The present application discloses a thin film transistor comprising a source electrode; a drain electrode; an active layer; a first connecting layer connecting the active layer to the source electrode; a second connecting layer connecting the active layer to the drain electrode; and an insulating layer between the first connecting layer and the second connecting layer.

Semiconductor devices and methods of manufacture thereof are disclosed. In some embodiments, a semiconductor device includes a substrate, and a plurality of contact pads disposed over the substrate. The contact pads may be arranged in a ball grid array (BGA), and the may include a plurality of corners. A metal dam is disposed around each of the plurality of corners, such as corners of the BGA.

This disclosure provides a thin film transistor and the preparation method thereof, an array substrate, and a display panel, so as to solve the problem that the active layer is prone to be corroded when a metal oxide thin film transistor is produced by a back channel etching process. The preparation method comprises: forming a gate electrode metal thin film on a base substrate, and allowing the gate electrode metal thin film to form a gate electrode metal layer comprising a gate electrode by a patterning process; forming a gate electrode insulating layer on the gate electrode metal layer; forming an active layer on the gate electrode insulating layer; preparing a metal nanoparticle layer on the active layer, said metal nanoparticle layer being used as an etching protection layer; forming a source and drain electrode metal thin film on the base substrate on which the above processes are finished, and allowing the source and drain electrode metal thin film to form a source and drain electrode metal layer comprising a source electrode and a drain electrode by a patterning process, wherein the source electrode and the drain electrode cover a part of the metal nanoparticle layer; removing or oxidizing the part of the metal nanoparticle layer which is not covered by the source electrode and the drain electrode in an oxygen-containing atmosphere; and forming a passivation layer on the source and drain electrode metal layer.

In a semiconductor device including a transistor, the transistor is provided over a first insulating film, and the transistor includes an oxide semiconductor film over the first insulating film, a gate insulating film over the oxide semiconductor film, a gate electrode over the gate insulating film, a second insulating film over the oxide semiconductor film and the gate electrode, and a source and a drain electrodes electrically connected to the oxide semiconductor film. The first insulating film includes oxygen. The second insulating film includes hydrogen. The oxide semiconductor film includes a first region in contact with the gate insulating film and a second region in contact with the second insulating film. The first insulating film includes a third region overlapping with the first region and a fourth region overlapping with the second region. The impurity element concentration of the fourth region is higher than that of the third region.

The present invention provides a metallic oxide thin film transistor and its manufacturing method, an array substrate and its manufacturing method, as well as a display device, which is belong to the field of thin film transistor manufacturing technology. The method for manufacturing the metallic oxide thin film transistor comprises a step of forming patterns of an oxide active layer and an etch stopping layer through a one-time patterning process.

The present invention provides a metallic oxide thin film transistor and its manufacturing method, an array substrate and its manufacturing method, as well as a display device, which is belong to the field of thin film transistor manufacturing technology. The method for manufacturing the metallic oxide thin film transistor comprises a step of forming patterns of an oxide active layer and an etch stopping layer through a one-time patterning process.

A mask and a method of making the mask are disclosed. The mask includes a transition region including at least one first region having a first thickness, and an active region having another thickness, where the thickness of the active region is greater than the first thickness. The method of making the mask includes forming a plurality of patterns in a mask body, the patterns being formed in regions of the mask body corresponding with the active region and the transition region of the mask.

This disclosure discloses an oxide semiconductor thin film, a thin film transistor, a manufacturing method and a device, belonging to the field of flat panel display. The oxide semiconductor thin film is made of an oxide containing zirconium and indium. A method of manufacturing the oxide semiconductor thin film comprises preparing a target using the oxide containing zirconium and indium, and sputtering the target to obtain the oxide semiconductor thin film.

Semiconductor devices and methods of manufacture thereof are disclosed. In some embodiments, a semiconductor device includes a substrate, and a plurality of contact pads disposed over the substrate. The contact pads may be arranged in a ball grid array (BGA), and the may include a plurality of corners. A metal dam is disposed around each of the plurality of corners, such as corners of the BGA.

The present disclosure provides an array substrate and a manufacturing method for the array substrate. The manufacturing method includes: forming a light-shielding layer, a source, and a drain on the substrate by using a first photomask; forming a semiconductor layer, a gate insulating layer, and a gate which are laminated on the source, the drain, and light-shielding layer by using a second photomask; forming a dielectric layer on the gate and the substrate, and a via hole exposing the drain on the dielectric layer by using a third photomask; and forming a pixel electrode on the dielectric layer by using a fourth photomask.