A method for milling flex foil includes providing a web (14) of flex foil including a substrate; a first conductive layer arranged on one surface of the substrate; a second conductive layer arranged on an opposite surface of the substrate; a first insulating layer arranged adjacent to the first conductive layer; and a second insulating layer arranged adjacent to the second conductive layer. The method includes dry milling one side of the web using a milling wheel (20-1) and a first cliche pattern (25-1) (including a rotating drum (24-1) and a flexible substrate (26-1)) including raised portions and non-raised portions to selectively remove at least one of the first conductive layer and the first insulating layer. The method includes dry milling an opposite side of the web using a milling wheel (20-2) and a second cliche pattern (25-2) including upper raised portions, lower raised portions and non-raised portions to selectively remove the second insulating layer.

The present invention relates to a light source support of an automotive vehicle. The light source support comprises: a first non-flexible part adapted to be mounted with a plurality of first electronic components; and a second non-flexible part adapted to be mounted with a plurality of second electronic components. The light source support further comprises a flexible arm adapted to join the first non-flexible part and the second non-flexible part to form the light source support, which is twistable and rotatable. The first non-flexible part and the second non-flexible part are joined in a non-axial manner by the flexible arm such that a longitudinal axis of the first non-flexible part is not parallel to a longitudinal axis of the second non-flexible part when the first non-flexible part is joined with the second non-flexible part.

A printed circuit board for an electric component contains an electrically insulating substrate which has a surface and at least one electrically conductive conductor track formed within the substrate. The surface of the substrate has a sealing region which is arranged and/or configured such that the sealing region is flat and/or the substrate has a homogenous substrate thickness in the sealing region. An overmolding which adjoins the sealing region is arranged on the surface of the substrate.

A method for forming a thermal and electrical path in a PCB may include forming a first removable layer over a top surface of a PCB and a second removable layer over a bottom surface of the PCB. The method may also include milling or laser drilling the PCB from the top surface to form a first cavity extending into the PCB, plating the first side panel plating the first side with a second metal to partially fill the first cavity; and milling or laser drilling from the bottom surface to form a second cavity extending into the PCB, the first cavity in a thermal communication and/or an electrical communication with the second cavity. The method may also include panel plating the first side with a second metal to fill the first cavity and the second side with the second metal to fill the second cavity, and removing the first and second removable layers from the PCB to form the PCB with a thermal and/or an electrical path comprising the first cavity and the second cavity filled with the second metal.

A method for manufacturing a dual conductor laminated substrate includes providing a first laminate including a first insulating layer and a first conductive layer; defining a first trace pattern including one or more traces in the first laminate; providing a second laminate including a second insulating layer and a second conductive layer; defining a second trace pattern including one or more traces in the second laminate; defining access holes in the second insulating layer; at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer; and aligning and attaching the first laminate to the second laminate to create a laminated substrate.

A printed circuit board with a lateral metallization groove and a processing method thereof, relates to the field of printed circuit boards with lateral metallization grooves, processing technologies thereof and batch processing methods. The processing method includes the following steps: step S01, drilling and milling grooves; step S02, performing metallization treatment; step S03, laying an outer layer circuit; step S04, performing pattern plating; step S05, performing first milling grooves; step S06, etching an outer layer; step S07, performing surface treatment after performing solder resist printing and character printing; step S08, forming to mill off connections of a processing side; step S09, performing second milling grooves to form a through groove. The present disclosure can implement: a long side of the printed circuit board can be directly connected with the ground wire rather than independently installing the ground wire; a small space is occupied and conveniently replacement.

Systems and methods for bonding an electronic component to substrate with a rough surface. The method comprising: disposing an insulating adhesive on the substrate; applying heat and pressure to the insulating adhesive to cause the adhesive to flow into at least one opening formed in the substrate; curing the insulating adhesive to form a pad that is at least partially embedded in the substrate and comprises a planar smooth surface that is exposed; disposing at least one trace on the planar smooth surface of the pad; depositing an anisotropic conductive material on the pad so as to at least cover the at least one trace; placing the electronic component on the pad so that an electrical coupling is formed between the electronic component and the at least one trace; and bonding the electronic component to the substrate by curing the anisotropic conductive material.

A carrier substrate (1) that includes an insulation layer (11) and a metal layer (12), wherein a flank profile (2), in particular an etching flank profile, at least zonally borders the metal layer (12) in a primary direction (P) extending parallel to the main extension plane (HSE), wherein, viewed in the primary direction (P), the flank profile (2) extends from a first edge (15) on an upper side (31) of the metal layer (12), which faces away from the insulation layer (11), to a second edge (16) on a lower side (32) of the metal layer (12), which faces the insulation layer (11), characterized in that the flank profile (2), viewed in the primary direction (P), has at least one local maximum (21) and at least one local minimum (22).

The method for manufacturing a number of electrical nodes, wherein the method includes providing a number of electronic circuits onto a first substrate, such as on a printed circuit board or other electronics substrate, optionally, a low-temperature co-fired ceramic substrate, wherein each one of the electronic circuits includes a circuit pattern and at least one electronics component in connection with the circuit pattern, wherein the electronic circuits are spaced from each other on the first substrate, thereby defining a blank area surrounding each one of the number of electronic circuits, respectively, and providing potting or casting material to embed each one of the number of electronic circuits in the potting or casting material, and, subsequently, hardening, optionally including curing, the potting or casting material to form a filler material layer of the number of electrical nodes.

A circuit carrier includes a first side, two layers arranged to define an intermediate space there between, with at least one of the two layers being electrically conductive and attached to the first side. The at least one of the two layers has a region deformed such as to exhibit an indentation and has a trace structure in the indentation. A first insulating material fills the intermediate space, and a second insulating material fills the indentation, A second side in opposition to the first side is shaped to have in the deformed region a cut-out for receiving a bare die such as to come into an electrical contact with the at least one of the two layers.