An electronic component includes a multilayer body including dielectric layers and inner electrodes alternately laminated together, first to third outer electrodes arranged in this order in one direction on a first main surface of the multilayer body, and fourth to sixth outer electrodes provided on a second main surface opposite to the first main surface such that at least a portion of the fourth outer electrode, at least a portion of the fifth outer electrode, and at least a portion of the sixth outer electrode respectively face the first outer electrode, the second outer electrode, and the third outer electrode. The first, third, and fifth outer electrodes are electrically connected to one another. The second, fourth, and sixth outer electrodes are electrically connected to one another and each have a polarity different from that of the first outer electrode.

A chip electronic component includes spacers that each have a predetermined thickness direction dimension on a mounting surface in a direction perpendicular to the mounting surface. The spacers each contain, as a main component, an intermetallic compound containing at least one high-melting-point metal selected from Cu and Ni, and Sn defining a low-melting-point metal.

In an exemplary embodiment, a multilayer ceramic capacitor 10 is formed in such a way that a first face f1 of a capacitor body 11 has a concave shape and a first part 12a of a first external electrode 12 contacts the concave-shaped first face f1, and that a second face f2 of the capacitor body 11 has a concave shape and a first part 13a of a second external electrode 13 contacts the concave-shaped second face f2.

An electronic component includes a laminated body including first and second end surfaces, first and second side surfaces, and first and second principal surfaces, a first external electrode, and a second external electrode, in which the first external electrode includes a first fired electrode layer and a first resin layer, the second external electrode includes a second fired electrode layer and a second resin layer, each of the first fired electrode layer and the second fired electrode layer is provided on the laminated body and includes a region including voids and glass, each of the first resin layer and the second resin layer includes metal particles, and a surface layer of each of the first resin layer and the second resin layer has a portion of the metal particles exposed in a ratio of about 72.6% or more and about 90.9% or less.

An electronic component includes a laminated body including first and second end surfaces, first and second side surfaces, and first and second principal surfaces, a first external electrode, and a second external electrode, in which the first external electrode includes a first fired electrode layer and a first resin layer, the second external electrode includes a second fired electrode layer and a second resin layer, each of the first fired electrode layer and the second fired electrode layer is provided on the laminated body and includes a region including voids and glass, each of the first resin layer and the second resin layer includes metal particles, and a surface layer of each of the first resin layer and the second resin layer has a portion of the metal particles exposed in a ratio of about 72.6% or more and about 90.9% or less.

A capacitor comprising first and second end sprays respectively located at distal ends of a capacitor cell, a positive polarity bus bar extending from a first wound conductive layer of the capacitor cell adjacent to the first end spray, a negative polarity bus bar extending from a second wound conductive layer of the capacitor cell adjacent to the second end spray, and a capacitor film wrapped around an area between the first and second conductive layers.

A capacitor comprising first and second end sprays respectively located at distal ends of a capacitor cell, a positive polarity bus bar extending from a first wound conductive layer of the capacitor cell adjacent to the first end spray, a negative polarity bus bar extending from a second wound conductive layer of the capacitor cell adjacent to the second end spray, and a capacitor film wrapped around an area between the first and second conductive layers.

A multi-terminal capacitor is provided that can be used either as a feedthrough capacitor or as a LW reversal capacitor. A multi-terminal capacitor includes a capacitor body shaped like a rectangular parallelepiped. The capacitor body includes a capacitance forming portion configured to form capacitance between a first conductor film and a second conductor film facing each other with a dielectric film being interposed therebetween. On one of the surfaces of the capacitor body in the third direction, first and second external terminals electrically connected to the first conductor film, and a third external terminal electrically connected to the second conductor film are provided. On the other of the surfaces of the capacitor body in the third direction, fourth and fifth external terminals electrically connected to the first conductor film and a sixth external terminal electrically connected to the second conductor film are provided.

The invention relates to an electronic structural element (1) with a first and a second base plate (2a, 2b), as well as a coupling plate (3), wherein, between the first base plate (2a) and the coupling plate (3), a first electrical capacitor (C1) is formed, and, between the second base plate (2b) and the coupling plate (3), a second electrical capacitor (C2) is formed, so that the first and the second electrical capacitors (C1, C2) form an electrical series capacitor (Cs) between the first and the second base plates (2a, 2b). According to the invention, the coupling plate (3) is divided into a plurality (N) of mutually non-contacting strips (6), wherein the first and the second electrical capacitors (C1, C2) are in each case divided into a plurality (N) of electrical elementary capacitors (Ce), and, by means of the strips (6), a plurality (N) of parallel-connected, electrical elementary series capacitors (Cse) is formed between the first and the second base plates (2a, 2b). This way, a short circuit (K) on a specific strip (6) has only a slight effect on a change in the overall series capacitance (Cs) on the structural element (1).

An electronic component includes an element body and outer electrodes on the element body. The element body includes top and bottom opposed surfaces, and side surfaces connecting the top and bottom surfaces. An outer electrode includes a lower layer electrode on the top surface and the bottom surface, and an upper layer electrode overlying the lower layer electrode and extending from an upper side of the lower electrode onto the side surface. When viewed from a direction orthogonal to the top and bottom surfaces, an edge of the lower layer electrode is disposed at a position farther from the side surface at which the upper layer electrode is provided than a position of an edge of the upper layer electrode, and a radius of curvature of the edge of the lower electrode is larger than a radius of curvature of the edge of the upper layer electrode.