A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and first and second internal electrodes disposed to be stacked in a third direction with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the third and fourth surfaces of the ceramic body, respectively. The first and second external electrodes comprise first and second base electrodes disposed to be in contact with the ceramic body and having a first conductive metal, and first and second conductive layers disposed on the first and second base electrodes and having a second conductive metal, and the first and second conductive layers have an average surface roughness (Ra) of 10.0 μm or more.

A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and first and second internal electrodes disposed to be stacked in a third direction with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the third and fourth surfaces of the ceramic body, respectively. The first and second external electrodes comprise first and second base electrodes disposed to be in contact with the ceramic body and having a first conductive metal, and first and second conductive layers disposed on the first and second base electrodes and having a second conductive metal, and the first and second conductive layers have an average surface roughness (Ra) of 10.0 μm or more.

An electronic component has capacitor chips where terminal electrodes are formed on both end surfaces, individual metal terminals connected to the terminal electrodes, an insulation case accommodating the capacitor chips, and a connecting portion interconnecting a plurality of the insulation cases.

A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately stacked with the dielectric layer interposed therebetween; and an external electrode including a first electrode layer disposed externally on the body, connected to the internal electrodes, and including a conductive metal, a glass, a low melting point metal having a lower melting point than the conductive metal, and a pore, and a second electrode layer covering the first electrode layer and including a conductive metal, a glass, and a pore, wherein porosity of the first electrode layer is higher than porosity of the second electrode layer.

A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately stacked with the dielectric layer interposed therebetween; and an external electrode including a first electrode layer disposed externally on the body, connected to the internal electrodes, and including a conductive metal, a glass, a low melting point metal having a lower melting point than the conductive metal, and a pore, and a second electrode layer covering the first electrode layer and including a conductive metal, a glass, and a pore, wherein porosity of the first electrode layer is higher than porosity of the second electrode layer.

A method for manufacturing a conductive paste, includes: an operation of forming a first mixture including a metal powder, a dispersant, and a hydrophobic solvent; an operation of forming a second mixture including a hydrophilic binder and a hydrophilic solvent; and an operation of forming a third mixture by mixing the first and second mixtures.

A capacitor component includes a body having a lamination portion in which first internal electrodes and second internal electrodes are alternately disposed to face each other in a first direction with dielectric layers disposed therebetween, and first and second margin portions disposed on respective opposing sides of the lamination portion in a second direction perpendicular to the first direction. First and second external electrodes are disposed on respective opposing sides of the body in a third direction and are electrically connected to the first and second internal electrodes, respectively. Each of the first and second margin portions includes a reinforcing pattern.

A capacitor component includes a body having a lamination portion in which first internal electrodes and second internal electrodes are alternately disposed to face each other in a first direction with dielectric layers disposed therebetween, and first and second margin portions disposed on respective opposing sides of the lamination portion in a second direction perpendicular to the first direction. First and second external electrodes are disposed on respective opposing sides of the body in a third direction and are electrically connected to the first and second internal electrodes, respectively. Each of the first and second margin portions includes a reinforcing pattern.

A multilayer ceramic capacitor includes a multilayer body and external electrodes. The multilayer body includes an inner layer portion including dielectric layers and internal electrode layers alternately stacked, and first and second outer layer portions on opposite sides of the inner layer portion in a stacking direction, side gap portions on opposite sides in a width direction, main surfaces on opposite sides in the stacking direction, side surfaces on opposite sides in the width direction, and end surfaces on opposite sides in a length direction. Each external electrode is provided at one end surfaces of the multilayer body, and extends from the end surface to a portion of the main surface. A difference in location between ends at the side surface of two adjacent internal electrode layers is about 0.5 μm or less. The second outer layer portion is thicker than the first outer layer portion.

A multilayer ceramic capacitor includes a multilayer body and external electrodes. The multilayer body includes an inner layer portion including dielectric layers and internal electrode layers alternately stacked, and first and second outer layer portions on opposite sides of the inner layer portion in a stacking direction, side gap portions on opposite sides in a width direction, main surfaces on opposite sides in the stacking direction, side surfaces on opposite sides in the width direction, and end surfaces on opposite sides in a length direction. Each external electrode is provided at one end surfaces of the multilayer body, and extends from the end surface to a portion of the main surface. A difference in location between ends at the side surface of two adjacent internal electrode layers is about 0.5 μm or less. The second outer layer portion is thicker than the first outer layer portion.