A metal-insulator-metal (MIM) capacitor structure and a method for forming the same are provided. The MIM capacitor structure includes a first electrode layer formed over a substrate, and a first spacer formed on a sidewall of the first electrode layer. The MIM capacitor structure also includes a first dielectric layer formed on the first spacers, and an end of the first dielectric layer is in direct contact with the first pacer.

The invention relates to a capacitor housing for electric circuits. The capacitor housing has a closed collar, into which busbars extend, to guarantee a clean assembly and subsequent filling with resin. The collar has pairs of through openings on the upper side and the lower side for the passage of a sleeve part through each, an upper and lower sleeve part each contacting as a terminal device one of the busbars and clamping same between the end faces of the sleeve parts. The invention also relates to a link capacitor with a housing of this kind.

A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween and disposed in point-symmetry with each other; first and second connection electrodes penetrating the body in a direction perpendicular to the dielectric layer and connected to the first internal electrode; third and fourth connection electrodes penetrating the body in a direction perpendicular to the dielectric layer and connected to the second internal electrode; first and second external electrodes disposed on both surfaces of the body and connected to the first and second connection electrodes; and third and fourth external electrodes spaced apart from the first and second external electrodes and connected to the third and fourth connection electrodes, and the first and second internal electrodes include a region in which an electrode is not disposed.

An electronic component includes a glass base in which through holes are formed passing through both surfaces thereof; an insulating resin layer laminated on each of both surfaces of the glass base and including a copper plated layer formed therein; and a capacitor including a lower electrode formed on the copper plated layer, a dielectric layer laminated on the lower electrode, and an upper electrode laminated on the dielectric layer. In the electronic component, the upper electrode has a region that is parallel to the copper plated layer and is formed so as to be smaller than a region of the dielectric layer parallel to the surface of the copper plated layer or a region of the lower electrode parallel to the surface of the copper plated layer.

An electronic component includes a glass base in which through holes are formed passing through both surfaces thereof; an insulating resin layer laminated on each of both surfaces of the glass base and including a copper plated layer formed therein; and a capacitor including a lower electrode formed on the copper plated layer, a dielectric layer laminated on the lower electrode, and an upper electrode laminated on the dielectric layer. In the electronic component, the upper electrode has a region that is parallel to the copper plated layer and is formed so as to be smaller than a region of the dielectric layer parallel to the surface of the copper plated layer or a region of the lower electrode parallel to the surface of the copper plated layer.

A power electronics system for an electric motor of a motor vehicle drive includes a first busbar, a second busbar which is electrically insulated relative to the first busbar, and at least one capacitor. The at least one capacitor, by way of its first electrode, makes contact with a plate-like receiving region of the first busbar and, by way of its second electrode, makes contact with a plate-like receiving region of the second busbar. At least one of the two busbars is of hollow design, with direct formation of a cooling duct.

A capacitor includes a capacitor element, an electrode disposed on an end face of the capacitor element, a bus bar connected to the electrode, and a case housing the capacitor element. The bus bar is extended from an opening of the case to outside the case. Outside the case, the bus bar includes an extension part and a connection terminal. The extension part extends in a first direction along a side face of the case. The connection terminal is connected to the extension part. Further, the case includes a supporting part disposed on the side face of the case. The supporting part supports the bus bar to form a space between the side face and the extension part.

A capacitor includes a capacitor element, an electrode disposed on an end face of the capacitor element, a bus bar connected to the electrode, and a case housing the capacitor element. The bus bar is extended from an opening of the case to outside the case. Outside the case, the bus bar includes an extension part and a connection terminal. The extension part extends in a first direction along a side face of the case. The connection terminal is connected to the extension part. Further, the case includes a supporting part disposed on the side face of the case. The supporting part supports the bus bar to form a space between the side face and the extension part.

A filtered feedthrough assembly includes a ferrule configured to be installed in an AIMD housing. An insulator is disposed within a ferrule opening. A conductive pathway is disposed within a passageway through the insulator. A filter capacitor is disposed on a device side having active and ground electrode plates disposed within a capacitor dielectric k greater than 0 and less than 1,000. A capacitor active metallization is electrically connected to the active electrode plates. A ground capacitor metallization is electrically connected to the ground electrode plates. The filter capacitor is the first filter capacitor electrically connected to the conductive pathway coming from a body fluid side into the device side. An active electrical connection electrically connects the conductive pathway to the capacitor active metallization. A ground electrical connection electrically connects the ground capacitor metallization to the ferrule. The filter capacitor is a flat-through or an X2Y attenuator filter capacitor.

A filtered feedthrough assembly includes a ferrule configured to be installed in an AIMD housing. An insulator is disposed within a ferrule opening. A conductive pathway is disposed within a passageway through the insulator. A filter capacitor is disposed on a device side having active and ground electrode plates disposed within a capacitor dielectric k greater than 0 and less than 1,000. A capacitor active metallization is electrically connected to the active electrode plates. A ground capacitor metallization is electrically connected to the ground electrode plates. The filter capacitor is the first filter capacitor electrically connected to the conductive pathway coming from a body fluid side into the device side. An active electrical connection electrically connects the conductive pathway to the capacitor active metallization. A ground electrical connection electrically connects the ground capacitor metallization to the ferrule. The filter capacitor is a flat-through or an X2Y attenuator filter capacitor.