A biaxially stretched polypropylene film for capacitors which has protrusions on both sides and has a thickness (t1[μm]) of 1 μm to 3 μm, wherein Formulae (1) to (4) are satisfied by an A-side as one film surface and a B-side as another film surface:
|Pa−Pb|≧200;  (1)
0.350≦Pa/SRzA≦0.700;  (2)
500 nm≦SRzA≦1,200 nm;  (3)
50 nm≦SRzB≦500 nm;  (4)
wherein, in Formulae (1) to (4), Pa is a number per 0.1 mm.sup.2 of protrusions on the A-side, Pb is a number per 0.1 mm.sup.2 of protrusions on the B-side, SRzA is a ten-point average roughness of the A-side, and SRzB is a ten-point average roughness of the B-side.

A metallized film capacitor includes: a metallized film columnar body including two metallized films that are laminated and wound, the two metalized films each including a vapor-deposited metal film with a plurality of vapor-deposition-free slits and fuse portions each interposed between the vapor-deposition-free slits, and a polyvinylidene fluoride dielectric film, the metallized film columnar body having two electrode extraction surfaces; metal-sprayed parts disposed respectively on the two electrode extraction surfaces: and outgoing terminals joined respectively to the metal-sprayed parts. Each of the two metallized films has a shape with successive sloped ridges and valleys in a cross-section orthogonal to a winding direction, and the two metallized films are laminated such that the ridges and valleys of one of the metallized films are aligned with the ridges and valleys of the other one of the metallized films.

A film capacitor includes a pair of mutually opposed dielectric films; and evaporated electrodes respectively provided on the pair of dielectric films. The evaporated electrode provided on one of the pair of dielectric films includes slits that are regions in which the evaporated electrode is not provided, a plurality of electrode regions defined by the slits, and at least one fuse portion that connects the electrode regions adjacent to each other. The one dielectric film, on which the evaporated electrode including the slits and the at least one fuse portion is provided, includes at least one through portion that extends through the one dielectric film, the at least one through portion being provided in at least one area corresponding to at least one of the slits adjacent to the at least one fuse portion.

A film capacitor includes a pair of mutually opposed dielectric films; and evaporated electrodes respectively provided on the pair of dielectric films. The evaporated electrode provided on one of the pair of dielectric films includes slits that are regions in which the evaporated electrode is not provided, a plurality of electrode regions defined by the slits, and at least one fuse portion that connects the electrode regions adjacent to each other. The one dielectric film, on which the evaporated electrode including the slits and the at least one fuse portion is provided, includes at least one through portion that extends through the one dielectric film, the at least one through portion being provided in at least one area corresponding to at least one of the slits adjacent to the at least one fuse portion.

A thin film capacitor includes a pair of electrode layers, a dielectric layer existing between the pair of electrode layers, and a ceramic layer disposed on a surface opposite to the dielectric layer of at least one of the electrode layers.

A thin film capacitor includes a pair of electrode layers, a dielectric layer existing between the pair of electrode layers, and a ceramic layer disposed on a surface opposite to the dielectric layer of at least one of the electrode layers.

A film capacitor includes: a film winding portion formed by winding at least one metalized film that includes a dielectric film and a metal film provided on a surface of the dielectric film; a pair of metallikon electrodes formed respectively on end faces of the film winding portion in a winding axis direction of the film winding portion; and a pair of busbars each of which is joined to a corresponding one of the metallikon electrodes via a joining metal. Each of the busbars is plate-shaped to cover an outer surface of the corresponding metallikon electrode. At least one of the metallikon electrodes has a ridge that is formed on the outer surface of the metallikon electrode to be convex in the winding axis direction toward the corresponding busbar. In the corresponding busbar, there is formed a ridge-receiving portion in which the ridge of the metallikon electrode is received.

A film capacitor includes: a film winding portion formed by winding at least one metalized film that includes a dielectric film and a metal film provided on a surface of the dielectric film; a pair of metallikon electrodes formed respectively on end faces of the film winding portion in a winding axis direction of the film winding portion; and a pair of busbars each of which is joined to a corresponding one of the metallikon electrodes via a joining metal. Each of the busbars is plate-shaped to cover an outer surface of the corresponding metallikon electrode. At least one of the metallikon electrodes has a ridge that is formed on the outer surface of the metallikon electrode to be convex in the winding axis direction toward the corresponding busbar. In the corresponding busbar, there is formed a ridge-receiving portion in which the ridge of the metallikon electrode is received.

Disclosed herein is a thin film capacitor that includes a capacitive insulating film having first and second surfaces opposite to each other, a first capacitive electrode covering the first surface of the capacitive insulating film, and a second capacitive electrode covering the second surface of the capacitive insulating film and including a plurality of capacitor areas divided by a slit and a plurality of fuse areas connecting two of adjacent capacitor areas. The second capacitive electrode has a structure in which a plurality of conductor films including a first conductor film and a second conductor film lower in electrical resistivity than the first conductor film are laminated.

Disclosed herein is a thin film capacitor that includes a capacitive insulating film having first and second surfaces opposite to each other, a first capacitive electrode covering the first surface of the capacitive insulating film, and a second capacitive electrode covering the second surface of the capacitive insulating film and including a plurality of capacitor areas divided by a slit and a plurality of fuse areas connecting two of adjacent capacitor areas. The second capacitive electrode has a structure in which a plurality of conductor films including a first conductor film and a second conductor film lower in electrical resistivity than the first conductor film are laminated.