Patent classifications
H01G4/232
MULTILAYER CERAMIC CAPACITOR
A multilayer ceramic capacitor includes a stacked body and external electrodes. The stacked body includes stacked dielectric layers and internal electrodes. The external electrodes are disposed on lateral surfaces of the stacked body and are connected to the internal electrodes. The dielectric layers include outer layer portions and an effective layer portion. Each outer layer portion is adjacent to a corresponding main surface of the stacked body. Each outer layer portion is a dielectric layer located between a corresponding main surface and an internal electrode closest to the main surface. A ratio of a dimension of the effective layer portion in a stacking direction to a dimension of the stacked body in the stacking direction is not less than about 53% and not more than about 83%.
Metal insulator metal (MIM) structure and manufacturing method thereof
A MIM structure and manufacturing method thereof are provided. The MIM structure includes a substrate having a first surface and a metallization structure over the substrate. The metallization structure includes a bottom electrode layer, a dielectric layer on the bottom electrode layer, a ferroelectric layer on the dielectric layer, a top electrode layer on the ferroelectric layer, a first contact electrically coupled to the top electrode layer, and a second contact penetrating the dielectric layer and the ferroelectric layer, electrically coupled to the bottom electrode layer.
ELECTRONIC COMPONENT
A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers laminated alternately on each other, and external electrode layers on both end surfaces of the multilayer body in a length direction orthogonal or substantially orthogonal to a lamination direction, and each connected to the internal electrode layers. The dielectric layers each include at least one of Ca, Zr, or Ti, the internal electrode layers each include Cu, and the external electrode layers each include a sintered electrode layer in which dielectric particles including at least one of Ca, Zr, or Ti are included in a metal including Ni, and at least one of a Cu-plated layer, a Ni-plated layer, and a Sn-plated layer on an outer side of the sintered electrode layer.
ELECTRONIC COMPONENT
A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers laminated alternately on each other, and external electrode layers on both end surfaces of the multilayer body in a length direction orthogonal or substantially orthogonal to a lamination direction, and each connected to the internal electrode layers. The dielectric layers each include at least one of Ca, Zr, or Ti, the internal electrode layers each include Cu, and the external electrode layers each include a sintered electrode layer in which dielectric particles including at least one of Ca, Zr, or Ti are included in a metal including Ni, and at least one of a Cu-plated layer, a Ni-plated layer, and a Sn-plated layer on an outer side of the sintered electrode layer.
Multilayer capacitor having open mode electrode configuration and flexible terminations
A multilayer ceramic capacitor may include a monolithic body and interleaved first and second pluralities of electrodes extending from the first and second ends, respectively, of the monolithic body towards opposite ends of the monolithic body. A first margin distance and a second margin distance may be formed, respectively, between the electrodes and the opposite ends of the monolithic body. First and second external terminations may be respectively disposed along the first end and second end of the monolithic body and respectively connected with the first and second plurality of electrodes. A margin ratio between a length of the monolithic body and the first margin distance and/or second margin distance may be less than about 10. At least one of the first external termination or the second external termination may include a conductive polymeric composition.
Multilayer ceramic electronic component
A multilayer ceramic electronic component includes a ceramic body including pluralities of first and second internal electrodes alternately disposed to face each other with respective dielectric layers interposed therebetween. First and second external electrodes are disposed on external surfaces of the ceramic body and are respectively electrically connected to the first and second external electrodes. A first dummy electrode is disposed in a margin portion of the ceramic body adjacent the first internal electrode in a third direction, and a second dummy electrode is disposed in a margin portion of the ceramic body adjacent the second internal electrode in the third direction. A distance (Ld) between the first and second dummy electrodes in a second direction, and a length (Lm) of each margin portion between one of the first and second internal electrodes and an external surface of the ceramic body in the second direction, satisfy Ld≤Lm.
Multilayer ceramic electronic component
A multilayer ceramic electronic component includes a ceramic body including pluralities of first and second internal electrodes alternately disposed to face each other with respective dielectric layers interposed therebetween. First and second external electrodes are disposed on external surfaces of the ceramic body and are respectively electrically connected to the first and second external electrodes. A first dummy electrode is disposed in a margin portion of the ceramic body adjacent the first internal electrode in a third direction, and a second dummy electrode is disposed in a margin portion of the ceramic body adjacent the second internal electrode in the third direction. A distance (Ld) between the first and second dummy electrodes in a second direction, and a length (Lm) of each margin portion between one of the first and second internal electrodes and an external surface of the ceramic body in the second direction, satisfy Ld≤Lm.
Multi-layer ceramic electronic component, circuit board, and method of producing a multi-layer ceramic electronic component
A multi-layer ceramic electronic component includes a ceramic body and an external electrode. The ceramic body includes an end surface facing in a first direction, and internal electrodes exposed from the end surface and laminated in a second direction orthogonal to the first direction. The external electrode is provided on the end surface and includes two protrusions that are formed along two peripheral portions of the end surface and protrude in the first direction, the two peripheral portions being disposed in a third direction orthogonal to the first direction and the second direction.
Electronic component
A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers laminated alternately on each other, and external electrode layers provided on opposing end surfaces of the multilayer body in a length direction orthogonal or substantially orthogonal to a lamination direction, and each connected with the internal electrode layers, in which the dielectric layers each include at least one of Ca, Zr, or Ti, the internal electrode layers each include Cu, and when a dimension in the lamination direction of the multilayer body is defined as T0, a dimension in the length direction of the multilayer body is defined as L0, and a dimension in a width direction orthogonal or substantially orthogonal to the lamination direction and the length direction is defined as W0, a relationship of L0<W0<T0 is satisfied.
Electronic component
A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers laminated alternately on each other, and external electrode layers provided on opposing end surfaces of the multilayer body in a length direction orthogonal or substantially orthogonal to a lamination direction, and each connected with the internal electrode layers, in which the dielectric layers each include at least one of Ca, Zr, or Ti, the internal electrode layers each include Cu, and when a dimension in the lamination direction of the multilayer body is defined as T0, a dimension in the length direction of the multilayer body is defined as L0, and a dimension in a width direction orthogonal or substantially orthogonal to the lamination direction and the length direction is defined as W0, a relationship of L0<W0<T0 is satisfied.