A method for manufacturing a capacitor includes a step of forming a case integrated with a terminal unit designed to be connected with an external terminal, and a step of housing a capacitor element in the case so that the terminal unit is electrically connected to the capacitor element. The step of forming the case includes heating a metal mold to a temperature less than or equal to a glass transition temperature of a thermoplastic resin that is a material for the case. The metal mold internally has a mold part that is a hollow part having a shape of the case. And the step of forming the case further includes, after the heating of the metal mold and inserting the terminal unit into the mold part, injecting the thermoplastic resin in a molten state into the mold part of the metal mold.

A method for manufacturing a capacitor includes a step of forming a case integrated with a terminal unit designed to be connected with an external terminal, and a step of housing a capacitor element in the case so that the terminal unit is electrically connected to the capacitor element. The step of forming the case includes heating a metal mold to a temperature less than or equal to a glass transition temperature of a thermoplastic resin that is a material for the case. The metal mold internally has a mold part that is a hollow part having a shape of the case. And the step of forming the case further includes, after the heating of the metal mold and inserting the terminal unit into the mold part, injecting the thermoplastic resin in a molten state into the mold part of the metal mold.

A hermetically sealed filtered feedthrough assembly attachable to an AIMD includes an insulator hermetically sealing a ferrule opening of an electrically conductive ferrule with a gold braze. A co-fired and electrically conductive sintered paste is disposed within and hermetically seals at least one via hole extending in the insulator. At least one capacitor is disposed on the device side. An active electrical connection electrically connects a capacitor active metallization and the sintered paste. A ground electrical connection electrically connects the gold braze to a capacitor ground metallization, wherein at least a portion of the ground electrical connection physically contacts the gold braze. The dielectric of the capacitor may be less than 1000 k. The ferrule may include an integrally formed peninsula portion extending into the ferrule opening spatially aligned with a ground passageway and metallization of an internally grounded feedthrough capacitor. The sintered paste may be of substantially pure platinum.

A hermetically sealed filtered feedthrough assembly attachable to an AIMD includes an insulator hermetically sealing a ferrule opening of an electrically conductive ferrule with a gold braze. A co-fired and electrically conductive sintered paste is disposed within and hermetically seals at least one via hole extending in the insulator. At least one capacitor is disposed on the device side. An active electrical connection electrically connects a capacitor active metallization and the sintered paste. A ground electrical connection electrically connects the gold braze to a capacitor ground metallization, wherein at least a portion of the ground electrical connection physically contacts the gold braze. The dielectric of the capacitor may be less than 1000 k. The ferrule may include an integrally formed peninsula portion extending into the ferrule opening spatially aligned with a ground passageway and metallization of an internally grounded feedthrough capacitor. The sintered paste may be of substantially pure platinum.

A capacitor provides a plurality of selectable capacitance values, by selective connection of six capacitor sections of a capacitive element each having a capacitance value. The capacitor sections are provided in a plurality of wound cylindrical capacitive elements. Two vertically stacked wound cylindrical capacitance elements may each provide three capacitor sections. There may be six separately wound cylindrical capacitive elements each providing a capacitor section. The capacitor sections have a common element terminal.

A capacitor provides a plurality of selectable capacitance values, by selective connection of six capacitor sections of a capacitive element each having a capacitance value. The capacitor sections are provided in a plurality of wound cylindrical capacitive elements. Two vertically stacked wound cylindrical capacitance elements may each provide three capacitor sections. There may be six separately wound cylindrical capacitive elements each providing a capacitor section. The capacitor sections have a common element terminal.

An electronic device includes first and second capacitors, a case, a coil, and first to fourth conductive terminals. The first capacitor includes first and second terminal electrodes. The second capacitor includes third and fourth terminal electrodes. The case includes an accommodation recess for accommodating the first and second capacitors. The coil is separated from the first and second capacitors by a part of the case and disposed outside the accommodation recess. The first terminal is connected to the first electrode and partly disposed on a mounting-side bottom surface of the case. The second terminal is connected to one end of the coil and the second electrode and partly disposed on the surface. The third terminal is connected to the other end of the coil and the third electrode and partly disposed on the surface. The fourth terminal is connected to the fourth electrode and partly disposed on the surface.

The present invention is directed to an EMI feedthrough filter terminal assembly. The EMI feedthrough filter terminal assembly comprises: a feedthrough filter capacitor having a plurality of first electrode layers and a plurality of second electrode layers, a first passageway therethrough having a first termination surface conductively coupling the plurality of first electrode layers, a second termination surface conductively coupling the plurality of second electrode layers; a feedthrough ferrule conductively coupled to the feedthrough filter capacitor via the second termination surface; at least one conductive terminal pin extending through the passageway in conductive relation with the plurality of first electrode layers; an insulator fixed to the feedthrough ferrule for conductively isolating the conductive terminal pin from the feedthrough ferrule; and a laminated insulative layer between the insulator and the feedthrough filter capacitor.

The present invention is directed to an EMI feedthrough filter terminal assembly. The EMI feedthrough filter terminal assembly comprises: a feedthrough filter capacitor having a plurality of first electrode layers and a plurality of second electrode layers, a first passageway therethrough having a first termination surface conductively coupling the plurality of first electrode layers, a second termination surface conductively coupling the plurality of second electrode layers; a feedthrough ferrule conductively coupled to the feedthrough filter capacitor via the second termination surface; at least one conductive terminal pin extending through the passageway in conductive relation with the plurality of first electrode layers; an insulator fixed to the feedthrough ferrule for conductively isolating the conductive terminal pin from the feedthrough ferrule; and a laminated insulative layer between the insulator and the feedthrough filter capacitor.

A metal-insulator-metal (MIM) capacitor structure and a method for forming the same are provided. The MIM capacitor structure includes a substrate, and the substrate includes a capacitor region and a non-capacitor region. The MIM capacitor structure includes a first electrode layer formed over the substrate, and a first spacer formed on a sidewall of the first electrode layer. The MIM capacitor structure includes a second electrode layer formed over the first electrode layer, and a second spacer formed on a sidewall of the second electrode layer. The second spacer is in direct contact with an interface between the second electrode layer and a first dielectric layer.