A capacitor configured to be surface-mounted on a predetermined mounting surface, and includes a capacitor element including an electrode at each of both end faces of the capacitor element and a bus bar connected to the electrode. The bus bar includes a plurality of connection terminal portions that are arranged in a comb-teeth shape. At least one of the plurality of connection terminal portions is disposed on a connection portion disposed in the predetermined mounting surface and is electrically connected to the connection portion.

A passive component includes a body including a dummy portion and a device portion. The dummy portion and the device portion extend in a first direction and are arranged such that a longitudinal axis of the device portion is offset from a longitudinal axis of the body in a second direction perpendicular to the first direction. The passive component further includes first and second electrical contacts on at least one surface of the body.

An electronic component includes a substrate including electrode pads disposed on an upper surface; and a plurality of multilayer capacitors mounted on the substrate and including external electrodes connected to the electrode pads. At least one multilayer capacitor among the plurality of multilayer capacitors is a multilayer capacitor of a horizontally stacked structure.

An electronic component includes a substrate including electrode pads disposed on an upper surface; and a plurality of multilayer capacitors mounted on the substrate and including external electrodes connected to the electrode pads. At least one multilayer capacitor among the plurality of multilayer capacitors is a multilayer capacitor of a horizontally stacked structure.

The present invention is directed to a multilayer ceramic capacitor. The capacitor comprises a top surface, a bottom surface, and at least one side surface connecting the top surface and the bottom surface. The capacitor comprises a main body containing a plurality of alternating dielectric layers and internal electrode layers comprising a first plurality of internal electrode layers and a second plurality of internal electrode layers. A first through-hole conductive via electrically connects the first plurality of internal electrode layers to a first external terminal on the top surface and a first external terminal on the bottom surface of the capacitor. A second through-hole conductive via electrically connects the second plurality of internal electrode layers to a second external terminal on the top surface and a second external terminal on the bottom surface of the capacitor. The at least one side surface does not include an external terminal.

The present invention is directed to a multilayer ceramic capacitor. The capacitor comprises a top surface, a bottom surface, and at least one side surface connecting the top surface and the bottom surface. The capacitor comprises a main body containing a plurality of alternating dielectric layers and internal electrode layers comprising a first plurality of internal electrode layers and a second plurality of internal electrode layers. A first through-hole conductive via electrically connects the first plurality of internal electrode layers to a first external terminal on the top surface and a first external terminal on the bottom surface of the capacitor. A second through-hole conductive via electrically connects the second plurality of internal electrode layers to a second external terminal on the top surface and a second external terminal on the bottom surface of the capacitor. The at least one side surface does not include an external terminal.

A multilayer capacitor includes: a first internal electrode layer including first and second internal electrodes spaced apart from each other with an insulating portion interposed therebetween; a second internal electrode layer including a third internal electrode; a body including the first and second internal electrode layers alternately disposed with respective dielectric layers interposed therebetween; first and second external electrodes disposed on the body to be electrically connected to the first and second internal electrodes, respectively; a connection electrode penetrating through the body to thereby be electrically connected to the third internal electrode; and a third external electrode disposed on the body to be electrically connected to the connection electrode.

The application of a titanium hydride coating on a ceramic, preferably an alumina ceramic, as a facile and inexpensive approach to bond gold to the ceramic during brazing is described. During the brazing process, the deposited titanium hydride is first partially decomposed to form pure titanium intermixed with titanium hydride. The combination of pure titanium and titanium hydride contributes to improved adhesion of gold with the alumina ceramic without any detrimental reaction between pure titanium and gold. The titanium hydride coating can be applied by dip/spray/paint coating.

The application of a titanium hydride coating on a ceramic, preferably an alumina ceramic, as a facile and inexpensive approach to bond gold to the ceramic during brazing is described. During the brazing process, the deposited titanium hydride is first partially decomposed to form pure titanium intermixed with titanium hydride. The combination of pure titanium and titanium hydride contributes to improved adhesion of gold with the alumina ceramic without any detrimental reaction between pure titanium and gold. The titanium hydride coating can be applied by dip/spray/paint coating.

A capacitor comprises a body of dielectric material in which an anode and a cathode are arranged in a stack. A capacitance-forming layer of the dielectric material is arranged between the anode and the cathode. The capacitor further comprises an electro-mechanical connection, which comprises a hole which extends into the body in the direction of the stack. The hole includes an electrical connector. The electrical connector is in electrical contact with either the anode or the cathode, comprises a compliant element, and is suitable for holding a contact pin. The compliant element is configured to decouple the body from mechanical forces applied to the contact pin. The compliant element reduces mechanical stresses experienced by the body of the capacitor. Also provided is a capacitor assembly comprising two or more such capacitors; a kit for assembling such capacitors, and the use of an electrical termination to protect a capacitor from stress.