A mask cleaning apparatus and method of using the same includes a preheating zone preheating a mask, a first ultraviolet cleaning zone irradiating the mask with a first ultraviolet laser beam at a first irradiation angle, a first cooling zone cooling the mask irradiated with the first ultraviolet laser beam, a second ultraviolet cleaning zone irradiating the mask with a second ultraviolet laser beam at a second irradiation angle, a second cooling zone cooling the mask irradiated with the second ultraviolet laser beam, an infrared cleaning zone irradiating the mask with an infrared laser beam at a third irradiation angle, and a peeling zone spraying air onto the mask irradiated with the infrared laser beam.

A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

Disclosed is a radiation curable polymer formulation and methods of producing a dielectric film having such a formulation. The radiation curable polymer formulation includes an acrylic monomer; a cross linking agent; and a photoinitiator. The polymer formulation is insoluble with an organic solvent, which is preferable in low cost high volume manufacturing of thin film transistors for flexible electronics.

A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

A manufacturing method of a thin film transistor is provided, which includes steps of: providing a flexible substrate with an active layer formed thereon; providing a dielectric layer disposed on the active layer, wherein the dielectric layer has openings; providing a heavily doped silicon layer in the openings, wherein the heavily doped silicon layer is connected to the active layer, extends upward along a sidewall of the openings, and covers an upper surface of the dielectric layer, and the heavily doped silicon layer configured as at least one source/drain; and providing a metal layer in the openings and on the at least one source/drain, wherein the metal layer is connected to the at least one source/drain. The active layer and the source/drain are formed as a same semiconductor material, so that contact resistance can be effectively lowered, thereby improving energy consumption.

A display device includes: a first substrate including a first region, a third region spaced apart from and surrounding the first region, and a second region located between the first region and the third region; a second substrate opposite to the first substrate; a display element including a first electrode on the first substrate, a light emitting layer provided on the first electrode, and a second electrode provided on the light emitting layer; a touch sensing part disposed on the second substrate; and a sealing member provided on the third region of the first substrate, the sealing member joining the first substrate and the second substrate, wherein the second electrode overlaps the touch sensing part, and an end of the second electrode is spaced apart from an end of the touch sensing part in the direction of the sealing member in the second region.

The invention relates to a display screen and a packaging method thereof. The packaging method of the display screen comprises the following steps: providing a substrate of the display screen; evaporating an organic light-emitting material on the substrate; printing a first packaging pattern and a second packaging pattern on the cover plate of the display screen, wherein the first packaging pattern surrounds the second packaging pattern; etching the organic light-emitting material by using a first laser on the substrate; fitting the substrate and the cover plate so that the first packaging pattern and the substrate are fitted, and the second packaging pattern and the organic light-emitting material are fitted; sintering the first packaging pattern and the second packaging pattern by using a second laser on one of the substrate and the cover plate; and performing punching on the display screen.

The present disclosure provides a packaging adhesive, a packaging method, a display panel, and a display device. The packaging adhesive includes a frit, an organic solvent, and a material with a thermal expansion coefficient larger than that of the frit. Using the packaging adhesive provided by the present disclosure, the thermal expansion coefficient of the packaging adhesive from which the organic solvent is removed may be enhanced by doping the material with a thermal expansion coefficient larger than that of the frit into existing glass cement, so that in a packaging process using laser radiation, an expansion volume of the packaging adhesive when heated is increased. In this way, a gap between the packaging adhesive and an array substrate is effectively reduced, and a packaging effect is improved.