An interface card assembly adapted for fixing an M.2 interface card to a circuit board body with an M.2 connector is provided. The M.2 interface card includes a connecting end and an end. The interface card assembly includes a heat dissipation plate and a fastener. The heat dissipation plate is disposed at a position adjacent to the M.2 connector, and the heat dissipation plate includes a hole. The fastener is detachably disposed in the hole. The fastener includes a main body and a cantilever, and a clamping part is disposed between the main body and the cantilever. When the M.2 interface card is inserted into the M.2 connector through the connecting end, the fastener moves relative to the heat dissipation plate at the end, so that the M.2 interface card extends into the clamping part and is clamped between the main body and the cantilever.

A capsule core and a capsule endoscope are provided. The capsule core includes a printed circuit board module, connecting structures and functional units. The printed circuit board module includes more than more printed circuit boards connected through flexible circuit boards and spaced apart. The connecting structures connect adjacent printed circuit boards. The functional units are mounted on the printed circuit boards or the connecting structures, and at least part of the functional units communicates with the printed circuit boards.

A power semiconductor component is specified, having a power semiconductor device arranged within a housing, wherein a heat sink is exposed on a first surface of the housing; a wiring substrate which receives the housing with the power semiconductor device and which has a first main surface and a second main surface. A heat dissipation region with increased thermal conductivity is arranged on the second main surface. The housing is arranged on the wiring substrate in such a way that the heat sink is connected to the heat dissipation region via a solder layer. A number of spacers which are arranged between the heat sink and the heat dissipation region are embedded in the solder layer. Furthermore, a method for producing a power semiconductor component is specified.

A circuit board assembly is provided and includes a first circuit board, a second circuit board and a first connecting module. The first connecting module includes a first connecting wire, a first connector and a second connector. The first circuit board includes a first processor, and the second circuit board includes a second processor. One end of the first connector is connected to one end of the first connecting wire, and the other end of the first connector is connected to the first circuit board. One end of the second connector is connected to the other end of the first connecting wire, and the other end of the second connector is connected to the second circuit board. The first connector is adjacent to the first processor, and the second connector is adjacent to the second processor.

A soldering component and a method of fitting it to boards are introduced. The soldering component includes a body and a fitting portion. The fitting portion is fitted to an object. The body has an engaging portion with an elastic retraction space conducive to elastic retraction of two or more engagement portions, allowing the engagement portions to engage with another object. The soldering component has a weldable surface to be soldered to a weldable surface of the object. The weldable surface of the object has a built-in solder layer adapted to be heated for soldering the soldering component and the weldable surface of the object together. The soldering component is disposed in a carrier, taken out with a tool, compared with the object by a comparison device to determine a fitting position on the object, positioned at the fitting position with the tool, thereby being fitted to the object.

A camera module includes an imaging sensor, a light emitter, and a circuit board. The circuit board includes first and second rigid printed wiring boards. A surface of the first rigid printed wiring board on which the imaging sensor is mounted has a holder which is configured to hold the second rigid printed wiring board in a state in which a surface of the second rigid printed wiring board on which the light emitter is mounted and the surface on which the imaging sensor is mounted face the same direction. The holder is arranged at a position which is different from the imaging sensor, and holds the second rigid printed wiring board at a height higher than the surface of the first rigid printed wiring board.

A printing device includes a frame, and an electronic circuit-board unit attached to the frame. The electronic circuit-board unit includes: a holder including a holding portion; a first substrate held to a first surface of the holder; a second substrate held to a second surface of the holder and attached to the frame; an electronic component; and a harness electrically connected to the electronic component. The holder has: a first region overlapped with the first substrate in a plan view; and a second region offset from the first region in the plan view. At least one of the electronic component and the harness is held by the holding portion.

A circuit board mounting support for supporting a first electronic circuit integration includes a bearing member. The first electronic circuit integration includes a circuit board, an electronic component engaged with a first surface of the circuit board, and multiple legs for engaging with the bearing member. The circuit board has a mounting area for mounting the electronic component and a second surface opposite to the first surface. The bearing member includes a groove and an engaging portion connected to a peripheral edge of the groove. A corresponding area is defined on the bearing member and corresponds to the mounting area of the circuit board. When the bearing member is engaged with the circuit board, an opening of the groove and the engaging portion face the second surface. A junction that each of the legs is engaged with the bearing member is located out of the corresponding area.

In general, the subject matter described in this disclosure can be embodied in methods, systems, and program products for receiving an indication that a vehicle has begun accelerating from a stationary state. A computing system sets, in response to having received the indication that the vehicle has begun accelerating from the stationary state, an orientation value generated using a gyroscope to a default orientation value. The computing system repeatedly updates the orientation value generated using the gyroscope, based on changes in gyroscope orientation that occurred after the computing system set the orientation value to the default orientation value. The computing system determines that the updated orientation value satisfies criteria that indicates that the vehicle is likely to encounter or has encountered a dangerous situation. The computing system outputs a signal to cause the vehicle to employ a safety measure.

3D electrical integration is provided by connecting several component carriers to a single substrate using contacts at the edges of the component carriers making contact to a 2D contact array (e.g., a ball grid array or the like) on the substrate. The resulting integration of components on the component carriers is 3D, thereby providing much higher integration density than in 2D approaches.