A multilayer ceramic capacitor includes a laminate and

an external electrode connected to the internal electrode layer. The laminate includes a central layer portion in which an internal electrode layer and a dielectric ceramic layer are alternately laminated, and a covering portion covering an outer surface of the central layer portion in the lamination direction and the width direction. A region where the main surface meets the lateral surface in the laminate is defined as a corner portion that is rounded, and a distance from the corner portion to an internal electrode closest to the corner portion is about 20 .Math.m or less.

A double-sided copper-clad laminate that includes an adhesive layer and a copper foil in order on each of both surfaces of a resin film, the resin film is in a cured state at 25° C., and each of the copper foils has a maximum peak height Sp of 0.05 μm or more and 3.3 μm or less as measured in accordance with ISO 25178 on a surface on a side being in contact with the adhesive layer.

A double-sided copper-clad laminate that includes an adhesive layer and a copper foil in order on each of both surfaces of a resin film, the resin film is in a cured state at 25° C., and each of the copper foils has a maximum peak height Sp of 0.05 μm or more and 3.3 μm or less as measured in accordance with ISO 25178 on a surface on a side being in contact with the adhesive layer.

A structural body that includes: a substrate; a plurality of fibrous materials, each of the plurality of fibrous material including a fibrous core material and a covering layer that covers the fibrous core material such that an exposed portion of the fibrous core material is formed at an end portion thereof; and an adhesive layer that bonds the substrate and the end portion of each of the plurality of fibrous materials to each other such that a boundary between the covering layer and the exposed portion is located inside the adhesive layer.

A structural body that includes: a substrate; a plurality of fibrous materials, each of the plurality of fibrous material including a fibrous core material and a covering layer that covers the fibrous core material such that an exposed portion of the fibrous core material is formed at an end portion thereof; and an adhesive layer that bonds the substrate and the end portion of each of the plurality of fibrous materials to each other such that a boundary between the covering layer and the exposed portion is located inside the adhesive layer.

A dielectric material includes a main component represented by (Ba.sub.1-xCa.sub.x)(Ti.sub.1-yZr.sub.y)O.sub.3, (Ba.sub.1-xCa.sub.x)(Ti.sub.1-ySn.sub.y)O.sub.3, or (Ba.sub.1-xCa.sub.x)(Ti.sub.1-yHf.sub.y)O.sub.3 (0≤x≤1 and 0≤y≤0.05) and a subcomponent. When an angle corresponding to a maximum peak is referred to as θ.sub.0 and angles corresponding to a full width at half maximum (FWHM) are respectively referred to as θ.sub.1 and θ.sub.2 (θ1<θ2) in the peaks of (002) and (200) plane of an x-ray diffraction (XRD) pattern using Cu Kα1 radiation (wavelength Δ=1.5406 Å), (θ.sub.2−θ.sub.0)/(θ.sub.0−θ.sub.1) is greater than 0.54 to 1.0 or less.

A dielectric material includes a main component represented by (Ba.sub.1-xCa.sub.x)(Ti.sub.1-yZr.sub.y)O.sub.3, (Ba.sub.1-xCa.sub.x)(Ti.sub.1-ySn.sub.y)O.sub.3, or (Ba.sub.1-xCa.sub.x)(Ti.sub.1-yHf.sub.y)O.sub.3 (0≤x≤1 and 0≤y≤0.05) and a subcomponent. When an angle corresponding to a maximum peak is referred to as θ.sub.0 and angles corresponding to a full width at half maximum (FWHM) are respectively referred to as θ.sub.1 and θ.sub.2 (θ1<θ2) in the peaks of (002) and (200) plane of an x-ray diffraction (XRD) pattern using Cu Kα1 radiation (wavelength Δ=1.5406 Å), (θ.sub.2−θ.sub.0)/(θ.sub.0−θ.sub.1) is greater than 0.54 to 1.0 or less.

A multilayer ceramic electronic component includes first and second multilayer ceramic electronic component bodies facing each other in a length direction that connects first and second end surfaces. A first metal terminal is connected to a first outer electrode. A second metal terminal is connected to a fourth outer electrode. An outer casing covers the first and second multilayer ceramic electronic component bodies, and at least a portion of each of the first and second metal terminals. A third metal terminal is exposed from the outer casing.

A multilayer ceramic electronic component includes first and second multilayer ceramic electronic component bodies facing each other in a length direction that connects first and second end surfaces. A first metal terminal is connected to a first outer electrode. A second metal terminal is connected to a fourth outer electrode. An outer casing covers the first and second multilayer ceramic electronic component bodies, and at least a portion of each of the first and second metal terminals. A third metal terminal is exposed from the outer casing.

A ceramic electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains has a core-dual shell structure having a core and a dual shell. The dual shell includes a first shell surrounding at least a portion of the core, and a second shell surrounding at least a portion of the first shell, and a concentration of a rare earth element included in the second shell is more than 1.3 times to less than 3.8 times a concentration of a rare earth element included in the first shell.