A display device includes a display panel, and an input sensor disposed on the display panel. The input sensor includes a detection electrode in an active area of the input sensor, a signal line connected to the detection electrode, a slave chip connected to the signal line and overlapping a non-active area adjacent to the active area, a master chip overlapping the non-active area, and a plurality of connection lines connecting the master chip and the slave chip so that a sensed signal of the detection electrode is delivered to the master chip through the slave chip.

Disclosed are special component carriers made of MID-capable plastic in order to make the geometric arrangement of electrical components, such as microprocessors, LEDs, sensors, antennas and the like, on a circuit board more flexible. Said component carriers can have a standardized footprint for connecting to the circuit board and can be adapted to the terminals and the geometric arrangement of the components using individually applied conducting tracks, in particular in an LDS process. Furthermore, the specially shaped component carriers allow the electrical components to be geometrically oriented, in particular at a right angle to the circuit board and parallel to the circuit board, which is especially highly advantageous for antennas and acceleration sensors. Furthermore, SMT soldering is made possible in the pre-mounted state even for temperature-sensitive components.

A printed wiring-board island relieves added complexity to a printed circuit board. The printed wiring-board island creates an island form factor in the printed circuit board. Coupling of a semiconductive device package to the printed wiring-board island includes a ball-grid array. The ball-grid array can at least partially penetrate the printed wiring-board island.

An example sensor interposer employing castellated through-vias formed in a PCB includes a planar substrate defining a plurality of castellated through-vias; a first electrical contact formed on the planar substrate and electrically coupled to a first castellated through-via; a second electrical contact formed on the planar substrate and electrically coupled to a second castellated through-via, the second castellated through-via electrically isolated from the first castellated through-via; and a guard trace formed on the planar substrate, the guard trace having a first portion formed on a first surface of the planar substrate and electrically coupling a third castellated through-via to a fourth castellated through-via, the guard trace having a second portion formed on a second surface of the planar substrate and electrically coupling the third castellated through-via to the fourth castellated through-via, the guard trace formed between the first and second electrical contacts to provide electrical isolation between the first and second electrical contacts.

A display device including: a display panel; a first substrate attached to a side of the display panel; and a second substrate attached to a side of the first substrate, wherein the display panel includes a first panel test pad and a second panel test pad, the first substrate includes a 1-1 circuit test lead overlapping and connected to the first panel test pad, a 1-2 circuit test lead overlapping and connected to the second panel test pad, a 2-1 circuit test lead overlapping and connected to the second substrate, a 1-1 test lead line connected to the 1-1 circuit test lead, a 1-2 test lead line connected to the 1-2 circuit test lead, and a first test lead line connected to the 2-1 circuit test lead, and the 1-1 test lead line and the 1-2 test lead line are connected to the first test lead line.

A wiring board includes an insulating substrate including a first surface and a mounting portion for an electronic component on the first surface, the insulating substrate having a rectangular shape in a plan view of the first surface; a via conductor located inside the insulating substrate and at a corner portion of the insulating substrate in a plane perspective, and extending in a thickness direction of the insulating substrate; a wiring conductor located on the first surface and connecting the mounting portion and the via conductor to each other; and a heat dissipation portion located inside the insulating substrate at a position overlapping the mounting portion in a plane perspective view, wherein the first surface includes, between the heat dissipation portion and the via conductor in a plane perspective view, a first region surrounded by the wiring conductor in a plan view.

A multilayer ceramic capacitor includes an interposer including, on a side in a length direction, a first through conductive portion that penetrates the interposer in a stacking direction, and provides electrical conduction between a first joining electrode and a first mounting electrode. The interposer includes, on the other side in the length direction, a second through conductive portion that penetrates the interposer in the stacking direction, and provides electrical conduction between a second joining electrode and a second mounting electrode. The first mounting electrode includes a first portion that covers a portion of a first interposer end surface on the one side in the length direction of the interposer. The second mounting electrode includes a second portion that covers a portion of a second interposer end surface on the other side in the length direction of the interposer.

An electronic board assembly comprises a board comprising an electronic component and a connector mounted to the board and electrically connected to the electronic component. The connector is configured to receive an electronic card assembly, and the connector comprises an electrical contact and a friction contact. The electrical contact is configured to exert a first amount of force on the electronic card assembly when the electronic card assembly is being seated in the connector. The friction contact is configured to exert a second amount of force on the electronic card assembly when the electronic card assembly is being seated in the connector. The second amount of force is greater than the first amount of force.

A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.

A printed circuit board assembly and a terminal are provided. The printed circuit board assembly includes: a first printed circuit board and a second printed circuit board, where the second printed circuit board is electrically connected to the first printed circuit board through at least four solder joints; the at least four solder joints include a first solder joint, a second solder joint, a third solder joint, and a fourth solder joint, the first solder joint communicates with the second solder joint, the third solder joint communicates with the fourth solder joint, and at least one solder joint and/or at least one printed circuit board cavity is provided between the second solder joint and the third solder joint; and the printed circuit board cavity is a recess structure that is recessed inwards from a surface of the printed circuit board.