A substrate processing apparatus includes a substrate cleaning unit cleaning a substrate, a substrate drying unit drying the substrate, and a transfer robot transferring the substrate between the substrate cleaning unit and the substrate drying unit. The substrate drying unit includes a substrate processing container having a substrate processing space accommodating the substrate, and the transfer robot includes a surface temperature measurement sensor measuring a surface temperature of the substrate processing container.

An apparatus for processing a substrate may include a wet chamber, a dry chamber, a first transfer robot and a shared shutter. The wet chamber may be configured to process the substrate using a chemical. The dry chamber may be adjacent the wet chamber and configured to dry the substrate processed by the wet chamber. The first transfer robot may be configured to transfer the substrate between the wet chamber and the dry chamber. The shared shutter may be between the wet chamber and the dry chamber. A connection opening through which the substrate may be transferred may be formed between the wet chamber and the dry chamber. The shared shutter may be configured to open and close the connection opening.

A material processing path selection method includes calculating a plurality of candidate material processing paths, determining a bottleneck process tank, and for each of the plurality of candidate material processing paths, calculating a bottleneck process tank utilization rate to select a candidate material processing path with a highest bottleneck process tank utilization rate in the plurality of candidate material processing paths as a target material processing path. The bottleneck process tank is a process tank having a highest use frequency among all process tanks, A use frequency of the process tank is equal to a total process time length of all materials that need to be transferred to the process tank divided by a number of all the materials that need to be transferred to the process tank.

The present disclosure related to a stacker of an electric device test hander comprising an upper stacker and a lower stacker. Stacker modules provided in the upper stacker can be opened and closed by being moved horizontally from the frame, and each of stacker modules can give and receive a plurality of user trays to and from the lower stacker in closed position.

According to present disclosure when goods are being transferred to and from the outside, the user trays can move freely between the loading parts disposed on the upper and lower sides. Thus, the dependence on the visitation cycle of an external robot and the replacement amounts of the user trays can be lowered to improve ease of operation.

A substrate processing apparatus includes a substrate holding portion which holds a substrate W. The substrate holding portion includes two movable holding pins and two fixed holding pins which sandwich the substrate. The substrate processing apparatus includes two support pins which support the substrate W held by the substrate holding portion from below. Each of the support pins has an inner portion which overlaps the substrate held by the substrate holding portion in a vertical direction. An upper end of the support pin is on a side below an overlapping portion of the substrate which overlaps the inner portion in the vertical direction.

According to one embodiment, a substrate processing method is disclosed. The method can include treating a substrate with a first liquid. The substrate has a structural body formed on a major surface of the substrate. The method can include forming a support member supporting the structural body by bringing a second liquid into contact with the substrate wetted by the first liquid, and changing at least a portion of the second liquid into a solid by carrying out at least one of causing the second liquid to react, reducing a quantity of a solvent included in the second liquid, and causing at least a portion of a substance dissolved in the second liquid to be separated. The method can include removing the support member by changing at least a part of the support member from a solid phase to a gaseous phase, without passing through a liquid phase.

A method of forming a material layer on a substrate comprises loading a substrate into a printing zone of a coating system using a substrate handler, printing an organic ink material on a substrate while the substrate is located in the printing zone, transferring the substrate from the printing zone to a treatment zone of the coating system, treating the organic ink material deposited on the substrate in the treatment zone to form a film layer on the substrate, and removing the substrate from the treatment zone using the substrate handler.

A substrate processing system for performing processing on a plurality of substrates. The substrate processing system comprises: a processing unit comprising a plurality of processing modules each configured to perform a predetermined process; a transfer unit having a transfer device configured to transfer a substrate to each of the plurality of processing modules; a loading/unloading unit configured to hold a plurality of substrates and load/unload a substrate to/from the processing unit; and a controller configured to control the processing unit, the loading/unloading unit, and the transfer unit. The controller controls the transfer unit to transfer to the plurality of processing modules in a serial manner a plurality of substrates that are sequentially loaded from the loading/unloading unit to the processing unit, the controller further comprises a standby mode setting unit configured to set a standby period of the substrate at an appropriate timing depending on a content of the process.

In an embodiment, a semiconductor processing tool for implementing hybrid laser and plasma dicing of a substrate is provided. The semiconductor processing tool comprises a transfer module, where the transfer module comprises a track robot for handling the substrate, and a loadlock attached to the transfer module. In an embodiment, the loadlock comprises a linear transfer system for handling the substrate. In an embodiment, the processing tool further comprises a processing chamber attached to the loadlock, wherein the linear transfer system of the loadlock is configured to insert and remove the substrate from the processing chamber.

A semiconductor wafer processing system for processing a set of semiconductor wafers includes a controller, a transfer robot controlled by the controller, a wet bath for containing a cleaning solution, and a cassette positioned in the wet bath for holding the set of wafers. The transfer robot transfers the wafer from a transfer location to the cassette and the controller controls the transfer robot during the transfer.