A display panel is provided which comprises a substrate, a backboard, and an electroluminescent device layer, which are stacked in sequence, the electroluminescent device layer having a hole at a display region of the display panel, a laser protection layer is provided on a periphery of the hole of the electroluminescent device layer.

A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

A continuous inline method for production of photovoltaic devices at high speed includes: providing a substrate; depositing a first carrier transport solution layer with a first carrier transport deposition device to form a first carrier transport layer on the substrate; depositing a Perovskite solution comprising solvent and perovskite precursor materials with a Perovskite solution deposition device on the first carrier transport layer; drying the deposited Perovskite solution to form a Perovskite absorber layer; and depositing a second carrier transport solution with a second carrier transport deposition device to form a second carrier transport layer on the Perovskite absorber layer, wherein the deposited Perovskite solution is dried at least partially with a fast drying device which causes a conversion reaction and the Perovskite solution to change in optical density by at least a factor of 2 in less than 0.5 seconds after the fast drying device first acts on the Perovskite solution.

A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

A display device includes a substrate including a first display area and a second display area, the first display area including a first pixel, and the second display area including a second pixel and a transmissive area, a first pixel electrode and a first emission layer in the first pixel, a second pixel electrode and a second emission layer in the second pixel, an opposite electrode arranged as one body in the first display area and the second display area, and a top layer arranged on the opposite electrode, wherein the opposite electrode and the top layer each have an opening area corresponding to the transmissive area, and wherein a convex portion is around the transmissive area, the convex portion being convex in a top surface direction of the substrate.

A display device including a display panel including a display substrate having a display area and a pad area around the display area, and a plurality of signal wirings disposed in the pad area of the display substrate, a base film attached to the pad area of the display substrate, a plurality of lead wirings disposed on the base film and connected to the plurality of signal wirings, and a first curable pattern disposed between adjacent ones of the lead wirings, in which a surface height of the first curable pattern from a surface of the base film is less than a surface height of the lead wirings from the surface of the base film.

A method for manufacturing an organic electronic device according to one embodiment includes: a coating film formation step of applying a coating liquid for a functional layer having a predetermined function onto a plastic substrate to form a coating film; and a heating step of heating and curing the coating film by irradiating the coating film with infrared rays in an infrared heating furnace to form the functional layer. In the heating step, the coating film is heated and cured by the infrared rays while a member of the infrared heating furnace is cooled to 100 C. or less, the member being disposed around the plastic substrate so as to be separate from the plastic substrate.

Present invention concerns optical processing of materials comprising complex phase behaviour, such as perovskites for stabilizing the optically active phase of thin films of materials with complex phase behaviour, such as perovskites.

Provided is a manufacturing method of a display device in which, after a layered body including a resin layer, a TFT layer, and a light emitting element layer is formed on a substrate configured to form a plurality of display devices, the resin layer is irradiated with laser from a back face of the substrate and the substrate is peeled from the layered body using a laser peeling device. The manufacturing method of a display device includes acquiring optical information of the substrate that is peeled off, detecting each acquisition result of the plurality of display devices from each assigned position of the plurality of display devices relative to the substrate, and performing predetermined processing on the display device in a case that the acquisition result of the display device exceeds a threshold value.