Embodiments disclosed herein include a printed circuit board (PCB). In an embodiment, the PCB comprises a substrate with a first surface and a second surface opposite from the first surface. In an embodiment, a first slot is through a thickness of the substrate, and a second slot is through the thickness of the substrate, where the first slot is parallel to the second slot. In an embodiment, a metal plate is provided on the PCB. In an embodiment the metal plate comprises a first portion over the first surface of the substrate between the first slot and the second slot, a second portion connected to the first portion, wherein the second portion is in the first slot, and a third portion connected to the first portion, wherein the third portion is in the second slot.

A method for producing a camera module having a first part, preferably a housing part, and a second part, preferably a circuit board or a cover part, in which the two parts are connected in positive locking fashion. The positive lock is produced in that a connecting element connected to the first part in the form of a tongue, sleeve or a pin is guided through an opening of the second part, the first part is brought to abut on the second part and subsequently the end of the connecting element protruding beyond the second part is curled in a deforming process so that the curled end abuts on the second part in a pretensioned manner. A camera module is also described.

Proposed are an anodic aluminum oxide mold made of an anodic aluminum oxide film, a manufacturing method thereof, a half-finished probe product, a manufacturing method thereof, a probe card, and a manufacturing method thereof.

A system is provided for installing a heatsink onto a circuit board. The heatsink has a base, a first hook and a second hook. The system includes a heatsink holder, a circuit board arm, a heatsink pusher, and a hook pusher. The heatsink holder is operable to receive the heatsink. The circuit board arm is operable to move the circuit board onto the heatsink received on the heatsink holder such that the bottom surface of the heatsink is adjacent to the circuit board. The heatsink pusher is operable to move the heatsink holder in a first direction so as to move the first hook relative to the first catch. The hook pusher is operable to push the first hook in a direction normal to the base from the top surface to the bottom surface.

The present disclosure provides systems for applying a compression load on at least part of an application specific integrated circuit (“ASIC”) ball grid array (“BGA”) package during the rework or secondary reflow process. The compression-loading assembly may include a top plate and a compression plate. The compression plate may exert a compression load on at least part of the ASIC using one or more compression mechanisms. The compression mechanisms may each include a bolt and a spring. The bolt may releasably couple the top plate to the compression plate and allow for adjustments to the compression load. The spring may be positioned on the bolt between the top plate and the compression plate and, therefore, may exert a force in a direction away from the top plate and toward the compression plate. The compression load may retain the solder joint and may prevent the solder separation defect during the reflow process.

The invention relates to a thermode for connecting at least two components, comprising a tip having a body portion with at least two contact surface portions connected to and spaced apart from one another by a recess configured to receive a portion of one of the at least two components; and a support portion having at least one supporting surface portion configured to support a further component (being the other of the at least two components, wherein the contact surface portions and the supporting surface portion are configured to receive the at least two components between them and wherein one or both of the contact surface portions and the supporting surface portion are moveable relative to and towards one another to exert heat and/or pressure on the at least two components located between the contact surface portions and the supporting portion.

A manufacturing method of a display device includes: loading, on a stage, a panel assembly including: a display panel drivable to display an image, and first and second printed circuit boards attached to the display panel, end portions of the first and second printed circuit boards overlapping each other; providing a jet of air to the overlapping end portion of the second printed circuit board to raise the overlapping end portion away from and expose the end portion of the first printed circuit board; fixing the raised end portion away from the exposed end portion of the first printed circuit board; pre-processing the exposed end portion of the first printed circuit board; and aligning a distal end of the pre-processed end portion of the first printed circuit board and a distal end of the end portion of the second printed circuit board.

A manufacturing method of a display device includes: loading, on a stage, a panel assembly including: a display panel drivable to display an image, and first and second printed circuit boards attached to the display panel, end portions of the first and second printed circuit boards overlapping each other; providing a jet of air to the overlapping end portion of the second printed circuit board to raise the overlapping end portion away from and expose the end portion of the first printed circuit board; fixing the raised end portion away from the exposed end portion of the first printed circuit board; pre-processing the exposed end portion of the first printed circuit board; and aligning a distal end of the pre-processed end portion of the first printed circuit board and a distal end of the end portion of the second printed circuit board.

The disclosure provides a portable light. The portable light includes a housing having a front surface, a rear surface, and an internal space for receiving electronic components and a battery. The portable light also includes a chip-on-board (COB) assembly. The COB assembly includes a substrate, a matrix of individual light emitting diode (LED) chips mounted to the substrate, and an outer coating covering the matrix of LED chips. The front surface of the housing is curved in one direction and the COB assembly is correspondingly curved and mounted to the front surface, such that individual LED chips are positioned about the curve and orientated to direct light outwardly about the curve to provide a collective beam angle greater than 220 degrees. The portable light further includes a front lens cover to protect the COB assembly.

A method for transferring a micro device on a curved surface according to an exemplary embodiment of the present invention includes: coating an adhesive layer on an external circumferential surface of a tube; providing a micro device pattern on one side of a substrate; positioning an external circumferential surface of the tube to contact the substrate and allow a length direction of the device pattern to cross a radius direction of the tube, and rotating the tube with respect to an axis-direction of the tube and simultaneously moving at least one of the tube and the substrate in a rectilinear way to transfer the micro device pattern on the substrate to the adhesive layer; and fixing the transferred micro device pattern to the adhesive layer by curing the adhesive layer.