The semiconductor device of the present invention includes an insulating layer, a high voltage coil and a low voltage coil which are disposed in the insulating layer at an interval in the vertical direction, a low potential portion which is provided in a low voltage region disposed around a high voltage region for the high voltage coil in planar view and is connected with potential lower than the high voltage coil, and an electric field shield portion which is disposed between the high voltage coil and the low voltage region and includes an electrically floated metal member.

A voltage regulator module includes a circuit board, a metallic winding assembly, a switching circuit and a magnetic core assembly. The circuit board includes an accommodation space, a first surface and a second surface. The accommodation space is formed within the circuit board and in communication with a first opening and a second opening. The metallic winding assembly includes third opening. A projection region of the switching circuit and a projection region of the metallic winding assembly on the first surface are partially overlapped with each other. The magnetic core assembly includes an upper core, a lower core and a lateral leg. The upper core and the lower core are disposed on the circuit board. The lateral leg is penetrated through the first opening, the third opening and the second opening. An inductor is defined by the magnetic core assembly and the metallic winding assembly collaboratively.

Systems and methods for using parasitic capacitance of a transformer as an element in a resonant converter are provided. Aspects include determining a parasitic capacitance associated with a transformer, determining a resonant circuit configuration based at least in part on the parasitic capacitance associated with the transformer, and providing a resonant converter comprising the resonant circuit and the transformer.

An on-chip transformer circuit is disclosed. The on-chip transformer circuit comprises a primary winding circuit comprising at least one turn of a primary conductive winding arranged as a first N-sided polygon in a first dielectric layer of a substrate; and a secondary winding circuit comprising at least one turn of a secondary conductive winding arranged as a second N-sided polygon in a second, different, dielectric layer of the substrate. In some embodiments, the primary winding circuit and the secondary winding circuit are arranged to overlap one another at predetermined locations along the primary conductive winding and the secondary conductive winding, wherein the predetermined locations comprise a number of locations less than all locations along the primary conductive winding and the secondary conductive winding.

Illustrative embodiments of hybrid transformers, power supplies, and methods relating to the same are disclosed. In at least one embodiment, a hybrid transformer includes first and second wire coils arranged on opposing surfaces of a printed circuit board (PCB), a core extending through the PCB, wherein the first and second coils are each wound around the core, and at least one header electrically coupling one of the first and second wire coils to the PCB.

A power converter includes a circuit board, a first magnetic core, and a housing. The circuit board includes an insulating substrate and a first coil conductor. The insulating substrate includes a first side surface. The first magnetic core includes a first magnetic core member and a second magnetic core member. A first side surface of the insulating substrate is opposed to a first portion of the housing and is spaced away from the first portion of the housing. The first magnetic core member and the second magnetic core member are both thermally connected to the first portion.

A transformer includes a magnetic core, a first coil unit and a second coil unit. The first coil unit is disposed within the magnetic core and includes a laminated board having layers laminated therein and conductive patterns. Respective ones of the conductive patterns are disposed on the laminated layers. The second coil unit includes a conductive wire spaced apart from the conductive patterns of the laminated board by an insulating distance. The conductive wire includes a triple-insulated wire surrounded by three sheets of insulating paper to maintain the insulating distance from the conductive patterns.

The present disclosure discloses a PCB winding transformer and a coil board thereof. The PCB winding transformer comprises a coil board and a magnetic core. The coil board includes a primary coil and a secondary coil. The primary coil and the secondary coil are wound around a magnetic core column of the magnetic core. At least two via holes which correspond to the primary coil and the secondary coil respectively are disposed in the coil board. In the primary coil and the secondary coil, the via hole corresponding to the coil with less turns is disposed between an inner side of the coil with more turns and the magnetic core column.

A magnetic coupling device is disclosed. The magnetic coupling device includes a core portion including an upper core and a lower core spaced apart from each other in a first direction, a primary coil and a secondary coil disposed between the upper core and the lower core in the state of being spaced apart from each other in the first direction, and a core connector electrically connected to the upper core and the lower core. A discharge phenomenon of a slim magnetic coupling device is prevented by the provision of the core connector.

A power conversion circuit has a multilayer transformer and a plurality of rectifying transistors coupled to the secondary windings of the multilayer transformer. The multilayer transformer is formed as multiple layers within a PCB stack, where primary winding conductors and secondary winding conductors are vertically aligned and stacked. The secondary winding conductors are constructed to have one or more secondary winding arms that provide area to which the plurality of rectifying transistors are physically connected. The primary winding conductors are constructed to have a primary winding arm. A footprint of each primary winding conductor is configured to substantially overlap an entire footprint of each of the secondary winding conductors. As such, an entirety of the secondary current flowing through the secondary winding conductors is vertically aligned with the primary winding conductors, and therefore with the primary current flowing through the secondary winding conductors.