A method of manufacturing a piezoelectric element of the present disclosure includes: a first film forming step of forming a first electrode at a substrate; a second film forming step of forming a first piezoelectric layer at the first electrode; a first processing step of patterning the first electrode and the first piezoelectric layer by etching; and a third film forming step of forming, after the first processing step, a second piezoelectric layer to cover the first electrode, the first piezoelectric layer, and the substrate.

A piezoelectric actuator includes: a vibration plate: a first piezoelectric body arranged on one side in a thickness direction of the vibration plate; a second piezoelectric body arranged on a side, of the first piezoelectric body, opposite to the vibration plate in the thickness direction; a first electrode arranged between the vibration plate and the first piezoelectric body; a second electrode arranged between the first and second piezoelectric bodies in the thickness direction, and overlapping with the first electrode in the thickness direction; and a third electrode arranged on a side, of the second piezoelectric body, opposite to the first piezoelectric body in the thickness direction, and overlapping with the second electrode in the thickness direction. The second piezoelectric body covers at least a part of a first end surface, of the first piezoelectric body, which is an end surface in a first direction orthogonal to the thickness direction.

A method for manufacturing an imaging module, including: providing a first substrate and bonding a first dielectric layer on the first substrate; patterning the first dielectric layer to form at least one first bump and at least one second bump which are mutually independent, wherein a region surrounded by the at least one second bump defines a location region of the moved element; providing a piezoelectric element, adhering one end of the piezoelectric element to the first bump through a first adhesion material and making the other end of the piezoelectric element at least partially located above the second bump; adhering the moved element to the second bump through a second adhesion material; and debonding to remove the first substrate.

A piezoelectric assembly, a screen component, and a mobile terminal are provided. The piezoelectric assembly can include a vibrating member made of a piezoelectric material and a signal line connected to the vibrating member. The vibrating member includes two or more piezoelectric layers stacked in sequence. A size of at least one of the piezoelectric layers is smaller than a size of any remaining one of the piezoelectric layers to form a stepped structure.

A piezoelectric assembly, a screen component, and a mobile terminal are provided. The piezoelectric assembly can include a vibrating member made of a piezoelectric material and a signal line connected to the vibrating member. The vibrating member includes two or more piezoelectric elements stacked in sequence. A size of at least one of the piezoelectric elements is smaller than a size of any remaining one of the piezoelectric elements to form a stepped structure. Each of the piezoelectric elements is provided with two or more piezoelectric layers of the same size.

A piezoelectric assembly, a screen component, and a mobile terminal are provided. The piezoelectric assembly can include a vibrating member made of a piezoelectric material and a signal line connected to the vibrating member. The vibrating member includes two or more piezoelectric layers stacked in sequence. A size of at least one of the piezoelectric layers is smaller than a size of any remaining one of the piezoelectric layers to form a stepped structure.

A ferroelectric transducer includes, in part, a first electrode positioned above a substrate; a composite stack positioned above the first electrode, and a second electrode positioned above the composite stack. The composite stack may include one or more alternate layers of a ferroelectric layer and a transition-metal nitride layer. The transition-metal nitride layer can be positioned above a corresponding ferroelectric layer, except the topmost ferroelectric layer in the composite stack. The ferroelectric layer comprises a scandium-doped aluminum nitride (Sc.sub.xAl.sub.1-xN) film, wherein 0<x<1.

A piezoelectric assembly, a screen component, and a mobile terminal are provided. The piezoelectric assembly can include a vibrating member made of a piezoelectric material and a signal line connected to the vibrating member. The vibrating member includes two or more piezoelectric elements stacked in sequence. A size of at least one of the piezoelectric elements is smaller than a size of any remaining one of the piezoelectric elements to form a stepped structure. Each of the piezoelectric elements is provided with two or more piezoelectric layers of the same size.

Various embodiments of the present disclosure are directed towards a piezoelectric metal-insulator-metal (MIM) device including a piezoelectric structure between a top electrode and a bottom electrode. The piezoelectric layer includes a top region overlying a bottom region. Outer sidewalls of the bottom region extend past outer sidewalls of the top region. The outer sidewalls of the top region are aligned with outer sidewalls of the top electrode. The piezoelectric layer is configured to help limit delamination of the top electrode from the piezoelectric layer.

Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array may be fabricated via a wafer scale approach, where a first comb structure, with a first type of element, is formed by dicing a first acoustic stack and a second comb structure, with a second type of element, is formed by dicing a second acoustic stack. Combining the first and second comb structures may form a multi-frequency transducer array.