A loop-type heat pipe includes a loop-type heat pipe main body including a loop-shaped flow path in which a working fluid is enclosed, a first magnet provided to the loop-type heat pipe main body, a heat dissipation plate thermally connected to the loop-type heat pipe main body, and a second magnet provided to the heat dissipation plate and provided to face the first magnet. The first magnet and the second magnet are provided so that different magnetic poles face to each other.

In one general aspect, an apparatus can include a first module including a first semiconductor die, and a first heatsink coupled to the first module where the first heatsink includes a substrate and a first plurality of protrusions. The apparatus can also include a second module including a second semiconductor die, and a second heatsink coupled to the second module and including a second plurality of protrusions. The apparatus can also include a cover defining a channel where the first plurality of protrusions of the first heatsink and the second plurality of protrusions of the second heatsink are disposed within the channel.

A method for forming an electronic chip assembly. A first metal plate is coupled to a first side of a substrate to form a backing plate. A first cavity is created extending through the substrate to extend at least to the first metal plate. An electronic component is bonded to the substrate such that the electronic component is located within the first cavity. A second metal plate, having a second cavity, is disposed to a second side of the substrate, and over the first cavity such that the electronic component is encased within the first and second cavities by the first and second metal plates.

A thermal interface material (TIM) structure for directing heat in a three-dimensional space including a TIM sheet. The TIM sheet includes a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion and the first side portion positioning the first side portion substantially perpendicular to the lower portion; and a second fold between the first side portion and the first upper portion positioning the first upper portion substantially perpendicular to the first side portion and substantially parallel to the lower portion.

A method of forming a semiconductor structure includes: attaching a semiconductor device to a first surface of a substrate; placing a thermal interface material (TIM) film over a first side of the semiconductor device distal from the substrate, where the TIM film is pre-formed before the placing, where after the placing, a peripheral portion of the TIM film extends laterally beyond sidewalls of the semiconductor device; and attaching a lid to the first surface of the substrate to form an enclosed space between the lid and the substrate, where after attaching the lid, the semiconductor device and the TIM film are disposed in the enclosed space, where a first side of the TIM film distal from the substrate contacts the lid.

A liquid-cooling heat dissipation device and a liquid-cooling heat dissipation system for improving heat transfer efficiency are disclosed. The liquid-cooling heat dissipation device includes a vapor chamber, a liquid-separating cover, and a housing. The housing has a cold liquid inlet and a hot liquid outlet. An accommodating cavity is formed between the vapor chamber and the housing. By providing the vapor chamber, the heat transfer efficiency of the liquid-cooling heat dissipation device is improved greatly to realize rapid heat dissipation.

Example integrated separator devices for hardware component separation are disclosed herein. An example apparatus include a processor carrier having an inner edge and an outer edge; and a component separator rotatably coupled to the processor carrier, the component separator including a shaft, an entirety of the component separator closer to a center of the processor carrier than the outer edge is to the center of the processor carrier.

A semiconductor device includes a package and a cooling cover. The package includes a first die having an active surface and a rear surface opposite to the active surface. The rear surface has a cooling region and a peripheral region enclosing the cooling region. The first die includes micro-trenches located in the cooling region of the rear surface. The cooling cover is stacked on the first die. The cooling cover includes a fluid inlet port and a fluid outlet port located over the cooling region and communicated with the micro-trenches.

An optical communication system includes a co-packaged optical module and a heatsink mounted to the co-packaged optical module. The co-packaged optical module includes a processor disposed on a substrate and a plurality of light engines disposed at different locations around the processor on the substrate. The processor and the light engines generating different amounts of heat during operation. The heatsink includes a plurality of heat pipes non-uniformly distributed throughout the heatsink to remove the different amounts of heat generated at a location of the processor and respective locations of the different ones of the light engines.

A power module and a power device are provided. The power device includes two screws, a heat dissipation components and a power module. The power module includes a substrate, a package body and two fixing structures. Each fixing structure includes a first through hole, two second through holes, an annular structure and two sinking structures. When the power module is fixed to the heat dissipation component, each sinking structure is bent toward the heat dissipation component, and each annular structure is fixed to the flat surface of the heat dissipation component by the screws. The heat dissipation surface of the substrate can be flatly attached to the flat surface of the heat dissipation component through the two fixed structures, so that the heat energy generated during the operation of the power module can be transferred out through the heat dissipation component.