For isolation barrier with magnetics, an apparatus includes an isolation laminate including a dielectric core having a first surface and a second surface opposed to the first surface; at least one conductive layer configured as a first transformer coil overlying the first surface; a first dielectric layer surrounding the at least one conductive layer; a first magnetic layer overlying the at least one conductive layer; at least one additional conductive layer configured as a second transformer coil overlying the second surface; a second dielectric layer surrounding the at least one additional conductive layer; and a second magnetic layer overlying the at least one additional conductive layer. Methods for forming the isolation barriers and additional apparatus arrangements are also described.

Provided is a method of forming a coil pattern on at least one surface on a substrate, the method comprising forming a seed layer on at least one surface of a substrate, and forming at least two or more plating layers to cover the seed layer, wherein the two or more plating layers are formed through anisotropic plating.

A measurement transformer includes a printed circuit and a magnetic core. The printed circuit includes an insulating layer, a primary through assembly and a secondary through assembly. The primary through assembly includes first primary plated through holes and second primary plated through holes extending through the insulating layer. The primary through assembly forms a portion of a primary winding of the transformer. The primary winding has a single turn. The secondary through assembly includes first secondary plated through holes and second secondary plated through holes extending through the insulating layer. The secondary through assembly forms a portion of a secondary winding of the transformer. The secondary winding includes a plurality of turns connected in series. The magnetic core extends in the thickness of the printed circuit.

A voltage regulator module includes a first circuit board, a switching circuit and a second circuit board. The switching circuit is disposed on a first surface of the first circuit board. A first contact pad is disposed on a second surface of the first circuit board. The switching circuit is connected with the contact pad through a conductive hole of the first circuit board. A first surface of the second circuit board is in contact with the first surface of the first circuit board. The first surface of the second circuit board includes a second contact pad. The second contact pad is fixed on the corresponding first contact pad. A second surface of the second circuit board includes a conductive pad. The conductive pad is connected with the corresponding second contact pad through a conductive hole of the second circuit board. The conductive pad is connected with a system board.

An inductor device includes a first wire, a second wire, and a third wire. The first wire includes a plurality of first sub-wires. The second wire includes a plurality of second sub-wires. The sequence of the first sub-wires and the second sub-wires is that at least two first sub-wires of the first sub-wires and at least one second sub-wires of the second sub-wires are disposed to each other in an interlaced manner. The third wire is disposed adjacent to at least two first sub-wires of the first sub-wires.

According to one embodiment, an isolator includes first and second electrodes, first and second insulating portions, and a first dielectric portion. The first insulating portion is provided on the first electrode. The second electrode is provided on the first insulating portion. The second insulating portion is provided around the second electrode along a first plane perpendicular to a first direction. The second insulating portion contacts the second electrode. The first dielectric portion is provided between the first and second insulating portions. At least a portion of the first dielectric portion contacts the second electrode and is positioned around the second electrode along the first plane. A distance between a lower end of the second electrode and a first interface between the first dielectric portion and the second insulating portion is less than a distance between the first interface and an upper end of the second electrode.

An isolator includes a substrate; a first planar coil provided above the substrate and along a surface of the substrate; a first insulating portion on the first planar coil; a second planar coil on the first insulating portion; and a metal layer above the first insulating portion. The first planar coil, the second planar coil, and the metal layer are arranged in a first direction perpendicular to the surface of the substrate. The first planar coil and the second planar coil each having a center and an outer perimeter in a second direction along the surface of the substrate. A distance in the second direction from the center of the first planar coil to the outer perimeter of the first planar coil is less than a distance in the second direction from the center of the second planar coil to the outer perimeter of the second planar coil.

A circuit device and a power converter include a core, a coil surrounding at least a part of the core, and a first heat transfer member being in surface contact with the core. A temperature rise of the core can thus be prevented or reduced.

An electronic component includes an insulating layer, a low voltage conductor pattern formed inside the insulating layer, a high voltage conductor pattern formed inside the insulating layer such as to face the low voltage conductor pattern in an up/down direction, and a withstand voltage enhancement structure of conductive property formed inside the insulating layer and along the high voltage conductor pattern such as to protrude further outside than the low voltage conductor pattern in plan view.

Provided is a method of manufacturing a component carrier that includes forming a magnetic core on a base structure; forming a through hole in at least one dielectric layer; forming a plurality of electrically conductive windings on the at least one dielectric layer around the through hole; forming a stack with the base structure having the magnetic core, the at least one dielectric layer and another base structure such that the magnetic core is inserted into the through hole and the conductive windings are arranged around the magnetic core such that the magnetic core and the plurality of electrically conductive windings are interposed between the base structure and the other base structure.