The present application discloses a QLED manufacturing method, which includes following steps of: providing a substrate provided with a bottom electrode, and preparing a quantum dot light emitting layer on the substrate; illuminating after depositing a first compound solution on a surface of the quantum dot light emitting layer, here a first compound is a compound capable of being photodegraded into ions after the illumination.

A display device including a display panel including a display substrate having a display area and a pad area around the display area, and a plurality of signal wirings disposed in the pad area of the display substrate, a base film attached to the pad area of the display substrate, a plurality of lead wirings disposed on the base film and connected to the plurality of signal wirings, and a first curable pattern disposed between adjacent ones of the lead wirings, in which a surface height of the first curable pattern from a surface of the base film is less than a surface height of the lead wirings from the surface of the base film.

A manufacturing method of a display device includes irradiating a laser beam onto a work panel along a beam irradiation line corresponding to an outer edge of the display device including a first thickness area and a second thickness area. The irradiating of the laser beam includes first irradiating the laser beam under a first driving condition to provide a first portion of the beam irradiation line at the first area, stopping driving of the laser beam while changing the first driving condition to a second driving condition different from the first driving condition, after the first irradiating of the laser beam, and second irradiating the laser beam under the second driving condition to provide a second portion of the beam irradiation line at the second area, after the stopping of the driving of the laser beam.

A device includes: (1) a substrate; (2) a patterning coating covering at least a portion of the substrate, the patterning coating including a first region and a second region; and (3) a conductive coating covering the second region of the patterning coating, wherein the first region has a first initial sticking probability for a material of the conductive coating, the second region has a second initial sticking probability for the material of the conductive coating, and the second initial sticking probability is different from the first initial sticking probability.

A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

A display device in which damage and carbonization of a display substrate is substantially minimized and a method of manufacturing the display device are provided. A display device includes: a substrate including a first area having a first thickness and a second area having a second thickness which is different from the first thickness; a display layer at the first area of the substrate; and a functional member on the display layer at the first area. The first area and the second area are arranged along a first direction, the substrate includes a protruding portion at the second area, and the protruding portion includes a side portion having an inclination of about 5 degrees or more with respect to the first direction toward a second direction which intersects the first direction.

The invention relates to a display screen and a packaging method thereof. The packaging method of the display screen comprises the following steps: providing a substrate of the display screen; evaporating an organic light-emitting material on the substrate; printing a first packaging pattern and a second packaging pattern on the cover plate of the display screen, wherein the first packaging pattern surrounds the second packaging pattern; etching the organic light-emitting material by using a first laser on the substrate; fitting the substrate and the cover plate so that the first packaging pattern and the substrate are fitted, and the second packaging pattern and the organic light-emitting material are fitted; sintering the first packaging pattern and the second packaging pattern by using a second laser on one of the substrate and the cover plate; and performing punching on the display screen.

A compound represented by the formula (1) is provided: ##STR00001##
wherein A.sup.1 represents an oxygen atom, a sulfur atom, —NR.sup.5— or —PR.sup.5—; at least one A.sup.1 is —NR.sup.5— or —PR.sup.5—; R.sup.1 represents a hydrogen atom, an alkyl group, a cycloalkyl group, an alkoxy group, a cycloalkoxy group, an aryloxy group, an alkylsulfenyl group, a cycloalkylsulfenyl group, an arylsulfenyl group or a disubstituted amino group; R.sup.2 and R.sup.3 represent an alkyl group, a cycloalkyl group, an aryl group, an alkoxy group, a cycloalkoxy group, an aryloxy group, an alkylsulfenyl group, a cycloalkylsulfenyl group, an arylsulfenyl group, a monovalent heterocyclic group, a halogen atom or a disubstituted amino group; R.sup.4 represents a hydrogen atom, —C(R.sup.6).sub.3, —OR.sup.7, —N(R.sup.7).sub.2 or —Si(R.sup.7).sub.3; m represents an integer of 0 to 3; and n represents an integer of 0 to 4.

In one embodiment, there is provided a method of manufacturing an organic layer. The method includes: forming an organic material solution layer on a substrate; and heating, by a directional heat source assembly, at least a first portion of organic material solution of the organic material solution layer that is inside a to-be-treated area of the substrate, to increase an evaporation rate of the first portion of the organic material solution, whereby, reducing a thickness difference, due to different evaporation rates of the first portion of the organic material solution and a second portion of the organic material solution of the organic material solution layer that is outside the to-be-treated area of the substrate, of the organic layer that is cured from the organic material solution layer.

Provided are a method for forming a perovskite layer and a method for forming a structure comprising a perovskite layer. The method for forming a perovskite layer includes the following steps: coating a perovskite precursor material on a substrate; and performing a heating treatment to the substrate; and irradiating the perovskite precursor material with infrared light.