Capacitive energy storage devices (CESDs) are disclosed, along with methods of making and using the CESDs. A CESD includes an array of electrodes with spaces between the electrodes. A dielectric material occupies spaces between the electrodes; regions of the dielectric material located between adjacent electrodes define capacitive elements. The disclosed CESDs are useful as energy storage devices and/or memory storage devices.

A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These layers are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. A pair of side surfaces facing each other in the first axis direction of the element body is respectively equipped with an insulating layer. A pair of end surfaces facing each other in the second axis direction of the element body is respectively equipped with an external electrode electrically connected to the internal electrode layer. The insulating layer has a mountain portion formed on a peripheral edge of the side surface and a plane portion of a central portion of the side surface.

A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These layers are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. A pair of side surfaces facing each other in the first axis direction of the element body is respectively equipped with an insulating layer. A pair of end surfaces facing each other in the second axis direction of the element body is respectively equipped with an external electrode electrically connected to the internal electrode layer. The insulating layer has a mountain portion formed on a peripheral edge of the side surface and a plane portion of a central portion of the side surface.

The application of a titanium hydride coating on a ceramic, preferably an alumina ceramic, as a facile and inexpensive approach to bond gold to the ceramic during brazing is described. During the brazing process, the deposited titanium hydride is first partially decomposed to form pure titanium intermixed with titanium hydride. The combination of pure titanium and titanium hydride contributes to improved adhesion of gold with the alumina ceramic without any detrimental reaction between pure titanium and gold. The titanium hydride coating can be applied by dip/spray/paint coating.

Systems and methods in accordance with embodiments of the invention implement micro- and nanoscale capacitors that incorporate a conductive element that conforms to the shape of an array elongated bodies. In one embodiment, a capacitor that incorporates a conductive element that conforms to the shape of an array of elongated bodies includes: a first conductive element that conforms to the shape of an array of elongated bodies; a second conductive element that conforms to the shape of an array of elongated bodies; and a dielectric material disposed in between the first conductive element and the second conductive element, and thereby physically separates them.

Systems and methods in accordance with embodiments of the invention implement micro- and nanoscale capacitors that incorporate a conductive element that conforms to the shape of an array elongated bodies. In one embodiment, a capacitor that incorporates a conductive element that conforms to the shape of an array of elongated bodies includes: a first conductive element that conforms to the shape of an array of elongated bodies; a second conductive element that conforms to the shape of an array of elongated bodies; and a dielectric material disposed in between the first conductive element and the second conductive element, and thereby physically separates them.

A multilayer ceramic capacitor includes a laminated body including an inner layer portion including ceramic dielectric layers and internal electrodes, and outer layer portions including ceramic dielectric layers. External electrodes connected to the internal electrodes are provided on both ends of the laminated body. The main constituent of the inner layer portion is a perovskite-type compound represented by ABO.sub.3. The outer layer portions include first outer layers and second outer layers respectively containing oxides that differ from each other in main constituents, and boundary reaction layers are provided between the first outer layers and the second outer layers. First ceramic dielectric layers outside the boundary reaction layers differ in color from second ceramic dielectric layers inside the boundary reaction layers.

A first substrate includes a substrate main body including a first principal surface and a second principal surface opposing each other in a first direction, first and second connection electrodes disposed on the first principal surface, and third and fourth connection electrodes disposed on the second principal surface. A first metal terminal includes a first connection portion electrically connected with the first connection electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion electrically connected with the fourth connection electrode, and a second leg portion extending from the second connection portion. A multilayer capacitor is disposed on the first principal surface side of the first substrate, and an overcurrent protection device is disposed on the second principal surface side of the first substrate. The second connection electrode and the third connection electrode are electrically connected to each other.

A first substrate includes a substrate main body including a first principal surface and a second principal surface opposing each other in a first direction, first and second connection electrodes disposed on the first principal surface, and third and fourth connection electrodes disposed on the second principal surface. A first metal terminal includes a first connection portion electrically connected with the first connection electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion electrically connected with the fourth connection electrode, and a second leg portion extending from the second connection portion. A multilayer capacitor is disposed on the first principal surface side of the first substrate, and an overcurrent protection device is disposed on the second principal surface side of the first substrate. The second connection electrode and the third connection electrode are electrically connected to each other.

A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These layers are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. A pair of side surfaces facing each other in the first axis direction of the element body is respectively equipped with an insulating layer. A pair of end surfaces facing each other in the second axis direction of the element body is respectively equipped with an external electrode electrically connected to the internal electrode layer. The insulating layer has a mountain portion formed on a peripheral edge of the side surface and a plane portion of a central portion of the side surface.