A connector including a biodegradable base material and a biodegradable binder material, comprising at least one of a protein and a residue, configured to hold together the base material to form a biodegradable connector element. The biodegradable connector element affects an operational condition of an apparatus the biodegradable connector element is used within. Degradation of at least one of the biodegradable base material, the biodegradable binder, and the biodegradable connector element provides for a limited operational lifespan of the apparatus resulting in the apparatus becoming inoperable. A system is also disclosed.

A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a film, wherein the conductive circuit is made of a conductive metal layer, the conductive metal layer is a metal foil and the conductive metal layer is patterned to form the conductive circuit. Then, an electronic element is disposed on the conductive circuit of the film, and the electronic element is electrically connected to the conductive circuit. Then, the film and a supporting structure are combined by an out-mold forming technology or an in-mold forming technology, such that the electronic element is wrapped between the film and the supporting structure.

Processes for recycling printed wire boards using environmentally-friendly compositions, wherein electronic components, precious metals and base metals may be collected for reuse and recycling.

An object of the present technology is to provide a copper clad laminate including a resin substrate that has biodegradability and less likely to warp or crack. The present technology provides a copper clad laminate including: a resin substrate; an adhesive layer; and a copper foil layer, the adhesive layer and the copper foil layer being stacked in this order on at least one side of the resin substrate, the resin substrate containing at least 50 mass % or more of polylactic acid, the degree of crystallization of the polylactic acid calculated on a basis of a result of differential scanning calorimetry being 29% or more and 36% or less, a crystallite size of the polylactic acid calculated on a basis of a result of X-ray diffraction measurement being 19 nm or more and 26 nm or less. Further, the present technology provides a printed wiring board formed using the copper clad laminate.

Systems and methods of the invention generally relate to altering the functionality of a non-transient electronic device. A container holding an agent is located proximal to a non-transient electronic device capable of performing at least one function. The agent is capable of rendering the device incapable of performing the at least one function. The container is configured to controllably release the agent to the electronic device in a variety of passive and active eventualities.

A composite element and methods of fabrication thereof are provided. The composite element can include a binder material and one or more electrical traces supported by the binder material, where a composition of the binder material is a thermoresponsive material and where each of the one or more electrical traces comprises an interconnected network of nanoparticles.

A workstation for disassembling a control panel having a first side and a second side is disclosed. The workstation may include a fixture mounted to the workstation that receives the control panel to be disassembled. The workstation may further include at least two wedging tools that enter the control panel at two locations between the first and second sides of the control panel. In addition, the workstation may include at least two driving members that engage and edge of the first side at two locations and apply a force to the edge sufficient to separate the first side from the second side.

A modular display or modular camera that is an integrated portion of a mobile phone hardware of a mobile phone can be selected. The modular display/camera component includes a connector having pin-outs that permit data transfer. Traces electronically connect the pin-outs to other electronics of modular display/camera. The modular display/camera when integrated to the logic board is coupled to the logic board by coupling the connector to a matching socket of the logic board. The modular display/camera can be manually removing from the logic board and can be physically mated to a different matching socket within a different device. Thus, the modular display/camera of the mobile phone can be repurposed/reused/recycled for the different device.

An electronic device is described that is designed to be more easily recycled at its end of life while maintaining usability during its lifetime. The electronic device includes a first substrate, an encapsulation layer, and a set of electronics disposed there between. One or more delamination layers cover at least one side, preferably both sides, of the set of electronics to separate the set of electronics from at least one, preferably both, of the first substrate and the encapsulation layer. The set of electronics, covered by the one or more delamination layers, is encapsulated between the encapsulation layer and the first substrate. At least one of the delamination layers includes a set of passages filled with material of the encapsulation layer forming a set of interconnections between the encapsulation layer and the first substrate.

A method for treating waste printed circuit board includes carbonizing waste printed circuit board together with a calcium compound at 400 C. to 600 C. in a non-oxidizing atmosphere to fix a halogen contained in the board as calcium halide and to melt a solder of the board to allow mounted parts to be easily separated from the board, performing crushing after the carbonizing, and sieving crushed materials into fine particles of less than 0.5 mm containing the calcium compounds, medium particles containing the mounted parts, and coarse particles containing board pieces such that the crushed materials are sorted into the calcium compounds, the mounted parts, and the board pieces.