An ultrasonic device includes: a substrate provided with a first opening and a second opening; a support film that is provided on the substrate and blocks the first opening and the second opening; a transmitting piezoelectric film that is provided on the support film at a position which overlaps the first opening when viewed in a thickness direction of the substrate and is interposed between a pair of electrodes in the thickness direction of the substrate; and a receiving piezoelectric film that is provided on the support film at a position which overlaps the second opening when viewed in the thickness direction of the substrate and is interposed between a pair of electrodes in the thickness direction of the substrate. In the thickness direction of the substrate, a thickness dimension of the transmitting piezoelectric film is smaller than a thickness dimension of the receiving piezoelectric film.

A resin structure that includes a plurality of piezoelectric fibers that generate a charge by application of external energy; and an insulating resin coating at least one of the plurality of piezoelectric fibers.

A method for forming a high resistivity handle substrate for a composite substrate comprises: providing a base substrate made of silicon; exposing the base substrate to a carbon single precursor at a pressure below atmospheric pressure to form a polycrystalline silicon carbide layer having a thickness of at least 10 nm on the surface of the base substrate; and then growing a polycrystalline charge trapping layer on the carbon-containing layer.

A driving mechanism is provided, including a base, a movable module, and a driving assembly. The movable module has a movable member and a connecting member connected to the movable member. The driving assembly is connected to the base and the connecting member. The driving assembly has a driving element that generates a driving force to the connecting member and the movable member, so that the movable module moves relative to the base.

A microphone device may include: a substrate wafer, a support member bonded to a front surface of the substrate wafer, a single-crystal piezoelectric film provided over the support member, a top electrode and a bottom electrode. The single-crystal piezoelectric film may have a first surface and an opposing second surface. The top electrode may be arranged adjacent to the first surface of the single-crystal piezoelectric film. The bottom electrode may be arranged adjacent to the second surface of the single-crystal piezoelectric film. The substrate wafer may have a through-hole formed therein. The through-hole of the substrate wafer may be at least substantially aligned with at least one of the top electrode and the bottom electrode.

Described herein is mechanically decoupling of an electromechanical transducer from a common substrate, enabling multiple transducers to be surface mounted to a common substrate such as a printed circuit board (PCB) without experiencing mechanical cross-coupling. The decoupling of the transducer from the substrate enables the transducers to be attached without reducing the efficiency of acoustic transduction. The design of the mount enables it to be assembled in an automated manner with pick and place tools.

As a temperature measurement apparatus using a surface acoustic wave of a piezoelectric substrate that performs temperature measurement wirelessly and without power supply, the temperature measurement apparatus accurately measures the temperature of the thermocouple tip end by analyzing the frequency characteristics of the surface acoustic wave propagating on the piezoelectric substrate and including temperature information of the piezoelectric substrate, and detecting change in propagation time of the surface acoustic wave of the piezoelectric substrate that is changed by the electromotive force of the thermocouple.

A display apparatus is disclosed. The display apparatus includes a display panel, a supporter attached to a rear surface of the display panel, and a piezoelectric vibration unit including a fixing portion attached to the supporter and a cantilever portion overhanging from the supporter.

A micro crystal oscillator includes: a tank body including a tank bottom and a side wall, the tank bottom including an inner surface and an outer surface, wherein the side wall is disposed on a periphery of the inner surface of the tank bottom to form a recess together with the tank bottom; a plurality of patterned electrodes arranged on the outer surface; a first patterned circuit arranged on the side wall; a plurality of vias disposed in the tank body for electrically connecting at least one of the patterned electrodes to the first patterned circuit; an oscillating chip arranged on the inner surface and located in the recess; and a plurality of connecting wires located in the recess and respectively connected to the oscillating chip and the first patterned circuit in a wire bonding manner; wherein the micro crystal oscillator is of millimeter level.

An optical assembly of a projection exposure apparatus for semiconductor lithography comprises an optical element and an actuator for deforming the optical element. The actuator is subjected to a bias voltage by a controller that is present. A projection exposure apparatus for semiconductor lithography comprises an optical assembly. A method for operating an actuator for deforming an optical element for semiconductor lithography comprises subjecting the actuator to a bias voltage by a controller.