Disclosed herein is an OLED lighting apparatus which can achieve both improvement in reliability and reduction in manufacturing cost. In the OLED lighting apparatus, an encapsulation layer is disposed over the active area and the non-active area on a buffer layer, such that a pad disposed in the non-active area of the buffer layer can be stably secured by the encapsulation layer bonded thereto. Accordingly, upon tape automated bonding between an FPCB substrate with a COF tape attached thereto and a via electrode, the COF tape does not directly contact the pad but contacts the via electrode connected to the pad, particularly a connection terminal of the via electrode disposed on an upper surface of the encapsulation layer, thereby establishing electrical connection between the FPCB substrate and the via electrode. In this way, the connection terminal of the via electrode is electrically connected to the FPCB substrate via the COF tape, whereby a signal from the outside can be applied to the pad connected to the via electrode.

The present invention provides an organic optoelectronic device and a method for manufacturing the same, in which laser scanning is used to form the electrical connection between the second electrode layer and the contact electrode layer. The present invention can effectively decrease the frequency of replacement of metal masks, significantly shorten the time required for replacing the metal masks, and reduce the down time due to the replacement of metal masks. In addition, the organic optoelectronic device can have a large active area due to the narrow border of the electrical connection formed by the laser scanning.

According to the present disclosure, an organic optoelectronic component provides with a first electrode, an organic functional layer structure above the first electrode, a second electrode above the organic functional layer structure, at least one contact section for electrically contacting the organic optoelectronic component, and an electrically conductive elastomer connector which is arranged above the contact section and is electrically connected to the contact section. The contact section is electrically connected to one of the electrodes.

A light-emitting device includes a substrate, a plurality of light-emitting units located on the substrate, each of the plurality of light-emitting units comprising a first electrode, a second electrode, and an organic layer located between the first electrode and the second electrode, a plurality of first terminals, each of the plurality of first terminals being electrically connected to a plurality of the first electrodes, a plurality of second terminals, each of the plurality of second terminals being electrically connected to a plurality of second electrodes, a sealing layer sealing the light-emitting unit, the sealing layer not covering the plurality of first terminals or the plurality of second terminals, and a cover layer located over the sealing layer.

Provided is an organic EL panel. A first conductive film, an organic functional film, a second conductive film, and a sealing film are provided on a substrate. The first conductive film includes a first main body, a first electrode pad, and a second electrode pad. The second conductive film includes a second main body, and a second electrode pad region extending from the second main body toward the first vertex. The second electrode pad region extends to a stretched region exposed from the sealing film which covers a light-emitting region. A first electrode conduction path surrounds at least half of the light-emitting region and connects the electrode pads. A circuit board is fixed near the first vertex. A first electrode wire is configured to adhere to the electrode pads. A second electrode wire is configured to adhere to the second electrode pad region in the stretched region.

A display device includes a first thin-film transistor (TFT) including a first semiconductor layer including silicon semiconductor and a first gate electrode insulated from the first semiconductor layer, a first interlayer insulating layer covering the first gate electrode, a second TFT arranged on the first interlayer insulating layer and including a second semiconductor layer including oxide semiconductor and a second gate electrode insulated from the second semiconductor layer, a second interlayer insulating layer covering the second gate electrode, a first power supply voltage line arranged on the second interlayer insulating layer, a first planarization layer covering the first power supply voltage line, and a data line arranged on the first planarization layer and at least partially overlapping the first power supply voltage line.

A display device includes a first thin-film transistor (TFT) including a first semiconductor layer including silicon semiconductor and a first gate electrode insulated from the first semiconductor layer, a first interlayer insulating layer covering the first gate electrode, a second TFT arranged on the first interlayer insulating layer and including a second semiconductor layer including oxide semiconductor and a second gate electrode insulated from the second semiconductor layer, a second interlayer insulating layer covering the second gate electrode, a first power supply voltage line arranged on the second interlayer insulating layer, a first planarization layer covering the first power supply voltage line, and a data line arranged on the first planarization layer and at least partially overlapping the first power supply voltage line.

A display panel includes a driving backplane, a plurality of detection pads, a light emitting function layer, and a flexible circuit board. The driving backplane has a pixel driving region and a peripheral region, and the peripheral region has bonding pads; an edge of the driving backplane is surrounded by a first section and a second section, and the bonding pads are located between the first section and the pixel driving region; a plurality of detection pads are disposed in and distributed along the second section; a light emitting function layer is disposed on the driving backplane and located in the pixel driving region; a flexible circuit board extends between the first section and the pixel driving region, and is bonded to the bonding pads; a first packaging layer is disposed on the light emitting function layer.

A display panel includes a driving backplane, a plurality of detection pads, a light emitting function layer, and a flexible circuit board. The driving backplane has a pixel driving region and a peripheral region, and the peripheral region has bonding pads; an edge of the driving backplane is surrounded by a first section and a second section, and the bonding pads are located between the first section and the pixel driving region; a plurality of detection pads are disposed in and distributed along the second section; a light emitting function layer is disposed on the driving backplane and located in the pixel driving region; a flexible circuit board extends between the first section and the pixel driving region, and is bonded to the bonding pads; a first packaging layer is disposed on the light emitting function layer.

This invention discloses methods to form a micro thin film device. The methods use release layer on a substrate, encapsulation layers, electrode formation, and forming a bank layer. The methods further use VIA's to provide access to pads. The methods also entail transfer of multiple micro thin film devices by forming micro thin film devices on a cartridge, forming a housing, using anchors, and covering a side wall of the housing with a release layer.