An electrical connector is provided. The electrical connector is connected to the counterpart electrical connector. The electrical connector includes: an insulating housing having an annular portion; a first elastic member provided to the annular portion; and a second elastic member provided to the annular portion, wherein the first elastic member has a first region exposed on an inner surface of the annular portion and configured to contact a first member of the counterpart electrical connector, the second elastic member has a second region exposed on an outer surface of the annular portion and configured to contact a second member of the counterpart electrical connector, and the first elastic member and the first member are electrical contacts and/or the second elastic member and the second member are electrical contacts.

The present disclosure relates to a method of manufacturing a layer structure for a component carrier. According to the method, a carrier layer is provided. An imprint resist layer is added onto the carrier layer and predefined structures forming at least one recess are stamped into the imprint resist layer by a predefined stamp. The recess defines a filling structure in or on the carrier layer. In the filling structure at least one of an electrically insulating material and an electrically conductive material is filled.

An object of the present invention is to provide an anisotropic conductive member capable of achieving excellent conduction reliability and a multilayer wiring substrate using the same. The anisotropic conductive member of the present invention includes an insulating base which is made of an inorganic material, a plurality of conductive paths which are made of a conductive member, penetrate the insulating base in a thickness direction thereof and are provided in a mutually insulated state, and a pressure sensitive adhesive layer which is provided on a surface of the insulating base, in which each of the conductive paths has a protrusion which protrudes from the surface of the insulating base, and an end of the protrusion of each of the conductive paths is exposed or protrudes from the surface of the pressure sensitive adhesive layer.

The invention relates to a method in which a layer compound having a substrate having an adhesive layer applied thereon at least in regions is provided. An opening extending through the substrate and through the adhesive layer is introduced therein in order to obtain a patterned layer compound. A microchip having an active region arranged on the outside of the chip is provided, wherein the active region is a sensor area or a radiation coupling-out area. In addition, in accordance with the invention, the microchip is arranged on the adhesive layer of the patterned layer compound such that the active region is exposed through the opening.

A printable component includes a component substrate and one or more electrical conductors. One or more electrically conductive connection posts protrudes from the component substrate to form an exposed electrical contact. Each connection post is electrically connected to at least one of the electrical conductors and one or more wicking posts protrude from the component substrate. The wicking post can be insulating. In certain embodiments, a printable component source wafer comprises a source wafer, a plurality of sacrificial portions separated by anchor portions formed in a sacrificial layer of the source wafer, and a plurality of printable components. Each printable component is disposed over a corresponding sacrificial portion and connected to an anchor portion by a tether. A destination substrate structure comprises a destination substrate having one or more electrically conductive contact pads, an adhesive layer disposed on the destination substrate, and one or more printable components.

A process makes electrical connections between electrical wires and flexible conductive elements, such as conductive fabrics. The process makes strong electrical connections that are mechanically flexible and can simultaneously create multiple electrical connections. The process involves creating an assembly that includes at least a TPE layer, an electrical wire, an insulating layer, and a flexible conductive element, and applying heat and pressure to the assembly. For example, a conductive fabric is disposed on an insulating layer, a wire is positioned onto a surface of the insulating layer, and a TPE layer is disposed over the wire and overlaps the conductive fabric element. When applying the heat and pressure, the wire melts through the insulating layer to make electrical contact with the conductive fabric element, and the TPE layer conforms to an exterior of the wire and bonds to the insulating layer.

Method of producing a device comprising at least two distinct components that are interconnected by interconnecting wires, and device thereby obtained. The invention relates to a method of producing a device having at least two distinct components which are interconnected on a substrate by at least one interconnecting wire. The method includes the following steps: creating the interconnecting wire by depositing individual wires on the substrate in a predefined interconnecting pattern, the wire comprising at least one terminal connection portion which is exposed on the substrate, bringing at least one contact of a component to face the terminal portion and connecting the contact to this terminal portion. The invention also relates to the device thereby obtained and to a multi-component product comprising same.

A substrate for mounting a semiconductor device includes an insulating layer having first and second opposed surfaces defining a thickness. First and second electrically conductive lands are included in the insulating layer. The first electrically conductive lands extend through the whole thickness of the insulating layer and are exposed on both the first and second opposed surfaces. The second electrically conductive lands have a thickness less than the thickness of the insulating layer and are exposed only at the first surface. Electrically conductive lines at the first surface of the insulating layer couple certain ones of the first electrically conductive lands with certain ones of the second electrically conductive lands. The semiconductor device is mounted to the first surface of the insulating layer. Wire bonding may be used to electrically coupling the semiconductor device to certain ones of the first and second lands.

An object of the present invention is to provide an anisotropic conductive member capable of achieving excellent conduction reliability and a multilayer wiring substrate using the same. The anisotropic conductive member of the present invention includes an insulating base which is made of an inorganic material, a plurality of conductive paths which are made of a conductive member, penetrate the insulating base in a thickness direction thereof and are provided in a mutually insulated state, and a pressure sensitive adhesive layer which is provided on a surface of the insulating base, in which each of the conductive paths has a protrusion which protrudes from the surface of the insulating base, and an end of the protrusion of each of the conductive paths is exposed or protrudes from the surface of the pressure sensitive adhesive layer.

The present invention discloses an electromagnetic wave shielding film, comprising at least one electromagnetic shielding layer. A printed circuit board comprising the shielding film, is formed by tightly connecting the electromagnetic wave shielding film with the printed circuit board in the direction of thickness, wherein a ground layer is disposed on said printed circuit board. A method for producing the circuit board, including the following steps: (1) hot-pressing and curing the electromagnetic shielding film with the circuit board in the direction of thickness; (2) piercing the adhesive film layer by a rough surface of the electromagnetic shielding layer, to achieve grounding. Or, including the following steps: (1) hot-pressing and curing the electromagnetic shielding film with the circuit board in the direction of thickness; (2) piercing the shielding film by an electrically conductive substance, to achieve grounding. Or, including the following steps: (1) hot-pressing and curing the electromagnetic shielding film with the circuit board in the direction of thickness; (2) forming through holes or blind holes in the circuit board; (3) metallizing the holes, to achieve grounding. The adhesive film layer of the shielding film of the present invention contains no conductive particle, so that the cost and the insertion loss are reduced, and the development demand of high-speed and high-frequency of the electronic products is met.