A module-embedded multilayer circuit board includes an inner circuit board, component embedded module embedded in the through opening, a first outer circuit board, and a second outer circuit board. A through opening is defined in the inner circuit board. The component embedded module includes a top surface and side surfaces. The top surface has a length greater than that of the two side surfaces. Each component embedded module includes a component, upper circuit patterns formed on the top surface, and side circuit patterns formed on the side surface and exposed from the through opening. The first and the second outer circuit board are formed on the inner circuit board. One end of the side circuit patterns is electrically connected to the first and the second outer circuit board, the other end of the side circuit patterns is electrically connected to the component by the upper circuit patterns, respectively.

A method of running a printed circuit board (PCB) trace on a PCB. The PCB comprising a plurality of PCB layers. The method comprising forming a conductive trace on at least one of the plurality of PCB layers; coupling a first portion of the conductive trace to a capacitor formed on at least one of the plurality of PCB layers; coupling a second portion, different from the first portion, of the conductive trace to a conductive material formed within a first via extending through two or more of the plurality of PCB layers; and configurably setting a length of a conductive path of the conductive trace according to a predetermined impedance. The capacitor is separated laterally in a plan view at a first distance from the first via. The length of the conductive trace in the plan view is greater than the first distance. The conductive path of the conductive trace of the length has the predetermined impedance.

First, a router (400) is rotated about a shaft (406) to cause a tip end (402) of the router (400) to move in a vertical direction with respect to a conductive layer (130) while being in contact with the conductive layer (130). In this way, the router (400) is inserted into the conductive layer (130) to form an opening in the conductive layer (130). Next, the router (400) is rotated about the shaft (406) to cause a side surface (404) of the router (400) to move in a horizontal direction with respect to the conductive layer (130) while being contact with the conductive layer (130). In this way, the conductive layer (130) is formed into a conductive pattern (132).

In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.

A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.

An LED circuit board structure includes first color LEDs, second color LEDs, third color LEDs, a carrier board, first testing wires, first connecting wires, second testing wires and second connecting wires. Each of the first testing wire is located at the carrier board and electrically connects two first color LEDs in a pixel-front-side-pattern region in parallel. The first connecting wire electrically connects two first testing wires in adjacent two pixel-front-side-pattern regions. Each of the second testing wire is located at the carrier board and electrically connects two second color LEDs in a pixel-front-side-pattern region in parallel. The second connecting wire electrically connects two second testing wires in adjacent two pixel-front-side-pattern regions.

An electronic device module may include: a board; a ground electrode disposed on a first surface of the board; a sealing portion disposed on the first surface of the board; electronic devices mounted on the first surface of the board such that at least one of the electronic devices is embedded in the sealing portion; a first shielding wall connected to the ground electrode and disposed along a side surface of the sealing portion; and a shielding layer formed of a conductive material and disposed along a surface formed by the sealing portion and the first shielding wall.

An electronic arrangement (100) and a method of manufacturing an electronic arrangement are provided. The electronic arrangement comprises an array of electronic components (110) arranged along a first axis, A, and a carrier (120) arranged to support the array of electronic components, wherein the carrier comprises, a first metal layer (130), a second metal layer (140), and an at least partially insulating layer (150) arranged between the first and second metal layers. The electronic arrangement further comprises a partition portion (160) arranged between two adjacently arranged electronic components for partitioning the electronic arrangement, wherein the second metal layer comprises a void (180) intersected by the second axis, wherein the void has a width (190) which extends parallel to the first axis, such that, at the second axis, the second metal layer is undercut with respect to the first metal layer, in a direction parallel to the first axis.

In one embodiment, a motherboard to be cut, includes: a motherboard body provided, on a surface thereof, with a cutting line comprising a special-shaped cutting line section, wherein, a plurality of positional marker groups are provided on a portion of the surface where the special-shaped cutting line section is provided; each positional marker group includes a first marker assembly and a second marker assembly provided at both sides of the special-shaped cutting line section; and, in the arrangement direction of the first marker assembly and the second marker assembly, size of the first marker assembly is not less than tolerance size of a side of the special-shaped cutting line section where the first marker assembly is in, and size of the second marker assembly is not less than tolerance size of a side of the special-shaped cutting line section where the second marker assembly is in.

In one embodiment, an electronic assembly includes a flexible circuit board formed into a curved shape that is configured to be substantially concentric with a viewer's eye. The electronic assembly further includes a plurality of facets coupled to a side of curved shape of the flexible circuit board that is configured to face the viewer's eye. Each facet has a planar face, one or more emitters configured to emit light towards the viewer's eye, and one or more receptors configured to detect the emitted light after it has been reflected back towards the electronic assembly from a retina of the viewer's eye. Each face is normal to a line pointing towards a center area of the viewer's eye when the curved shape is substantially concentric with the viewer's eye. Each facet is individually addressable such that the plurality of facets are configurable to detect a center of gaze of the viewer.