Some embodiments include semiconductor constructions having stacks containing electrically conductive material over dielectric material. Programmable material structures are directly against both the electrically conductive material and the dielectric material along sidewall surfaces of the stacks. Electrode material electrically coupled with the electrically conductive material of the stacks. Some embodiments include methods of forming memory cells in which a programmable material plate is formed along a sidewall surface of a stack containing electrically conductive material and dielectric material.

The disclosure relates to an integrated circuit comprising a transistor comprising first and second conduction terminals and a control terminal. The integrated circuit further comprises a stack of a first dielectric layer, a conductive layer, and a second dielectric layer, the first conduction terminal comprising a first semiconductor region formed in the first dielectric layer, the control terminal comprising a second semiconductor region formed in the conductive layer, and the second conduction terminal comprising a third semiconductor region formed in the second dielectric layer.

Embodiments of the present disclosure generally relate to electronic devices, and more specifically, to multi-level phase change devices. In one embodiment, a memory cell device is provided. The memory cell device generally includes a top surface, a bottom surface and a cell body between the top surface and the bottom surface. The cell body may include a plurality of phase change material layers, which may be used to store data of the cell. In another embodiment, a method of programming a memory cell is provided. The method generally may include applying a sequence of different pulses to each phase change material layer of the cell as the voltage of each pulse in the sequence is ratcheted down from the start of a write cycle to the end of a write cycle.

Semiconductor memory is provided wherein a memory cell includes a capacitorless transistor having a floating body configured to store data as charge therein when power is applied to the cell. The cell further includes a nonvolatile memory comprising a resistance change element configured to store data stored in the floating body under any one of a plurality of predetermined conditions. A method of operating semiconductor memory to function as volatile memory, while having the ability to retain stored data when power is discontinued to the semiconductor memory is described.

This variable resistance element is provided with a variable resistance film, a first electrode, which is disposed in contact with one surface of the variable resistance film, and a second electrode, which is disposed in contact with the other surface of the variable resistance film. The first and the second electrodes have corner portions, respectively, and the distance between the corner portions of the first and the second electrodes is set equal to the shortest distance between the first and the second electrodes. Furthermore, the variable resistance element has a third electrode, which is disposed on the one surface of the variable resistance film.

Some aspects of this disclosure relate to a memory device. The memory device includes a collector region having a first conductivity type and which is coupled to a source line of the memory device. A base region is formed over the collector region and has a second conductivity type. A gate structure is coupled to the base region and acts as a shared word line for first and second neighboring memory cells of the memory device. First and second emitter regions are formed over the base region and have the first conductivity type. The first and second emitter regions are arranged on opposite sides of the gate structure. First and second contacts extend upwardly from the first and second emitter regions, respectively, and couple the first and second emitter regions to first and second data storage elements, respectively, of the first and second neighboring memory cells, respectively.

Structures that include a switching memory element and methods of forming a structure including a switching memory element. The structure comprises a switching memory element, and a two-terminal access device including a first terminal coupled to the switching memory element, a second terminal, and a semiconductor layer between the first terminal and the second terminal. The semiconductor layer is electrically floating in the structure.

A method includes: providing a modulation circuit and a driving circuit, the modulation circuit configured to generate a temperature-dependent voltage and provide the same to the driving circuit; determined an operation mode of a memory array; providing a first current corresponding to a positive temperature coefficient by the driving circuit in response to the operation mode being a read operation on the memory array; and providing a second current corresponding to a negative temperature coefficient by the driving circuit in response to the operation mode being a write operation on the memory array.

The present description concerns a method of manufacturing an electronic chip comprising the successive steps of: providing a semiconductor layer located on an insulator covering a semiconductor substrate; oxidizing first and second portions of the semiconductor layer down to the insulator, to form first oxidized portions and second oxidized portions on the insulator; generating stress in a third portion of the semiconductor layer through which the first and second oxidized portions do not pass, the third portion continuously extending between the second oxidized portions; forming cavities extending at least down to the semiconductor substrate through the second oxidized portions and the insulator; and forming first field-effect transistors in and on top of the third portion.

A memory circuit includes a semiconductor substrate having selection transistors arranged therein, the semiconductor substrate including first regions and second regions, the first regions forming first rows extending in a first direction, the second regions forming second rows extending in the first direction. The memory circuit includes an interconnection stack including a succession of levels including first and second insulating layers, having interconnection elements defined therein. The memory circuit includes a plurality of memory cells arranged above a level of the stack, each memory cell being coupled to a first region by at least one interconnection element, the second regions of a same second row being coupled together by interconnection elements located in the at least one level of the stack.