquire a value from the distortion sensor when the lead wire is not inserted into the board.

A measurement device to automatically measure an electrical characteristic of a component is mounted on a mounter for mounting a component on a circuit board. The measurement device includes a main body, a loading stand on which a component is placed, a pair of measuring elements provided in such a manner as to move towards and away from each other, and a loading stand moving device for moving the loading stand. The loading stand moving device includes a guide rail provided on the main body, and the loading stand is held movably onto the guide rail. This configuration enables an electrical charge stored in a component held onto the loading stand and an electrical charge stored in the loading stand to be removed well by way of the guide rail and the main body. As a result, an electrical characteristic held by the component can be measured stably.