A wireless power supply wiring circuit board includes a first insulating layer, a conductive layer that is on one surface in the thickness direction of the first insulating layer and includes a wiring portion, a transceiver circuit portion that is electrically connected to the wiring portion, a component mounting portion which is on the other surface in the thickness direction of the first insulating layer and on which an electronic component electrically connected to the wiring portion is mounted, and a metal dam portion provided around at least part of the component mounting portion.

Systems, methods, and devices related to catalyzed metal foils are disclosed. Contemplated metal foils have a bottom surface, preferably roughened to Ra of at least 0.1 μm, bearing a catalyst material. The metal foils are etchable, typically of aluminum or derivative thereof, and is less than 500 μm thick. Methods and systems for forming circuits from catalyzed metal foils are also disclosed. The catalyst material bearing surface of the metal foil is applied to a substrate and laminated, in some embodiments with a thermoset resin or thermoplastic resin therebetween or an organic material first coating the catalytic material. The metal foil is removed to expose the catalyst material, and a conductor is plated to the catalyst material.

Provide are a method for manufacturing a wiring board or a wiring board material, and the wiring board obtained by the method, which allows columnar metal members to be inserted into the wiring board at once using a simple operation, enables alignment without requiring strict accuracy, can handle columnar metal members having different shapes, and imparts sufficiently high adhesive strength to the columnar metal members.

The method includes the steps of: laminating a laminate material LM including the support sheet 10 having the columnar metal members 14 formed thereon, a wiring board WB or a wiring board material WB′ having a plurality of openings in portions corresponding to the columnar metal members 14, and a prepreg 16′ having a plurality of openings in portions corresponding to the columnar metal members 14 and containing a thermosetting resin such that the columnar metal members 14 are positioned in the respective openings; integrating the laminate material LM by heating and pressing to obtain a laminate LB including a thermosetting resin filled between an inner surface of each of the openings of the wiring board WB or the wiring board material WB′ and each of the columnar metal members 14; and peeling at least the support sheet 14 from the laminate LB.

A substrate structure includes a metal substrate, an insulating material, at least one first dielectric layer, and at least one first patterned circuit layer. The metal substrate has a first surface and a second surface opposite to each other and multiple through holes penetrating the metal substrate and connecting the first surface and the second surface. The insulating material fills the through holes and is aligned with the first surface and the second surface. The first dielectric layer is disposed on the first surface and the insulating material, and has multiple first openings. The first openings partially expose the metal substrate. The material of the first dielectric layer includes aluminum nitride or silicon carbide. The first patterned circuit layer is disposed on the first dielectric layer, fills the first openings, and connected to the metal substrate. The first patterned circuit layer partially exposes the first dielectric layer.

Aspects of the embodiments are directed to a printed circuit board (PCB) that includes a conductive layer extending from the printed circuit board to act as a heat sink for circuit components electrically and mechanically attached to the PCB. The conductive layer can be a copper ground layer of a multi-layered PCB. The PCB can include one or more circuit components, such as dynamic random access memory elements. In embodiments, the PCB is part of a dual inline memory module. The conductive layer can be fashioned such that it extends out from the PCB and returns over the circuit elements to define an air gap between the conductive layer and the surface of the PCB and/or the surface of the circuit elements. In embodiments, a connection adaptor can be used to accommodate various PCB thicknesses so that the PCB can be electrically connected to an edge connector.

A MEMS microphone device greatly reduced in size includes a metallic substrate, a printed circuit including an audio sensor, and a processing chip. The metallic substrate includes a first bent portion and a second bent portion. The printed circuit is directly formed by thick film printing on the metal substrate which is then punched and shaped into the first and second bent portions. The audio sensor receives sounds and functions as a microphone. The processing chip is coupled to the printed circuit and processes the electrical signal. A method for manufacturing such microphone device is also disclosed.

A method of manufacturing a curved-surface metal line is provided. A three-dimensional structure is formed with a metal member and then fixed together with an insulator. Alternatively, the metal member and the insulator are embedded-formed to jointly form the three-dimensional structure, or the metal member and the insulator are fixed together and then jointly form the three-dimensional structure. Then, a photoresist protection layer is formed outside the metal member, and a selective exposure treatment is performed such that corresponding locations of the photoresist protection layer being exposed is subject to a photochemical reaction. The photoresist protection layer is developed, and after the photoresist protection layer is partially dissolved, portions of the metal member at the corresponding locations are simultaneously exposed. The exposed portions of the metal member are etched, and residual portions of the photoresist protection layer are removed to form the metal line provided on the insulator.

A circuit board includes: a metal core base material including a first main surface, a second main surface on an opposite side of the first main surface, a side surface, and a projection that projects from the side surface; an outer cover including a first insulation layer that covers the first main surface, a second insulation layer that covers the second main surface, and a third insulation layer that covers the side surface; a first wiring layer provided in the first main surface with the first insulation layer interposed between the first wiring layer and the first main surface; a second wiring layer provided in the second main surface with the second insulation layer interposed between the second wiring layer and the second main surface; and a sealing portion that is made of an insulation material embedded in the outer cover and covers an end surface of the projection.

Systems, methods, and devices related to catalyzed metal foils are disclosed. Contemplated metal foils have a bottom surface, preferably roughened to Ra of at least 0.1 m, bearing a catalyst material. The metal foils are etchable, typically of aluminum or derivative thereof, and is less than 500 m thick. Methods and systems for forming circuits from catalyzed metal foils are also disclosed. The catalyst material bearing surface of the metal foil is applied to a substrate and laminated, in some embodiments with a thermoset resin or thermoplastic resin therebetween or an organic material first coating the catalytic material. The metal foil is removed to expose the catalyst material, and a conductor is plated to the catalyst material.

A method for manufacturing a high-current printed circuit board, comprising: providing a circuit substrate comprising a substrate layer; a first circuit layer formed on the substrate layer; and a second circuit layer formed on the substrate layer and facing away from the first circuit layer, wherein first conductive circuits are defined on the first circuit layer, second conductive circuits are defined on the second circuit layer, and a line width of each of the first conductive circuits is greater than a line width of each of the second conductive circuits; and forming buffering circuits by plating, wherein the buffering circuits are electrically connected the first circuit layer to the second circuit layer; wherein a line width of each of the buffering circuits is greater than the line width of each of the second conductive circuits.