A substrate treating apparatus and a substrate treating method. The substrate treating apparatus includes a treating unit and a controller. The treating unit includes a substrate holder, a rotation driving unit, a treatment liquid supplying unit, a liquid collecting unit, and a guard driving unit. The substrate holder holds a substrate in a horizontal posture. The rotation driving unit rotates the substrate holder. The liquid collecting unit includes a first guard, a second guard, and a liquid inlet. The first guard and the second guard are arranged so as to surround the substrate holder laterally. The liquid inlet is defined by the guards. The liquid inlet is open toward the substrate held by the substrate holder. The guard driving unit moves the second guard in a vertical direction. The controller controls the guard driving unit in accordance with the shape of the substrate held by the substrate holder, thereby changing a height position of an upper end of the liquid inlet.

Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.

A processing apparatus group management system manages operational statuses of a processing apparatus group that is a group of substrate processing apparatuses. This system includes an information storage, a display, and a display controller. The information storage stores apparatus-specific information specific to each substrate processing apparatus, and apparatus operational information relating to the operational statuses of substrate processing apparatuses and continuously transmitted from the substrate processing apparatuses. The display controller causes the display to display the operational status of each substrate processing apparatus as an operational status table in accordance with the apparatus-specific information and the apparatus operational information about the substrate processing apparatus. The operational status table includes display items including an apparatus identifier used to identify each substrate processing apparatus, and the number of times an abnormal processing stop occurs in each substrate processing apparatus. This allows collective management of the operations statuses of the substrate processing apparatuses.

Disclosed herein is a remote monitoring apparatus for an air valve for semiconductor equipment. The remote monitoring apparatus includes: a communication network formed by selecting one or more from the Internet, a Bluetooth network, a Wi-Fi network, and an Internet of Things (IoT) network and then combining them, and configured to connect a device, a server, and a terminal; an inspection device installed on one side of an air valve for semiconductor equipment; a management server connected to the communication network, and configured to collectively manage failure diagnosis and monitoring information; and an operator terminal configured to output the failure diagnosis and monitoring information.

Two machine learning modules or models are used to generate a recipe. A first machine learning module determines a set of recipes based on measured signals. The second machine learning module analyzes the set of recipes based on a cost function to determine a final recipe. The second machine learning module also can determine settings if the set of recipes fail evaluation using the cost function.

A dividing apparatus includes a table having a transparent plate having a holding surface for holding a workpiece thereon and a lower illumination unit for illuminating the holding surface from below, a first storage section for storing a first image including a white portion where illumination light from the lower illumination unit is transmitted through the workpiece and displayed as white and a black portion where the illumination light is blocked by the workpiece and displayed as black when an image of a kerf defined by a dividing unit in the workpiece held on the holding surface is captured by an image capturing unit with the lower illumination unit being energized, and a white pixel detecting section for detecting whether or not there are pixels in the white portion of the first image in directions perpendicular to directions along which a street extends.

Semiconductor device packages and associated methods are disclosed herein. In some embodiments, the semiconductor device package includes (1) a first surface and a second surface opposite the first surface; (2) a semiconductor die positioned between the first and second surfaces; and (3) an indication positioned in a designated area of the first surface. The indication includes a code presenting information for operating the semiconductor die. The code is configured to be read by an indication scanner coupled to a controller.

An integrated metrology system for evaluating semiconductor wafers, the metrology system comprises a main body that has a rear side and a front side; the front side defines a front border of the main body; one or more detachable supporting units that are detachably coupled to the main body and support the main body while extending outside the front border; and at least one auxiliary supporting unit that is configured to support the main body at an absence of the one or more detachable supporting units

A support device includes a support that supports an object to be tested and that includes a flow path inside, the flow path having an inlet and an outlet, and the flow path being configured to flow a first temperature adjusting medium from the inlet to the outlet, a mixer configured to discharge a third temperature adjusting medium, the first temperature adjusting medium flowing out from the outlet and a second temperature adjusting medium externally supplied being mixed at a ratio that is predetermined in the third temperature adjusting medium, a medium transfer configured to transfer the third temperature adjusting medium to the inlet as the first temperature adjusting medium, and a heater configured to heat the first temperature adjusting medium or the third temperature adjusting medium.

Exemplary processing chambers may include a body having sidewalls and a bottom plate. The bottom plate may define an exhaust opening and a gas inlet. The chambers may include a faceplate seated atop the body. The chambers may include a purge ring seated atop the bottom plate. The purge ring may include a ring body having an outer edge and an inner edge defining an open interior. The ring body may have a surface disposed against the bottom plate. The ring body may define an opening aligned with the exhaust opening. The surface may define a fluid port aligned and coupled with the gas inlet. The surface may define arcuate grooves extending into the fluid port. The arcuate grooves may be parallel with the inner and outer edges. The surface may define radial grooves extending from the open interior to an arcuate groove.