Patent classifications
H01L21/67739
METHOD OF PROCESSING SUBSTRATE, SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR PROCESSING APPARATUS, AND RECORDING MEDIUM
There is provided a technique that includes abnormality detecting by picking up a sound generated from a transfer configured to be capable of transporting the substrate and comparing a waveform of sound data with a preset threshold value to detect an abnormality of the transfer; and failure detecting by picking up vibration of the transfer and comparing a waveform of vibration data with a preset threshold value to detect a failure of the transfer.
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
A substrate processing method includes: a carry-in step of carrying a substrate having a silicon-containing film on a surface of the substrate into a processing container; a first step of forming an adsorption layer by supplying an oxygen-containing gas into the processing container and causing the oxygen-containing gas to be adsorbed on a surface of the silicon-containing film; a second step of forming a silicon oxide layer by supplying an argon-containing gas into the processing container and causing the adsorption layer and the surface of the silicon-containing film to react with each other with plasma of the argon-containing gas; and a third step of forming a graphene film on the silicon oxide layer by supplying a carbon-containing gas into the processing container with plasma of the carbon-containing gas.
VALVE STRUCTURE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
A process chamber door for closing or opening an entrance of a process chamber through which a substrate to be process is loaded includes a seal plate including a front surface and a rear surface opposite to each other in a first direction, a connection block connected to the rear surface of the seal plate and including a central portion and two side portions connected to the rear surface of the seal plate, and a shaft connected to the central portion of the connection block. The connection block includes a first hinge groove and a second hinge groove. The first hinge groove is exposed at a bottom surface and a side surface of the connection block and the second hinge groove is exposed at an upper surface and the side surface of the connection block.
Substrate processing apparatus
In a chemical liquid container replacement device D2 configured to replace a chemical liquid container 50, multiple chemical liquid containers 50 respectively connected to base end sides of chemical liquid supply paths configured to supply chemical liquids, and a nozzle attachment/detachment device 61 is configured to attach/detach the base end side of the chemical liquid supply path with respect to the chemical liquid container 50 of a container arrangement section 60. A loading/unloading port 62 loads a new chemical liquid container 50 for performing a liquid process on a substrate W and unloads a completely used chemical liquid container 50. A container transfer device 7 unloads the completely used chemical liquid container 50 from the container arrangement section 60 toward the loading/unloading port 62 and loads the new chemical liquid containers 50 from the loading/unloading port 62 toward the container arrangement section 60.
BONDING SYSTEM
A first transfer device and a second transfer device are configured to transfer a first substrate and a second substrate in a normal pressure atmosphere. A third transfer device is configured to transfer the first substrate and the second substrate in a decompressed atmosphere. A load lock chamber has accommodation sections allowed to accommodate therein the first substrate and the second substrate, and is allowed to switch an inside of the accommodation sections between the normal pressure atmosphere and the decompressed atmosphere. Multiple gates are respectively disposed on three different sides of the load lock chamber, and allowed to open or close the load lock chamber. The first transfer device, the second transfer device, and the third transfer device carry the first substrate and the second substrate into/out of the load lock chamber through different gates among the multiple gates.
Fluid control system
An improved fluid delivery system and method that directly controls the concentration of constituent components in a fluid mixture delivered, for example, to a process chamber. Pressure of the fluid mixture can also be directly controlled. A concentration sensor capable of measuring concentration of all of the constituent components in a fluid mixture is used to provide signals used to vary the flow rate of constituent gases under a closed loop feedback system. The signal output of one or more pressure sensors can also be used to provide a signal used to vary the flow rate of constituent gases under a closed loop feedback system. By directly controlling these two extremely important process variables, embodiments of the present invention provide a significant advantage in measurement accuracy over the prior art, enable real-time process control, reduce system level response time, and allow for a system with a significant footprint reduction.
SUBSTRATE TRANSFER MECHANISM TO REDUCE BACK-SIDE SUBSTRATE CONTACT
A substrate processing system is disclosed which includes a processing chamber comprising a susceptor having a first surface and a second surface opposite to the first surface, a groove formed in the first surface adjacent to a perimeter thereof, and a substrate support structure including a plurality of carrier lift pins, each of the plurality of carrier lift pins movably disposed in an opening formed from the second surface to the first surface, wherein the opening is recessed from the groove.
Dual arm robot
A robot assembly for transporting a substrate is presented. The robot assembly having a first arm and a second arm supported by a column, the first arm further having a first limb, the first limb having a first set of revolute joint/line pairs configured to provide translation and rotation of the distal most link of the first limb in the horizontal plane. The assembly further having a second arm further having a second limb, the second limb comprising a second set of revolute joint/link pairs configured to provide translation and rotation of a distalmost link of the second limb in the horizontal plane. The first limb and second limb further having proximal revolute joints having a common vertical axis of rotation and a proximal inner joint housed in a common housing. The assembly further having an actuator assembly coupled to the first set of revolute joint/link pairs and to the second set of revolute joint/link pairs to effect rotation and translation of the distalmost links of the first limb and the second limb, each of the first limb and the second limb defining, in conjunction with the actuator assembly, at least three degrees of freedom per limb, whereby the distalmost links of the first limb and the second limb are independently horizontally translatable for extension and retraction.
APPARATUS FOR PROCESSING SUBSTRATE, DEVICE OF CONTROLLING APPARATUS FOR PROCESSING SUBSTRATE, METHOD OF CONTROLLING APPARATUS FOR PROCESSING SUBSTRATE, AND STORAGE MEDIUM THAT STORES PROGRAM
One object of the present disclosure is to flexibly and promptly save a processing solution in an apparatus for processing a substrate. An apparatus for processing a substrate is configured to change over a transfer time table between an ordinary mode that has a maximum throughput of the apparatus for processing the substrate and a processing solution saving mode that saves a processing solution in at least one of processing tanks. The apparatus for processing the substrate determines whether or not the apparatus for processing the substrate is in a slack period that has a small demand output by the apparatus for processing the substrate, based on a rate-controlling point that limits a processing speed of the entire apparatus for processing the substrate, and sets the transfer time table to the processing solution saving mode when it is determined that the apparatus for processing the substrate is in the slack period, while setting the transfer time table to the ordinary mode when it is determined that the apparatus for processing the substrate is not in the slack period.
SUBSTRATE PROCESSING APPARATUS
A substrate processing apparatus includes: a substrate retainer configured to support a substrate; a heat-insulating unit; a transfer chamber; and a gas supply mechanism configured to supply a gas into the transfer chamber, the gas supply mechanism including: a first gas supply mechanism configured to supply the gas into an upper region of the transfer chamber, where the substrate retainer is disposed such that the gas flows horizontally through the upper region; and a second gas supply mechanism configured to supply the gas into a lower region of the transfer chamber, where the heat-insulating unit is provided such that the gas flows downward through the lower region, wherein the first gas supply mechanism and the second gas supply mechanism are disposed along a first sidewall of the transfer chamber, and the second gas supply mechanism is disposed lower than the first gas supply mechanism.