A multilayer component and a mathod for producing a multilayer component are disclosed. In an embodiment a multilayer component includes a ceramic main element and at least one metal structure, wherein the metal structure is cosintered and wherein main element is a varistor ceramic having 90 mol % of ZnO, from 0.5 to 5 mol % of Sb.sub.2O.sub.3, from 0.05 to 2 mol % of Co.sub.3O.sub.4, Mn.sub.2O.sub.3, SiO.sub.2 and/or Cr.sub.2O.sub.3, and <0.1 mol % of B.sub.2O.sub.3, Al.sub.2O.sub.3 and/or NiO.

A multilayer component and a mathod for producing a multilayer component are disclosed. In an embodiment a multilayer component includes a ceramic main element and at least one metal structure, wherein the metal structure is cosintered and wherein main element is a varistor ceramic having 90 mol % of ZnO, from 0.5 to 5 mol % of Sb.sub.2O.sub.3, from 0.05 to 2 mol % of Co.sub.3O.sub.4, Mn.sub.2O.sub.3, SiO.sub.2 and/or Cr.sub.2O.sub.3, and <0.1 mol % of B.sub.2O.sub.3, Al.sub.2O.sub.3 and/or NiO.

A fuse device including a fuse component, a first electrode, disposed on a first side of the fuse component, a second electrode, disposed on a second side of the fuse component, and a phase change component, disposed in thermal contact with the fuse component. The fuse component may comprise a fuse temperature, wherein the phase change component exhibits a phase change temperature, the phase change temperature marking a phase transition of the phase change component, and wherein the phase change temperature is less than the fuse temperature.

A solid state circuit breaker that may include a metal oxide varistor (MOV) that is connected in series to a thyristor, the MOV to clamp voltage of current flowing through the solid state circuit breaker; the thyristor including a gate to control flow of the current to the MOV along a first path to the MOV; a breakover diode to activate at a target voltage level to allow the current to flow to the MOV along a second path; and a Zener diode to close the gate and allow current to flow along the first path in response to the current on the second path.

A solid state circuit breaker that may include a metal oxide varistor (MOV) that is connected in series to a thyristor, the MOV to clamp voltage of current flowing through the solid state circuit breaker; the thyristor including a gate to control flow of the current to the MOV along a first path to the MOV; a breakover diode to activate at a target voltage level to allow the current to flow to the MOV along a second path; and a Zener diode to close the gate and allow current to flow along the first path in response to the current on the second path.

The present disclosure specifies a varistor comprising a ceramic body, which comprises a functional ceramic, and electrodes arranged inside the ceramic body. The electrodes include non-floating electrodes, which are electrically connected to external contacts of the varistor, respectively. The electrodes include at least three floating electrodes, which are electrically isolated with respect to the external contacts. At least two floating electrodes are arranged in the same layer, and each of the floating electrodes overlaps with at least two further electrodes. At least two floating electrodes overlap with one of the non-floating electrodes, respectively. A distance (D1) is defined along a longitudinal axis of the ceramic body between two of the electrodes overlapping with a first floating electrodes, and a distance (D2) is defined perpendicular to the longitudinal axis between the first floating electrode and one of the overlapping electrodes. The distance (D1) is at least twice the distance (D2).

The present disclosure specifies a varistor comprising a ceramic body, which comprises a functional ceramic, and electrodes arranged inside the ceramic body. The electrodes include non-floating electrodes, which are electrically connected to external contacts of the varistor, respectively. The electrodes include at least three floating electrodes, which are electrically isolated with respect to the external contacts. At least two floating electrodes are arranged in the same layer, and each of the floating electrodes overlaps with at least two further electrodes. At least two floating electrodes overlap with one of the non-floating electrodes, respectively. A distance (D1) is defined along a longitudinal axis of the ceramic body between two of the electrodes overlapping with a first floating electrodes, and a distance (D2) is defined perpendicular to the longitudinal axis between the first floating electrode and one of the overlapping electrodes. The distance (D1) is at least twice the distance (D2).

A surge protection apparatus is disclosed. The surge protection apparatus includes a housing; electronics contained in the housing; and a plurality of metal tabs electrically connected to the electronics, the metal tabs being configured to connect to a terminal block of a relay panel in a substation, the metal tabs electrically connecting the terminal block to the electronics to provide EMP surge protection to the relay panel.

Embodiments of the disclosure provide an electrical power surge arresting apparatus. Specifically, the surge arresting apparatus may be implemented within a port of an electrical power cord. In some embodiments, the surge arresting power cable comprises a plurality of conductive plates that may be attached to the hot, neutral, and ground leads of the electrical power cord. A plurality of Metal Oxide Varistors (MOV) may be positioned between the plurality of conductive plates. The plurality of conductive plates may be directly coupled to or comprise a plurality of conductive clips that may be configured to directly couple to a surge protected electronic device. Accordingly, there are no leads between the surge protecting device and the surge protected electronic device. The surge arresting device may further comprise one or more capacitors serving as a low-pass filter.

An over-voltage circuit protection device includes a voltage-dependent resistor component, and a printed circuit board (PCB) component connected to the voltage-dependent resistor component through first and second conductive lead layers. The PCB component includes a PCB body, a first conductive portion, a second conductive portion, at least one first conductive via and at least one second conductive via. The first and second conductive portions are disposed on the PCB body, and are electrically insulated from each other. The first and second conductive vias extend through the PCB body, and are defined by via-defining walls respectively covered by the first and second conductive portions.