Patent classifications
H10N60/203
Coated conductor high temperature superconductor carrying high critical current under magnetic field by intrinsic pinning centers, and methods of manufacture of same
A coated conductor comprises a substrate supporting a ReBCO superconductor adapted to carry current in a superconducting state. The superconductor is characterized in having peaks in critical current (J.sub.c) of at least 0.2 MA/cm.sup.2 in a magnetic field of about 1 Tesla when the field is applied normal to the surface of the superconductor and when the field is applied parallel to the surface of the superconductor, and further characterized in that the superconductor includes horizontal defects and columnar detects in a size and an amount sufficient to result in the said critical current response. The conductor is characterized in that the ratio of the height of the peaks in the J.sub.c is in the range from 3:1 with the ratio of the field perpendicular (0 degrees) to the field parallel (+/90 degrees) to the range from 3:1 with the ratio of the field parallel to the field perpendicular.
TAPE TYPE SUPERCONDUCTOR WITH A PLURALITY OF ELONGATED BARRIER STRUCTURES
A tape type superconductor (1), extending in longitudinal direction (LD), includes a substrate tape (2), at least one buffer layer (3), a superconductor layer (4), and plural elongated barrier structures (5, 5a, 5b). The superconductor layer has a width W.sub.SL in a direction (WD) that is perpendicular to the longitudinal direction and runs parallel to a flat side (8) of the substrate tape. The tape type superconductor has a longitudinal length L.sub.TTS t, and the elongated barrier structures are oriented in parallel with the longitudinal direction. A respective barrier structure has a longitudinal length L.sub.BS, with L.sub.BS0.20*W.sub.SL and L.sub.BS0.20*L.sub.TTS. The barrier structures are distributed longitudinally, are located at least partially in the superconductor layer, and impede a superconducting current flow in width direction across a respective barrier structure. This tape type superconductor achieves high critical currents simply and over extended tape lengths with suppressed magnetization.
CABLE DESIGN IN HTS TOKAMAKS
There is described a cable for carrying electrical current in a coil of a magnet. The cable comprises a stack of tape assemblies, each tape assembly comprising a high-strength metal substrate layer, and an HTS layer of high temperature superconductor material. The tape assemblies are stacked as a series of type 0 pairs such that the HTS layers of a type 0 pair face each other and the substrate layers of the type 0 pair are separated by the HTS layers.
Quality Control of High Performance Superconductor Tapes
A superconductor tape and method for manufacturing, measuring, monitoring, and controlling same are disclosed. Embodiments are directed to a superconductor tape which includes a superconductor film overlying a buffer layer which overlies a substrate. In one embodiment, the superconductor film is defined as having a c-axis lattice constant higher than 11.74 Angstroms. In another embodiment, the superconductor film comprises BaMO.sub.3, where M=Zr, Sn, Ta, Nb, Hf, or Ce, and which has a (101) peak of BaMO.sub.3 elongated along an axis that is between 60? to 90? from an axis of the (001) peaks of the superconductor film. These and other embodiments achieve well-aligned nanocolumnar defects and thus a high lift factor, which can result in superior critical current performance of the tape in, for example, high magnetic fields.
Pre-product and method for producing a strip-like high-temperature superconductor
The present invention relates to a precursor (1) for production of a high-temperature superconductor (HTS) in ribbon form, comprising a metallic substrate (10) in ribbon form having a first ribbon side (11) and a second ribbon side (12), wherein, on the first ribbon side (11), (a) the substrate (10) has a defined texture as template for crystallographically aligned growth of a buffer layer or an HTS layer and (b) an exposed surface of the substrate (10) is present or one or more layers (20,30) are present that are selected from the group consisting of: buffer precursor layer, pyrolyzed buffer precursor layer, buffer layer, HTS precursor layer, pyrolyzed HTS buffer precursor layer and pyrolyzed and further consolidated HTS buffer precursor layer, and, on the second ribbon side (12), at least one ceramic barrier layer (40) that protects the substrate (10) against oxidation or a precursor which is converted to such a layer during the HTS crystallization annealing or the pyrolysis is present, wherein, when one or more layers (20, 30) are present on the first ribbon side (11), the ceramic barrier layer (40) or the precursor thereof has a different chemical composition and/or a different texture than the layer (20) arranged on the first ribbon side (11) and directly adjoining the substrate (10). In this precursor, the barrier layer (40) is a layer that delays or prevents ingress of oxygen to the second ribbon side (12) and is composed of conductive ceramic material or a precursor which is converted to such a precursor during the HTS crystallization annealing or the pyrolysis, and the ceramic material is an electrically conductive metal oxide or an electrically conductive mixture of metal oxides, wherein the conductive metal oxide or one or more metal oxides in the conductive mixture is/are preferably metal oxide(s) doped with an extraneous metal.
Quality Control of High Performance Superconductor Tapes
A superconductor tape and method for manufacturing, measuring, monitoring, and controlling same are disclosed. Embodiments are directed to a superconductor tape which includes a superconductor film overlying a buffer layer which overlies a substrate. In one embodiment, the superconductor film is defined as having a c-axis lattice constant higher than 11.74 Angstroms. In another embodiment, the superconductor film comprises BaMO.sub.3, where M=Zr, Sn, Ta, Nb, Hf, or Ce, and which has a (101) peak of BaMO.sub.3 elongated along an axis that is between 60? to 90? from an axis of the (001) peaks of the superconductor film. These and other embodiments achieve well-aligned nanocolumnar defects and thus a high lift factor, which can result in superior critical current performance of the tape in, for example, high magnetic fields.
Electrical, mechanical, computing/ and/or other devices formed of extremely low resistance materials
Electrical, mechanical, computing, and/or other devices that include components formed of extremely low resistance (ELR) materials, including, but not limited to, modified ELR materials, layered ELR materials, and new ELR materials, are described.
Oxide superconducting wire
An oxide superconducting wire, includes a laminate including a base material, an intermediate layer, and an oxide superconducting layer, the intermediate layer being laminated on a main surface of the base material, the intermediate layer being constituted of one or more layers having an orientation, the intermediate layer having one or more first non-orientation regions extending in a longitudinal direction of the base material, the oxide superconducting layer being laminated on the intermediate layer, the oxide superconducting layer having a crystal orientation controlled by the intermediate layer, the oxide superconducting layer having second non-orientation regions located on the first non-orientation regions, and a metal layer which covers at least a front surface and side surfaces of the oxide superconducting layer in the laminate.
Precise Alignment and Decal Bonding of a Pattern of Solder Preforms to a Surface
A method of making precise alignment and decal bonding of a pattern of solder preforms to a surface comprising cutting and placing a length of a solder ribbon onto a semiconductor release tape forming a solder ribbon and semiconductor release tape combination, placing the solder ribbon and semiconductor release tape combination on a vacuum chuck on X-Y stage pair in a laser micromachining system, adjusting the working distance, laser-cutting an outline, peeling off the solder ribbon, allowing the desired solder shape to remain, creating indexing holes, providing a target surface on an alignment fixture with indexing pins, aligning the indexing holes, placing the semiconductor release tape with the desired solder shape on the target surface, pressing the desired solder shape onto the target surface, removing the release tape, and making a pattern of the desired solder shape with precise alignment and decal bonding on the target surface.
Fabrication of High-Temperature Superconducting Striated Tape Combinations
This disclosure teaches methods for making high-temperature superconducting striated tape combinations and the product high-temperature superconducting striated tape combinations. This disclosure describes an efficient and scalable method for aligning and bonding two superimposed high-temperature superconducting (HTS) filamentary tapes to form a single integrated tape structure. This invention aligns a bottom and top HTS tape with a thin intervening insulator layer with microscopic precision, and electrically connects the two sets of tape filaments with each other. The insulating layer also reinforces adhesion of the top and bottom tapes, mitigating mechanical stress at the electrical connections. The ability of this method to precisely align separate tapes to form a single tape structure makes it compatible with a reel-to-reel production process.