A fuse production method includes the steps of forming a liquid film of a dispersion liquid, in which metal nanoparticles are dispersed in a solvent, on a principal surface of a substrate containing at least an organic substance, heating the liquid film so as to vaporize the solvent to melt or sinter the metal nanoparticles and to soften or melt the principal surface, and forming a fuse film on the principal surface by fusing the melted or sintered metal nanoparticles and the softened or melted principal surface with each other.

A fuse includes an integrated measuring function. In an embodiment, the fuse includes a fuse housing including a first receiving space delimited by a pressure body and a second receiving space spatially separated from the first receiving space. A fusible conductor is mounted in the first receiving space and a measuring device is accommodated and mounted in the second receiving space. The measuring device has a current transformer and an electronic assembly, electrically conductively connected to the current transformer. Viewed in a direction of longitudinal extent, a height of the current transformer essentially corresponds to a height of the second receiving space. With the aid of the measuring device, it is possible to determine the electric current flowing through the fuse in the immediate vicinity of the fuse. Energy required is generated from the primary current of the fuse by electromagnetic induction, meaning no external power source is required.

Provided are approaches for integrating solenoids and fuses within a compact housing. In one approach, a fuse apparatus may include a housing including a main body, a cover coupled to a first side of the main body, and a base coupled to a second side of the main body, wherein the cover and the main body define a fuse cavity, and wherein the base and the main body define a main cavity. The fuse apparatus may further include a plurality of fuses disposed within the fuse cavity, and a plurality of solenoids electrically connected to a printed circuit board (PCB), wherein the plurality of fuses is disposed above the PCB, and wherein the PCB is positioned within the main cavity.

A relay assembly configured for use in a vehicle electrical distribution center. The relay assembly includes a circuit board, a first and second relay disposed the circuit board and a plurality of terminals electrically coupled to the first and second relays. The relay assembly also includes removable fuses to protect the circuits controlled by the first and second relays against over-current conditions. In one embodiment, the relay assembly is packaged as a mini-ISO relay package.

Approaches disclosed herein are related to vertically oriented fusible devices and vertically oriented fuse blocks. In one approach, a vertical fuse assembly may include a body comprising an upper section and a lower section, and a fuse extending between an upper terminal and a lower terminal, wherein the upper terminal is positioned within the upper section, wherein the lower terminal is positioned within the lower section, and wherein the lower terminal extends through the lower section. The vertical fuse assembly may further include a side terminal adjacent the fuse body, wherein the side terminal extends through the lower section.

A BEOL e-fuse is disclosed which reliably blows in the via and can be formed even in the tightest pitch BEOL layers. The BEOL e-fuse can be formed utilizing a line first dual damascene process to create a sub-lithographic via to be the programmable link of the e-fuse. The sub-lithographic via can be patterned using standard lithography and the cross section of the via can be tuned to match the target programming current.

There is provided an electronic device including a first member formed to include at least a part of a substrate material, a second member formed to include at least a part of the substrate material and configured to be relatively movable with respect to the first member, and a fuse configured to include at least a part of the substrate material and configured to electrically connect the first member to the second member via the substrate material.

Described is a fuse for an electrical circuit, comprising two contact arms, each having at least one connecting pin for inserting into a hole of a printed circuit board, and a spring which connects the two contact arms in an electrically conductive manner. According to this disclosure, it is provided that the spring is fastened to at least one of the two contact arms by means of a fastening means that loses its strength at a trigger temperature of the fuse, wherein the fuse is formed in such a manner that by inserting the connecting pins into holes of a printed circuit board, the spring is loaded such that the spring lifts from the at least one contact arm by spring force as soon as the fastening means loses its strength due to overheating. Moreover, a printed circuit board comprising such a fuse is described.

There is provided a photodiode array including a semiconducting substrate and a plurality of photodiodes that are disposed at a surface of the substrate. Each photodiode is laterally spaced apart from neighboring photodiodes by a lateral substrate surface region. An optical interface surface of the substrate is arranged for accepting external input radiation. A plurality of electrically conducting fuses are disposed on the substrate surface. Each fuse is connected to a photodiode in the plurality of photodiodes. Each fuse is disposed at a lateral substrate surface region that is spaced apart from neighboring photodiodes in the plurality of photodiodes.

An electronic device that includes an intermediate connection layer interposed between a wiring substrate with a pair of land electrodes and an electronic component. The intermediate connection layer has first and second connection electrodes formed on the surface of a base. A fuse part is formed inside the second connection electrode between a main conductor part thereof opposed to a first external electrode of the electronic component and a main conductor part of the first connection electrode opposed to a second external electrode of the electronic component.