Exemplary substrate support assemblies may include a platen characterized by a first surface configured to support a semiconductor substrate. The assemblies may include a first stem section coupled with a second surface of the platen opposite the first surface of the platen. The assemblies may include a second stem section coupled with the first stem section. The second stem section may include a housing and a rod holder disposed within the housing. The second stem section may include a connector seated within the rod holder at a first end of the connector. The second stem section may include a heater rod disposed within the first end of the connector and a heater extension rod coupled with the connector at a second end of the connector. The second stem section may include an RF rod and an RF strap coupling the RF rod with an RF extension rod.

The present disclosure provides a device (300) for degumming and inserting silicon wafers and method for processing silicon wafers. The device (300) for degumming and inserting silicon wafers includes a material frame (1), a grabbing mechanism (2), a degumming mechanism (3), an unlocking mechanism (8) and an inserting mechanism (4). The material frame (1) is configured for placing and clamping a plurality of silicon wafers (100) bonded with a support (200), the grabbing mechanism (2) is configured for grabbing and transferring the material frame (1) or the support (200), the degumming mechanism (3) is configured for degumming the plurality of silicon wafers (100) from the support (200), the unlocking mechanism (8) is configured for releasing clamping and fixing of the material frame (1) on the plurality of silicon wafers (100), and the inserting mechanism (4) is configured for splitting the degummed plurality of silicon wafers (100).

Exemplary semiconductor substrate carrier frames may include a frame body defining a central aperture. The frames may include a plurality of fingers that are coupled with the frame body. Each of the plurality of fingers may extend into the central aperture. Each of the plurality of fingers may include a substrate receiving interface. At least one of the plurality of fingers may include an actuator that manipulates a respective one of the at least one of the plurality of fingers between a substrate holding position and an open position.

The present disclosure provides a device (300) for degumming and inserting silicon wafers and method for processing silicon wafers. The device (300) for degumming and inserting silicon wafers includes a material frame (1), a grabbing mechanism (2), a degumming mechanism (3), an unlocking mechanism (8) and an inserting mechanism (4). The material frame (1) is configured for placing and clamping a plurality of silicon wafers (100) bonded with a support (200), the grabbing mechanism (2) is configured for grabbing and transferring the material frame (1) or the support (200), the degumming mechanism (3) is configured for degumming the plurality of silicon wafers (100) from the support (200), the unlocking mechanism (8) is configured for releasing clamping and fixing of the material frame (1) on the plurality of silicon wafers (100), and the inserting mechanism (4) is configured for splitting the degummed plurality of silicon wafers (100).

The present disclosure provides a device for conveying and dispersing a silicon wafer (100). The device for conveying and dispersing a silicon wafer (100) includes: a conveying component (20) configured for conveying a plurality of silicon wafers (200); a clamping component (10) disposed at two sides of the conveying component (20), the clamping component (10) being capable of clamping and conveying the plurality of silicon wafers (200); and a spraying component (30) disposed on the clamping component (10), wherein after the plurality of silicon wafers (200) are conveyed to an end close to the spraying component (30) of the conveying component (20) via the conveying component (20) and the clamping component (10), the spraying component (30) is capable of spraying water on the plurality of silicon wafers (200) to separate adjacent two of the plurality of silicon wafers (200).

A cassette for receiving at least one substrate for a display device includes a base; and a first wall extending in a direction generally perpendicular to an upper surface of the base and a plurality of first projections extending from the first wall in a first direction and arranged in a second direction generally perpendicular to the first direction at substantially regular intervals. A first opening is defined between adjacent first projections to receive one end of a first substrate, the first opening includes a first portion having a first width in the second direction and a second portion having a second width greater than the first width, and the first portion is disposed closer to the first wall than the second portion.

A film-forming device that includes a cylindrical chamber capable of maintaining vacuum therein, a workpiece holder that is constructed to align and hold workpieces to be processed in multiple stages such that main surfaces of the workpieces are oriented in a vertical direction relative to a central axis of the chamber, a deposition material supply pipe, a modifier supply pipe, a carrier gas supply pipe, and an exhaust mechanism, wherein in a cross section of the chamber in a direction parallel to the main surfaces of the workpieces, the exhaust mechanism is located on a side opposite to an opening direction of gas outlets of the deposition, modifier, and carrier gas supply pipes, and a total gas flow from the deposition, modifier, and carrier gas supply pipes is symmetric about a centerline of the chamber.

Described herein is a technique capable of suppressing generation of particles and improving a throughput. According to one aspect of the technique, there is provided a substrate processing apparatus including: a loading chamber accommodating a boat; an elevator configured to elevate and lower the boat; a boat exchanging device configured move the boat on the elevator to a first stand-by region and a second stand-by region; a first clean air supplier facing an unloading region in the loading chamber where the boat placed on the elevator is accommodated; a second clean air supplier facing the first stand-by region; and a third clean air supplier facing the second stand-by region, wherein a flow volume ejected from the clean air suppliers are individually controlled so as to form a predetermined air flow in a range of height in which the boat exchanging device in the loading chamber is provided.

A wafer boat configured to be placed on a pedestal of a vertical batch furnace, the pedestal having a substantially flat support surface. The wafer boat comprises a support ring defining a substantially flat bottom end surface of the wafer boat, and an alignment ring substantially concentric with the support ring. Either the support surface of the pedestal, or a bottom side of the alignment ring is provided with a plurality of alignment elements respectively protruding upwards from the support surface or downwards from the alignment ring, while the other one is provided with a plurality of alignment openings configured to accommodate therein the plurality of alignment elements. The support ring downwardly protrudes beyond the alignment ring so that, when the wafer boat is placed on the pedestal, the support ring is supported on the support surface while the alignment ring is spaced from the support surface of the pedestal.

Substrates can be suppressed from being separated from supporting grooves. A substrate processing apparatus includes a substrate holding unit and a processing tub. The substrate holding unit is configured to hold multiple substrates. The processing tub is configured to store a processing liquid therein. The substrate holding unit comprises a supporting body, an elevating device and a restriction unit. The supporting body has multiple supporting grooves and is configured to support the multiple substrates with a vertically standing posture from below in the multiple supporting grooves, respectively. The elevating device is configured to move the supporting body between a standby position above the processing tub and a processing position within the processing tub. The restriction unit is configured to be moved up and down along with the supporting body by the elevating device and configured to restrict an upward movement of the substrates with respect to the supporting body.