H01G4/248

ELECTRONIC COMPONENT
20230091570 · 2023-03-23 ·

An electronic component includes a main body including first and second end surfaces opposed to each other in a length direction, first and second side surfaces opposed to each other in a width direction, and first and second main surfaces opposed to each other in a thickness direction and that has a rectangular substantially rectangular parallelepiped shape, a first outer electrode provided at a first end side in the length direction of the main body, and a second outer electrode provided a second end side in the length direction of the main body. Each of the first and second outer electrodes includes first through fourth protrusions.

ELECTRONIC COMPONENT
20230091570 · 2023-03-23 ·

An electronic component includes a main body including first and second end surfaces opposed to each other in a length direction, first and second side surfaces opposed to each other in a width direction, and first and second main surfaces opposed to each other in a thickness direction and that has a rectangular substantially rectangular parallelepiped shape, a first outer electrode provided at a first end side in the length direction of the main body, and a second outer electrode provided a second end side in the length direction of the main body. Each of the first and second outer electrodes includes first through fourth protrusions.

ELECTRONIC COMPONENT
20220351905 · 2022-11-03 · ·

The electronic component includes an element body 4 having a plurality of side faces 5a to 5d along a circumference direction. The element body 4 includes insulation layers 16a to 16d covering the plurality of side faces 5a to 5d in a continuous manner along a circumference direction; and properties (a pore ratio, dielectric particle sizes, and so on) of the insulation layers 16a to 16d are substantially consistent along a circumference direction.

ELECTRONIC COMPONENT
20220351905 · 2022-11-03 · ·

The electronic component includes an element body 4 having a plurality of side faces 5a to 5d along a circumference direction. The element body 4 includes insulation layers 16a to 16d covering the plurality of side faces 5a to 5d in a continuous manner along a circumference direction; and properties (a pore ratio, dielectric particle sizes, and so on) of the insulation layers 16a to 16d are substantially consistent along a circumference direction.

Low profile passive components and devices and packages including the same

A passive component includes a body including a dummy portion and a device portion. The dummy portion and the device portion extend in a first direction and are arranged such that a longitudinal axis of the device portion is offset from a longitudinal axis of the body in a second direction perpendicular to the first direction. The passive component further includes first and second electrical contacts on at least one surface of the body.

Low profile passive components and devices and packages including the same

A passive component includes a body including a dummy portion and a device portion. The dummy portion and the device portion extend in a first direction and are arranged such that a longitudinal axis of the device portion is offset from a longitudinal axis of the body in a second direction perpendicular to the first direction. The passive component further includes first and second electrical contacts on at least one surface of the body.

Multilayer ceramic electronic component

A multilayer ceramic electronic component includes a multilayer body including layered ceramic layers and layered inner electrode layers and having a rectangular parallelepiped shape, and outer electrodes covering both end surfaces of the multilayer body and extending from both end surfaces to cover at least a portion of a first main surface of the multilayer body. The multilayer ceramic capacitor includes an insulating layer continuously extending from a ceramic layer at the first main surface of the multilayer body so as to cover end edge portions of both the outer electrodes located on the first main surface of the multilayer body, and t2>t1 is satisfied.

Multilayer ceramic electronic component

A multilayer ceramic electronic component includes a multilayer body including layered ceramic layers and layered inner electrode layers and having a rectangular parallelepiped shape, and outer electrodes covering both end surfaces of the multilayer body and extending from both end surfaces to cover at least a portion of a first main surface of the multilayer body. The multilayer ceramic capacitor includes an insulating layer continuously extending from a ceramic layer at the first main surface of the multilayer body so as to cover end edge portions of both the outer electrodes located on the first main surface of the multilayer body, and t2>t1 is satisfied.

Multilayer capacitor and method of manufacturing the same

A multilayer capacitor includes a capacitor body including first to sixth surface, and including a plurality of dielectric layers, and first and second internal electrodes; and first and second external electrodes. The first and second internal electrodes include first and second capacitance forming portion, first and second lead-out portion extending from the first and second capacitance forming portion toward the third surface of the capacitor body and connected to the first and second external electrode, and first and second dot pattern portion formed in at least one corner of the first and second capacitance forming portion. The first dot pattern portion and the second dot pattern portion have dot patterns not overlapping each other in the first direction.

Multilayer capacitor and method of manufacturing the same

A multilayer capacitor includes a capacitor body including first to sixth surface, and including a plurality of dielectric layers, and first and second internal electrodes; and first and second external electrodes. The first and second internal electrodes include first and second capacitance forming portion, first and second lead-out portion extending from the first and second capacitance forming portion toward the third surface of the capacitor body and connected to the first and second external electrode, and first and second dot pattern portion formed in at least one corner of the first and second capacitance forming portion. The first dot pattern portion and the second dot pattern portion have dot patterns not overlapping each other in the first direction.