A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween and disposed in point-symmetry with each other; first and second connection electrodes penetrating the body in a direction perpendicular to the dielectric layer and connected to the first internal electrode; third and fourth connection electrodes penetrating the body in a direction perpendicular to the dielectric layer and connected to the second internal electrode; first and second external electrodes disposed on both surfaces of the body and connected to the first and second connection electrodes; and third and fourth external electrodes spaced apart from the first and second external electrodes and connected to the third and fourth connection electrodes, and the first and second internal electrodes include a region in which an electrode is not disposed.

A thin film capacitor includes: a body formed by alternately stacking first and second electrode layers, with dielectric layers therebetween on a substrate. A plurality of first vias are disposed in the body and electrically connected to the first electrode layers. A plurality of second vias are disposed in the body, electrically connected to the second electrode layers, and disposed alternately with the first vias. A first connection electrode is disposed on an upper surface of the body and connected to the plurality of first vias, a second connection electrode is disposed on the upper surface of the body and connected to the plurality of second vias, and first and second electrode pads are disposed on the first and second connection electrodes, respectively, and formed to not overlap the plurality of first and second vias.

A method of manufacturing a dielectric slurry, includes supplying a dielectric slurry including dielectric particles and a solvent to a slurry supply module, dispersing the dielectric slurry by inserting the dielectric slurry into a particle dispersing module, classifying the dielectric particles according to particle size by inserting the dispersed dielectric slurry into a classifying module, recovering at least a portion of the dielectric particles to the slurry supply module, and redispersing the dielectric slurry including the dielectric particles recovered to the slurry supply module to the particle dispersing module.

A method of manufacturing a dielectric slurry, includes supplying a dielectric slurry including dielectric particles and a solvent to a slurry supply module, dispersing the dielectric slurry by inserting the dielectric slurry into a particle dispersing module, classifying the dielectric particles according to particle size by inserting the dispersed dielectric slurry into a classifying module, recovering at least a portion of the dielectric particles to the slurry supply module, and redispersing the dielectric slurry including the dielectric particles recovered to the slurry supply module to the particle dispersing module.

An AC capacitor including a first electrode with an electrically conductive rod protruding from surface of the first electrode, a second electrode including an opening, a bobbin located between the first and the second electrode the bobbin includes a hollow central section. The axis of the electrically conductive rod protruding from surface of the first electrode is coaxial with axis of the hollow bobbin and the electrically conductive rod passes through the hollow central section of the bobbin and through the opening in the second electrode allowing current flow.

An AC capacitor including a first electrode with an electrically conductive rod protruding from surface of the first electrode, a second electrode including an opening, a bobbin located between the first and the second electrode the bobbin includes a hollow central section. The axis of the electrically conductive rod protruding from surface of the first electrode is coaxial with axis of the hollow bobbin and the electrically conductive rod passes through the hollow central section of the bobbin and through the opening in the second electrode allowing current flow.

It has been discovered that poor TDDB reliability of microelectronic device capacitors with organic polymer material in the capacitor dielectric is due to water molecules infiltrating the organic polymer material when the microelectronic device is exposed to water vapor in the operating ambient. Water molecule infiltration from water vapor in the ambient is effectively reduced by a moisture barrier comprising a layer of aluminum oxide formed by an atomic layer deposition (ALD) process. A microelectronic device includes a capacitor with organic polymer material in the capacitor dielectric and a moisture barrier with a layer of aluminum oxide formed by an ALD process.

A case-mold-type capacitor includes a capacitor element, first and second bus bars connected to the first and second electrodes of the capacitor element, a case accommodating the capacitor element and the first and second bus bars, and a mold resin filling the case therein. The case has a cutaway portion provided therein. A sealing plate joined to the case so as to seal the cutaway portion. The first and second bus bars pass through the sealing plate and are fixed to the sealing plate. The case-mold-type capacitor improves dimensional accuracy between terminal portions of the first and second bus bars without increasing material cost, and has high reliability.

A case-mold-type capacitor includes a capacitor element, first and second bus bars connected to the first and second electrodes of the capacitor element, a case accommodating the capacitor element and the first and second bus bars, and a mold resin filling the case therein. The case has a cutaway portion provided therein. A sealing plate joined to the case so as to seal the cutaway portion. The first and second bus bars pass through the sealing plate and are fixed to the sealing plate. The case-mold-type capacitor improves dimensional accuracy between terminal portions of the first and second bus bars without increasing material cost, and has high reliability.

A power electronics system has a housing, a cooling device, a power semiconductor module and a capacitor device, wherein a cooling section of a capacitor connection device is in thermally conducting contact with a cooling surface of the cooling device.